专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

WO2017222545A1 AMORPHOUS THIN METAL FILM 审中-公开
标题翻译：非晶态金属薄膜
公开(公告)号：WO2017222545A1
公开(公告)日：2017-12-28
申请号：PCT/US2016/039174
申请日：2016-06-24
申请人： HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. , THE STATE OF OREGON
发明人： ABBOTT JR., James Elmer , MCGLONE, John M. , OLSEN, Kristopher , KESZLER, Douglas , WAGER, John , PUGLIESE, Roberto A. , STICKLE, William F. , LONG, Greg Scott
IPC分类号： C23C30/00 , C22C45/00 , C23C4/04 , C23C14/06 , B41J2/335
CPC分类号： B41J2/14129 , B41J2202/03 , C22C45/00 , C23C14/14
摘要： An amorphous thin metal film can comprise a combination of three metals or metalloids including: 5 at% to 90 at% of a metalloid selected from the group of carbon, silicon, and boron; 5 at% to 90 at% of a first metal selected from the group of titanium, vanadium, chromium, iron, cobalt, nickel, zirconium, niobium, molybdenum, ruthenium, rhodium, palladium, hafnium, tantalum, tungsten, osmium, iridium, and platinum; and 1 at% to 90 at% of cerium. The three elements may account for at least 50 at% of the amorphous thin metal film.
摘要翻译：非晶金属薄膜可包含三种金属或准金属的组合，包括：5at％至90at％的选自碳，硅和硼的准金属; 5原子％至90原子％的选自钛，钒，铬，铁，钴，镍，锆，铌，钼，钌，铑，钯，铪，钽，钨，锇，铱，和铂金; 和1原子％至90原子％的铈。这三种元素可能占非晶薄金属膜的至少50原子％。

2. 发明申请

WO2017023241A1 PRINTED CIRCUIT BOARD WITH RECESSED POCKET FOR FLUID DROPLET EJECTION DIE 审中-公开
标题翻译：印刷电路板，带有流体喷射喷枪的接收口
公开(公告)号：WO2017023241A1
公开(公告)日：2017-02-09
申请号：PCT/US2015/043080
申请日：2015-07-31
申请人： HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
发明人： CHEN, Chien-Hua , HAMMERSTAD, Diane R. , HOFFMAN, Randy
IPC分类号： B41J2/04 , B41J2/14 , B41J2/16
CPC分类号： B41J2/14072 , B41J2/14129 , B41J2/14145 , B41J2/1433 , B41J2/1623 , B41J2/1637 , B41J2002/14419 , B41J2002/14491 , B41J2202/13 , B41J2202/18
摘要： A printed circuit board includes a recessed pocket. A fluid droplet ejection die is within recessed pocket.
摘要翻译：印刷电路板包括凹陷的凹槽。流体液滴喷射模具在凹槽内。

3. 发明申请

WO2017019091A1 PRINTHEAD ASSEMBLY 审中-公开
标题翻译：印度大会
公开(公告)号：WO2017019091A1
公开(公告)日：2017-02-02
申请号：PCT/US2015/042908
申请日：2015-07-30
申请人： HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
发明人： MUN, Wong Wai , CHIA, Leong Yap , GE, Ning
IPC分类号： B41J2/05 , B41J2/16
CPC分类号： B41J2/05 , B41J2/14072 , B41J2/14129 , B41J2/16 , B41J2202/03 , B41J2202/11
摘要： The present subject matter relates to a printhead assembly comprising a plurality of print nozzles in a nozzle array. Each of the plurality of print nozzles is coupled to a printhead firing resistor, the printhead firing resistor being individually addressable. A print control circuit is to actuate the printhead firing resistor. In accordance with one example implementation of the present subject matter, the print control circuit comprises pull-down resistors made of Tantalum-Aluminum (Ta-Al).
摘要翻译：本主题涉及一种包括喷嘴阵列中的多个打印喷嘴的打印头组件。多个打印喷嘴中的每一个连接到打印头致动电阻器，打印头激励电阻器可单独寻址。打印控制电路用于致动打印头致冷电阻。根据本主题的一个示例性实施例，打印控制电路包括由钽 - 铝（Ta-Al）制成的下拉电阻器。

4. 发明申请

WO2016031217A1 METHOD OF FABRICATING FLUID EJECTION CHIP, PRINTHEAD, FLUID EJECTION CHIP AND INKJET PRINTER 审中-公开
标题翻译：制造流体喷射芯片，打印头，流体喷射芯片和喷墨打印机的方法
公开(公告)号：WO2016031217A1
公开(公告)日：2016-03-03
申请号：PCT/JP2015/004216
申请日：2015-08-21
申请人： FUNAI ELECTRIC CO., LTD.
发明人： EDELEN, John Glenn , SEMLER, Nicole , MARRA, Michael
IPC分类号： B41J2/14
CPC分类号： B41J2/14072 , B41J2/14129 , B41J2/14427 , B41J2/1603 , B41J2/1628 , B41J2/1629 , B41J2/1631 , B41J2/1632 , B41J2/1648 , B41J2202/13
摘要： An inkjet printer (40) including a printhead (10) with a fluid ejection chip and an associated method of forming is described. The fluid ejection chip includes a substrate, a plurality of groups of drive elements formed on the substrate, and a plurality of fluid ejection devices disposed on the substrate. Each group of drive elements includes at least two drive elements electrically coupled in parallel. Each fluid ejection device of the plurality of fluid ejection devices is electrically coupled with a respective group of the plurality of groups of drive elements so that the plurality of drive elements selectively activate the plurality of fluid ejection devices for causing fluid to be expelled from the printhead (10) in accordance with image data.
摘要翻译：描述了包括具有流体喷射芯片的打印头（10）和相关联的成形方法的喷墨打印机（40）。流体喷射芯片包括基板，形成在基板上的多组驱动元件和设置在基板上的多个流体喷射装置。每组驱动元件包括并联电耦合的至少两个驱动元件。多个流体喷射装置中的每个流体喷射装置与相应组的多组驱动元件电耦合，使得多个驱动元件选择性地启动多个流体喷射装置，以使流体从打印头排出（10）根据图像数据。

5. 发明申请

WO2015005934A1 THERMAL INKJET PRINTHEAD STACK WITH AMORPHOUS METAL RESISTOR 审中-公开
标题翻译：热喷墨印刷电路板与非晶金属电阻器
公开(公告)号：WO2015005934A1
公开(公告)日：2015-01-15
申请号：PCT/US2013/050205
申请日：2013-07-12
申请人： HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
发明人： ABBOTT, JR., James Elmer , PUGLIESE, Roberto A. , LONG, Greg Scott
IPC分类号： B41J2/335 , B41J2/345
CPC分类号： B41J2/14129 , B41J2/14016 , B41J2/14088 , B41J2/14112 , B41J2/1601 , B41J2/164 , B41J2/1642 , B41J2/1646 , B41J2202/03 , B41J2202/11 , H01C1/148 , H01C7/006 , H01C17/0652 , H01C17/06526 , H01L27/11582 , H01L28/00
摘要： The present disclosure is drawn to a thermal inkjet printhead stack with an amorphous metal resistor, including an insulated substrate and a resistor applied to the insulated substrate. The resistor can include from 5 atomic % to 90 atomic % of a metalloid of carbon, silicon, or boron; and from 5 atomic % to 90 atomic % each of a first and second metal of titanium, vanadium, chromium, cobalt, nickel, zirconium, niobium, molybdenum, rhodium, palladium, hafnium, tantalum, tungsten, iridium, or platinum, where the second metal is different than the first metal. The metalloid, the first metal, and the second metal can account for at least 70 atomic % of the amorphous thin metal film.
摘要翻译：本公开涉及具有非晶金属电阻器的热喷墨打印头堆叠，其包括绝缘基板和施加到绝缘基板的电阻器。电阻器可以包括5原子％至90原子％的碳，硅或硼准金属; 和钛，钒，铬，钴，镍，锆，铌，钼，铑，钯，铪，钽，钨，铱或铂的第一和第二金属的5原子％至90原子％第二金属与第一金属不同。准金属，第一金属和第二金属可以占非晶金属薄膜的至少70原子％。

6. 发明申请

WO2013055349A1 RESISTOR 审中-公开
公开(公告)号：WO2013055349A1
公开(公告)日：2013-04-18
申请号：PCT/US2011/056270
申请日：2011-10-14
申请人： HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. , COOK, Galen P. , CHUNG, Bradley D.
发明人： COOK, Galen P. , CHUNG, Bradley D.
IPC分类号： C23F1/02 , B41J2/14 , B41J2/145
CPC分类号： B41J2/1626 , B41J2/1412 , B41J2/14129 , B41J2/1603 , B41J2/1628 , B41J2002/0055 , B41J2002/14387 , H05B3/00 , H05B2203/013 , H05B2203/017
摘要： A method and apparatus provide a resistor electrically connected to an electrically conductive trace.
摘要翻译：一种方法和装置提供电连接到导电迹线的电阻器。

7. 发明申请

WO2013036424A1 PRINTHEAD FOR INKJET PRINTING DEVICE 审中-公开
标题翻译：喷墨打印设备
公开(公告)号：WO2013036424A1
公开(公告)日：2013-03-14
申请号：PCT/US2012/053012
申请日：2012-08-30
申请人： EASTMAN KODAK COMPANY , SIEBER, Kurt, D.
发明人： SIEBER, Kurt, D.
IPC分类号： B41J2/16 , B41J2/03 , B41J2/14
CPC分类号： B41J2/1606 , B41J2/03 , B41J2/14129 , B41J2/1601 , B41J2/1642 , B41J2/1646 , B41J2202/22 , C23C16/405
摘要： An inkjet printhead is provided for a digitally controlled inkjet printing apparatus wherein the inkjet printhead is comprised of a material layer and a drop formation mechanism positioned in or on the material layer, that is substantially improved in chemical resistance and thermally stability. A chemically resistant and thermally stable multilayer coating is provided onto and in contact with the inkjet printhead, wherein the multilayer coating includes one or more thin film layers comprised primarily of hafnium oxide or zirconium oxide and one or more thin film layers comprised primarily of tantalum oxide, the multilayer coating being located on the material layer. The corrosion resistant film used in the invention is particularly beneficial because it can be formed on the printhead using atomic layer deposition film forming methods that produce conformal films that cover complex geometries, thereby enabling the corrosion resistant film to be formed on all surfaces of the printhead that come in contact with inks or other fluids employed in the printing system.
摘要翻译：为数字控制的喷墨打印设备提供喷墨打印头，其中喷墨打印头包括位于材料层中或材料层上的材料层和液滴形成机构，其基本上改善了耐化学性和热稳定性。在喷墨打印头上提供耐化学性和热稳定性的多层涂层，其中多层涂层包括主要由氧化铪或氧化锆组成的一个或多个薄膜层和主要由氧化钽组成的一个或多个薄膜层，多层涂层位于材料层上。本发明中使用的耐腐蚀膜是特别有益的，因为它可以使用产生覆盖复杂几何形状的保形膜的原子层沉积膜形成方法在打印头上形成，从而使耐腐蚀膜能够形成在打印头的所有表面上其与印刷系统中使用的油墨或其它流体接触。

8. 发明申请

WO2012106307A3 FLUID EJECTION DEVICE HAVING FIRING CHAMBER WITH MESA 审中-公开
标题翻译：具有MESA燃烧室的流体喷射装置
公开(公告)号：WO2012106307A3
公开(公告)日：2012-11-15
申请号：PCT/US2012023272
申请日：2012-01-31
申请人： HEWLETT PACKARD DEVELOPMENT CO , WHITE LAWRENCE H , MARDILOVICH PETER , TORNIAINEN ERIK D , FEINN JAMES A , STRAND THOMAS R , CRUZ-URIBE TONY S
发明人： WHITE LAWRENCE H , MARDILOVICH PETER , TORNIAINEN ERIK D , FEINN JAMES A , STRAND THOMAS R , CRUZ-URIBE TONY S
IPC分类号： B41J2/175 , B41J2/045 , B41J2/14
CPC分类号： B41J2/1412 , B41J2/14129
摘要： A fluid ejection device includes a firing chamber having an ejection orifice opposite a chamber floor, a heating element and a mesa projecting from the chamber floor, the mesa is spaced from the heating element to define a passive zone between the mesa and heating element.
摘要翻译：流体喷射装置包括具有与腔室底板相对的喷射孔的加热室，加热元件和从室底板突出的台面，台面与加热元件间隔开以在台面和加热元件之间限定被动区域。

9. 发明申请

WO2012057758A1 FLUID EJECTION ASSEMBLY WITH CIRCULATION PUMP 审中-公开
标题翻译：带循环泵的流体喷射装置
公开(公告)号：WO2012057758A1
公开(公告)日：2012-05-03
申请号：PCT/US2010/054412
申请日：2010-10-28
申请人： HEWLETT-PACKARD DEVELOPMENT COMPANY L.P. , GOVYADINOV, Alexander , OAK, Jason
发明人： GOVYADINOV, Alexander , OAK, Jason
IPC分类号： B41J2/175 , B41J2/045 , B41J2/14
CPC分类号： B41J2/04541 , B41J2/1404 , B41J2/14129 , B41J2/165 , B41J2/16526 , B41J2/18 , B41J2/19 , B41J2002/14387 , B41J2002/14467 , B41J2202/12
摘要： A fluid ejection assembly includes a fluid slot, a recirculation channel, and a drop ejection element within the recirculation channel. A pump element is configured to pump fluid to and from the fluid slot through the recirculation channel. A first addressable drive circuit associated with the drop ejection element and a second addressable drive circuit associated with the pump element are capable of driving the drop ejection element and the pump element simultaneously.
摘要翻译：流体喷射组件包括在再循环通道内的流体槽，再循环通道和液滴喷射元件。泵元件构造成将流体泵送到流体槽并通过再循环通道。与液滴喷射元件相关联的第一可寻址驱动电路和与泵元件相关联的第二可寻址驱动电路能够同时驱动液滴喷射元件和泵元件。

10. 发明申请

WO2010141104A2 LOCALIZED DROPLET HEATING WITH SURFACE ELECTRODES IN MICROFLUIDIC CHIPS 审中-公开
标题翻译：用微波炉表面电极定位滴漏加热
公开(公告)号：WO2010141104A2
公开(公告)日：2010-12-09
申请号：PCT/US2010021402
申请日：2010-01-19
申请人： UNIV CALIFORNIA , KIM CHANG-JIN , NELSON WYATT C
发明人： KIM CHANG-JIN , NELSON WYATT C
IPC分类号： G01N27/26 , B41J2/05 , B41J2/175 , B60L3/00 , G01N1/02
CPC分类号： B41J2/14129 , B41J2/04563 , B41J2/0458 , B41J2/1603 , B41J2/1629 , B41J2/1631 , B41J2/1642 , Y10T137/6606
摘要： A microfluidic device for droplet manipulation includes a substrate, a plurality of electrically addressable thin-film electrodes disposed on the substrate, at least one of the plurality of electrodes comprising a heating element in the form of a patterned electrode. A hydrophilic region is disposed in or above a portion of the heating element. The hydrophilic region may be permanent or electronically actuable. The thin-film electrodes have multi-function capabilities including, for instance, heating, temperature sensing, and/or sample actuation.
摘要翻译：用于液滴操作的微流体装置包括基板，设置在基板上的多个可电寻址的薄膜电极，多个电极中的至少一个电极包括呈图案化电极形式的加热元件。亲水区域设置在加热元件的一部分中或上方。亲水区域可以是永久的或电动的。薄膜电极具有多功能能力，包括例如加热，温度感测和/或样品致动。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式