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1. 发明申请

WO2012006558A4 CHARGED PARTICLE BEAM PROCESSING SYSTEM WITH VISUAL AND INFRARED IMAGING 审中-公开
标题翻译：具有可视和红外成像的充电颗粒光束处理系统
公开(公告)号：WO2012006558A4
公开(公告)日：2012-06-14
申请号：PCT/US2011043410
申请日：2011-07-08
申请人： FEI CO , RUE CHAD , CROWLEY DANIEL
发明人： RUE CHAD , CROWLEY DANIEL , AGORIO ENRIQUE
IPC分类号： H01J37/22 , H01J37/08 , H01J37/20 , H01J37/244
CPC分类号： G01J3/0262 , G01J3/0208 , G01J3/0278 , G01N21/9501 , G01N21/95684 , G01N2021/8825 , G01N2021/95653 , H01J37/226 , H01J37/3005 , H01J37/3056 , H01J2237/31749
摘要： A charged particle beam system for processing substrates is disclosed, comprising a charged particle column, combination infrared radiation and visible light illumination and imaging subsystems, in-vacuum optics, and a precision stage for supporting and positioning the substrate alternately under the charged particle column and the imaging system. The axes of the charged particle column and imaging system are offset to enable much closer working distances for both imaging and beam processing than would be possible in a single integrated assembly. A method for extremely accurately calibrating the offset between the column and imaging system is disclosed, enabling beam processing at precisely-determined locations on the substrate. The imaging system is capable of locating sub-surface features on the substrate which cannot be seen using the charged particle beam. Two illumination modes are disclosed, enabling both bright-field and dark-field imaging in infrared radiation and visible light.
摘要翻译：公开了一种用于处理衬底的带电粒子束系统，包括带电粒子柱，组合红外辐射和可见光照明和成像子系统，真空内光学器件，以及精确级，用于在充电粒子柱下交替地支撑和定位衬底，成像系统。带电粒子柱和成像系统的轴线偏移，以使成像和光束处理的工作距离远远大于单个集成组件中可能的距离。公开了一种用于非常精确校准柱和成像系统之间的偏移的方法，使得能够在基板上的精确确定的位置处进行光束处理。成像系统能够将基底上的子表面特征定位为使用带电粒子束不能看到的。公开了两种照明模式，使得能够在红外辐射和可见光下进行亮场和暗场成像。

2. 发明申请

WO2011162566A3 DEVICE AND METHOD FOR MEASURING VIA HOLE OF SILICON WAFER 审中-公开
标题翻译：用于通过硅波的孔测量的装置和方法
公开(公告)号：WO2011162566A3
公开(公告)日：2012-05-03
申请号：PCT/KR2011004616
申请日：2011-06-24
申请人： KOREA RES INST OF STANDARDS , JIN JONG HAN , KIM JAE WAN , KIM JONG AHN , KANG CHU-SHIK
发明人： JIN JONG HAN , KIM JAE WAN , KIM JONG AHN , KANG CHU-SHIK
IPC分类号： G01B11/22 , G01B9/02 , G01B11/08 , G01N21/45
CPC分类号： G01B11/22 , G01B9/02008 , G01B11/12 , G01B2210/56 , G01N21/9501 , G01N2021/95653
摘要： The present invention pertains to a device and a method for measuring a via hole of a silicon wafer, wherein it is possible to precisely measure the depth of the via hole without damaging the wafer. Broadband infrared light is radiated to a silicon wafer which has a superior light transmission property, so that the depth of the via hole may be measured from the light which is reflected from each boundary surface of the wafer and the interference signal of reference light. The via hole measuring device according to the present invention includes: a light source unit for generating broadband infrared light; and an interferometer for radiating the light generated from the light source unit to a silicon wafer, so as to measure the depth of a via hole formed on the wafer according to the spectrum period of the interference signal of the light, which is reflected from the silicon wafer.
摘要翻译：本发明涉及用于测量硅晶片的通孔的装置和方法，其中可以精确地测量通孔的深度而不损坏晶片。宽带红外光被照射到具有优异的透光性的硅晶片，从而可以从从晶片的每个边界面反射的光和参考光的干涉信号测量通孔的深度。根据本发明的通孔测量装置包括：用于产生宽带红外光的光源单元; 以及干涉仪，用于将从光源单元产生的光发射到硅晶片，以便根据光的干涉信号的光谱周期来测量形成在晶片上的通孔的深度，该距离从硅晶片。

3. 发明申请

WO2012006558A3 CHARGED PARTICLE BEAM PROCESSING SYSTEM WITH VISUAL AND INFRARED IMAGING 审中-公开
标题翻译：带视觉和红外成像的带电粒子束处理系统
公开(公告)号：WO2012006558A3
公开(公告)日：2012-04-12
申请号：PCT/US2011043410
申请日：2011-07-08
申请人： FEI CO , RUE CHAD , CROWLEY DANIEL
发明人： RUE CHAD , CROWLEY DANIEL , AGORIO ENRIQUE
IPC分类号： H01J37/22 , H01J37/08 , H01J37/20 , H01J37/244
CPC分类号： G01J3/0262 , G01J3/0208 , G01J3/0278 , G01N21/9501 , G01N21/95684 , G01N2021/8825 , G01N2021/95653 , H01J37/226 , H01J37/3005 , H01J37/3056 , H01J2237/31749
摘要： A charged particle beam system for processing substrates is disclosed, comprising a charged particle column, combination infrared radiation and visible light illumination and imaging subsystems, in-vacuum optics, and a precision stage for supporting and positioning the substrate alternately under the charged particle column and the imaging system. The axes of the charged particle column and imaging system are offset to enable much closer working distances for both imaging and beam processing than would be possible in a single integrated assembly. A method for extremely accurately calibrating the offset between the column and imaging system is disclosed, enabling beam processing at precisely-determined locations on the substrate. The imaging system is capable of locating sub-surface features on the substrate which cannot be seen using the charged particle beam. Two illumination modes are disclosed, enabling both bright-field and dark-field imaging in infrared radiation and visible light.
摘要翻译：公开了一种用于处理基板的带电粒子束系统，其包括带电粒子柱，组合式红外辐射和可见光照明和成像子系统，真空中的光学器件以及用于交替地在带电粒子柱下方支撑和定位衬底的精密台，以及成像系统。带电粒子柱和成像系统的轴偏移，使得成像和光束处理的工作距离比单个集成组件中的可能距离更近。公开了一种用于非常准确地校准柱和成像系统之间的偏移的方法，使得能够在衬底上精确确定的位置处进行光束处理。成像系统能够在衬底上定位使用带电粒子束无法看到的子表面特征。公开了两种照明模式，使红外辐射和可见光中的明场和暗场成像成为可能。

4. 发明申请

WO2012006558A2 CHARGED PARTICLE BEAM PROCESSING SYSTEM WITH VISUAL AND INFRARED IMAGING 审中-公开
标题翻译：带视觉和红外成像的带电粒子束处理系统
公开(公告)号：WO2012006558A2
公开(公告)日：2012-01-12
申请号：PCT/US2011/043410
申请日：2011-07-08
申请人： FEI COMPANY , RUE, Chad , CROWLEY, Daniel
发明人： RUE, Chad , CROWLEY, Daniel
IPC分类号： H01J37/22 , H01J37/08 , H01J37/20 , H01J37/244
CPC分类号： G01J3/0262 , G01J3/0208 , G01J3/0278 , G01N21/9501 , G01N21/95684 , G01N2021/8825 , G01N2021/95653 , H01J37/226 , H01J37/3005 , H01J37/3056 , H01J2237/31749
摘要： A charged particle beam system for processing substrates is disclosed, comprising a charged particle column, combination infrared radiation and visible light illumination and imaging subsystems, in-vacuum optics, and a precision stage for supporting and positioning the substrate alternately under the charged particle column and the imaging system. The axes of the charged particle column and imaging system are offset to enable much closer working distances for both imaging and beam processing than would be possible in a single integrated assembly. A method for extremely accurately calibrating the offset between the column and imaging system is disclosed, enabling beam processing at precisely-determined locations on the substrate. The imaging system is capable of locating sub-surface features on the substrate which cannot be seen using the charged particle beam. Two illumination modes are disclosed, enabling both bright-field and dark-field imaging in infrared radiation and visible light.
摘要翻译：公开了一种用于处理基板的带电粒子束系统，其包括带电粒子柱，组合式红外辐射和可见光照明和成像子系统，真空中光学器件以及用于支撑和定位衬底交替地位于带电粒子柱和成像系统下方。带电粒子柱和成像系统的轴偏移，使得成像和光束处理的工作距离比单个集成组件中的可能距离更近。公开了一种用于非常准确地校准柱和成像系统之间的偏移的方法，使得能够在衬底上精确确定的位置处进行光束处理。成像系统能够在衬底上定位使用带电粒子束无法看到的子表面特征。公开了两种照明模式，使红外辐射和可见光中的明场和暗场成像成为可能。

5. 发明申请

WO2011162566A2 실리콘 웨이퍼의 비아홀 측정 장치 및 방법 审中-公开
标题翻译：用于通过硅波的孔测量的装置和方法
公开(公告)号：WO2011162566A2
公开(公告)日：2011-12-29
申请号：PCT/KR2011/004616
申请日：2011-06-24
申请人： 한국표준과학연구원 , 진종한 , 김재완 , 김종안 , 강주식
发明人： 진종한 , 김재완 , 김종안 , 강주식
IPC分类号： G01B11/22 , G01B11/08 , G01B9/02 , G01N21/45
CPC分类号： G01B11/22 , G01B9/02008 , G01B11/12 , G01B2210/56 , G01N21/9501 , G01N2021/95653
摘要： 본 발명은 웨이퍼를 손상시키지 않고 비아홀의 깊이를 정확하게 측정할 수 있는 실리콘 웨이퍼의 비아홀 측정 장치 및 방법에 관한 것으로, 광 투과 특성이 우수한 실리콘 웨이퍼에 광대역 적외선 광을 조사하여 웨이퍼의 각 경계면으로부터 반사되는 빛과 기준광의 간섭 신호로부터 비아홀의 깊이를 측정할 수 있게 한 실리콘 웨이퍼의 비아홀 측정 장치 및 방법에 관한 것이다. 본 발명의 비아홀 측정 장치는 광대역의 적외선 광을 생성하는 광원부와 상기 광원부로부터 생성된 광을 실리콘 웨이퍼에 조사하여 상기 실리콘 웨이퍼로부터 반사된 빛의 간섭 신호의 스펙트럼 주기로부터 웨이퍼에 형성된 비아홀의 깊이를 측정하는 간섭계를 포함한다.
摘要翻译：本发明涉及用于测量硅晶片的通孔的装置和方法，其中可以精确地测量通孔的深度而不损坏晶片。宽带红外光被照射到具有优异的透光性的硅晶片，从而可以从从晶片的每个边界面反射的光和参考光的干涉信号测量通孔的深度。根据本发明的通孔测量装置包括：用于产生宽带红外光的光源单元; 以及干涉仪，用于将从光源单元产生的光发射到硅晶片，以便根据光的干涉信号的光谱周期来测量形成在晶片上的通孔的深度，该距离从硅晶片。

6. 发明申请

WO2008102332A1 OPTICALLY MONITORING AN ALOX (TM) FABRICATION PROCESS 审中-公开
标题翻译：光学监测ALOX TM制造工艺
公开(公告)号：WO2008102332A1
公开(公告)日：2008-08-28
申请号：PCT/IL2007/000246
申请日：2007-02-25
申请人： MICRO COMPONENTS LTD. , MIRSKY, Uri , NEFTIN, Shimon , FURER, Lev
发明人： MIRSKY, Uri , NEFTIN, Shimon , FURER, Lev
IPC分类号： G01N21/956 , H01L21/66 , H01L21/316 , H01L23/498 , G01R31/309 , C25D11/04 , C25D21/12
CPC分类号： G01N21/95684 , C25D11/26 , G01N2021/8411 , G01N2021/95653 , G01N2021/95661 , H01L21/31687 , H01L2924/0002 , H01L2924/00
摘要： A method of forming an insulator that passes through a metal substrate (302) comprising: anodizing a region (312a, 312b, 314,316a, 316b, 318, 320a, 320b, 322, 324a, 324b) of the substrate to form the insulator; illuminating the region with light (330); and determining if the light passes through the substrate at the region to determine if the insulator passes completely through the substrate.
摘要翻译：一种形成穿过金属基板（302）的绝缘体的方法，包括：阳极氧化基板的区域（312a，312b，314,316a，316b，318a，320a，320b，322a，324a，324b）以形成绝缘体; 用光照射该区域（330）; 以及确定所述光是否通过所述区域处的所述衬底，以确定所述绝缘体是否完全穿过所述衬底。

7. 发明申请

WO01084128A1 INSPECTION METHOD FOR FOREIGN MATTERS INSIDE THROUGH HOLE 审中-公开
标题翻译：通过孔内的外部事项的检查方法
公开(公告)号：WO01084128A1
公开(公告)日：2001-11-08
申请号：PCT/JP2001/002643
申请日：2001-03-29
IPC分类号： G01N21/894 , G01N21/94 , G01N21/956 , G01M11/00
CPC分类号： G01N21/95692 , G01N21/94 , G01N2021/95653
摘要： An inspection method and device for foreign matters inside a through hole, capable of a high-speed inspection on foreign matters inside a through hole at low costs and with a good accuracy. Rays of light passing from a plurality of through holes of the same size are simultaneously captured as image data, the number of lumps in the captured lump area corresponding to the plurality of through holes is counted, and a work having the counted number of lumps agreeing with a preset value is subjected to relative comparison with respect to an adjacent lump area, whereby the presence/absence of foreign matters is judged.
摘要翻译：一种通孔内的异物的检查方法和装置，能够以低成本高精度地高效地检查通孔内的异物。同时捕获从同一尺寸的多个通孔穿过的光线作为图像数据，对与多个通孔对应的捕获的块区域中的块数进行计数，并且具有计数的块数的工件一致对预定值进行相对于相邻的块区域的相对比较，从而判断异物的存在/不存在。

8. 发明申请

WO01073411A1 THROUGH HOLE INSPECTING METHOD AND DEVICE 审中-公开
标题翻译：通孔检查方法和设备
公开(公告)号：WO01073411A1
公开(公告)日：2001-10-04
申请号：PCT/JP2001/002641
申请日：2001-03-29
IPC分类号： G01N21/894 , G01N21/94 , G01N21/954 , G01N21/956 , H01L21/66 , G01M11/00
CPC分类号： G01N21/95692 , G01N21/894 , G01N21/94 , G01N21/954 , G01N2021/95653
摘要： A through hole inspecting method and device for inspecting a through hole at low cost with good precision. A light source and a sensor camera having imaging devices are provided on both sides of a table where a work having a through hole is placed. The light emerging from the through hole is captured by the sensor camera. The focal position of the sensor camera is shifted from the surface of the work to apparently enlarging the area for capturing the light emerging from the through hole.
摘要翻译：一种通孔检查方法和装置，以低成本高精度检查通孔。具有成像装置的光源和传感器相机设置在具有通孔的工件的放置台的两侧。从通孔出射的光被传感器相机捕获。传感器相机的焦点位置从工件的表面移动到明显放大用于捕获从通孔出射的光的区域。

9. 发明申请

WO1992009883A1 METHOD AND SYSTEM FOR VERIFYING SUBSTRATE MACHINING 审中-公开
标题翻译：用于验证基板加工的方法和系统
公开(公告)号：WO1992009883A1
公开(公告)日：1992-06-11
申请号：PCT/US1991001368
申请日：1991-02-27
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人： INTERNATIONAL BUSINESS MACHINES CORPORATION , CONESKI, Anthony, Francis , LIN, Yea-Sen , VANDERGHEYNST, George, Bertram
IPC分类号： G01N21/88
CPC分类号： G01N21/95607 , G01J1/44 , G01N2021/95653
摘要： A system (21) for machining and for verifying the machining of substrates (16) includes a source of an energy beam (13) located to impinge upon machined features of the substrates and a verifier detect head (14) comprising a photodiode switching circuit matrix (30) for detecting those portions of the energy beam which impinge upon the machined features of the substrate. The photodiode switching circuits (40) include a current boost resistor (45) in parallel with the photodiode (41) which allows greater current to flow through the output diode, thereby increasing its switching speed. Pairs of photodiode circuits of the array are sequentially energized so that dual strings of outputs are produced. These outputs are then multiplexed and digitized. The digital outputs are compared in a verifier controller (12) with a predetermined set of data to determine accuracy of the machining process. Substrates (15, 16) to be machined and verified can be mounted on a single X-Y table (10) so that the machining and verification processes can be accomplished simultaneously. Application: machining and verifying hole patterns and checking quality of the machined holes of electronic device substrates (e.g. multilayer ceramic substrates).
摘要翻译：用于加工和验证基板（16）的加工的系统（21）包括位于冲击基板的机加工特征的能量束（13）的源和验证器检测头（14），其包括光电二极管开关电路矩阵（30），用于检测撞击衬底的加工特征的能量束的那些部分。光电二极管开关电路（40）包括与光电二极管（41）并联的电流升压电阻（45），其允许更大的电流流过输出二极管，从而增加其开关速度。对阵列的光电二极管电路依次通电，从而产生双串输出。然后将这些输出进行多路复用和数字化。数字输出在验证器控制器（12）中与预定的一组数据进行比较，以确定加工过程的精度。要加工和验证的基板（15,16）可以安装在单个X-Y工作台（10）上，从而可以同时完成加工和验证过程。应用：加工和验证孔图案并检查电子器件基板（例如多层陶瓷基板）的加工孔的质量。

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