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1. 发明申请

WO2016081951A1 WAFER PIN CHUCK FABRICATION AND REPAIR 审中-公开
标题翻译： WAFER PIN CHUCK制造和维修
公开(公告)号：WO2016081951A1
公开(公告)日：2016-05-26
申请号：PCT/US2015/062231
申请日：2015-11-23
申请人： M CUBED TECHNOLOGIES
发明人： GRATRIX, Edward
IPC分类号： G03F7/20 , H01L21/687
CPC分类号： H01L21/6875 , B24B37/042 , B24B37/14 , B24B37/16 , G03F7/707 , G03F7/70783 , H01L21/6838 , H01L21/68757
摘要： In a wafer chuck design featuring pins or "mesas" making up the support surface, engineering the pins to have an annular shape, or to contain holes or pits, minimizes sticking of the wafer, and improves wafer settling. In another aspect of the invention is a tool and method for imparting or restoring flatness and roughness to a surface, such as the support surface of a wafer chuck. The tool is shaped such that the contact to the surface being treated is a circle or annulus. The treatment method may take place in a dedicated apparatus, or in-situ in semiconductor fabrication apparatus. The tool is smaller than the diameter of the wafer pin chuck, and may be approximate to the spatial frequency of the high spots to be lapped. The movement of the tool relative to the support surface is such that all areas of the support surface may be processed by the tool, or only those areas needing correction.
摘要翻译：在具有构成支撑表面的销或“台面”的晶片卡盘设计中，将引脚设计成具有环形形状，或者包含孔或凹坑，最小化晶片的粘附，并且改善晶片沉降。本发明的另一方面是用于赋予或恢复诸如晶片卡盘的支撑表面的表面的平坦度和粗糙度的工具和方法。该工具被成形为使得与被处理的表面的接触是圆形或环形。处理方法可以在专用设备中进行，或者在半导体制造设备中进行。该工具小于晶片销卡盘的直径，并且可以近似于待研磨的高点的空间频率。工具相对于支撑表面的移动使得支撑表面的所有区域可以由工具来处理，或者仅仅是需要校正的区域。

2. 发明申请

WO2011142975A2 PAD WINDOW INSERT 审中-公开
标题翻译： PAD WINDOW插件
公开(公告)号：WO2011142975A2
公开(公告)日：2011-11-17
申请号：PCT/US2011034215
申请日：2011-04-27
申请人： APPLIED MATERIALS INC , SWEDEK BOGUSLAW A , BENVEGNU DOMINIC J
发明人： SWEDEK BOGUSLAW A , BENVEGNU DOMINIC J
IPC分类号： H01L21/304
CPC分类号： B24B37/013 , B24B37/16 , B24B37/205 , B24B37/26
摘要： A polishing pad includes a polishing layer having a polishing surface, an adhesive layer on a side of the polishing layer opposite the polishing layer, and a solid light-transmitting window extending through and molded to the polishing layer. The solid light-transmitting window has an upper portion with a first lateral dimension and a lower portion with a second lateral dimension that is smaller than the first lateral dimension. A top surface of the solid light-transmitting window coplanar with the polishing surface and a bottom surface of the solid light-transmitting window coplanar with a lower surface of the adhesive layer.
摘要翻译：抛光垫包括具有抛光表面的抛光层，与抛光层相对的抛光层一侧的粘合剂层，以及延伸穿过模制到抛光层的固体透光窗。固体透光窗具有具有第一横向尺寸的上部和具有小于第一横向尺寸的第二横向尺寸的下部。固体透光窗的顶表面与抛光表面共面并且固体透光窗的底表面与粘合剂层的下表面共面。

3. 发明申请

WO2010045151A3 TEXTURED PLATEN 审中-公开
标题翻译：纹理平板
公开(公告)号：WO2010045151A3
公开(公告)日：2010-07-15
申请号：PCT/US2009060356
申请日：2009-10-12
申请人： APPLIED MATERIALS INC , CHEN HUNG CHIH
发明人： CHEN HUNG CHIH
IPC分类号： H01L21/304
CPC分类号： B24B37/16
摘要： Embodiments described herein generally relate to the planarization of substrates. In one embodiment, an apparatus for polishing a substrate is provided. The apparatus comprises a rotatable platen having a textured upper surface, at least one groove formed in the upper surface, and a pad disposed on the textured upper surface and bridging the at least one groove.
摘要翻译：本文描述的实施例通常涉及衬底的平面化。在一个实施例中，提供了一种用于抛光衬底的装置。该装置包括具有纹理的上表面的可旋转压板，在上表面中形成的至少一个凹槽，以及设置在纹理化的上表面上并桥接至少一个凹槽的垫。

4. 发明申请

WO2008023288A8 AN APPARATUS FOR AND METHOD OF POLISHING A SEMICONDUCTOR WAFER USING CHEMICAL MECHANICAL PLANARIZATION 审中-公开
标题翻译：利用化学机械平面抛光抛光半导体晶片的装置和方法
公开(公告)号：WO2008023288A8
公开(公告)日：2008-11-27
申请号：PCT/IB2007051402
申请日：2007-04-19
申请人： O'DEA EOIN
发明人： O'DEA EOIN
IPC分类号： B24B37/04
CPC分类号： B24B37/04 , B24B21/04 , B24B37/16
摘要： An apparatus for polishing a substrate surface such as a semiconductor wafer or the like by Chemical Mechanical Planarization (CMP) comprises a rotatable wafer platen which is held against a conical body having a polishing pad which contacts the wafer along tangential length of the curved surface of the conical body. The polishing pad is optionally a belt tensioned over the conical body or a conical pad securely mounted to the conical body. The apparatus includes a housing or process vessel to encapsulate substantially the process interface region, particulary where a chemical slurry is used in the polishing media. A method of polishing a substrate, such as a semiconductor wafer, is also disclosed. The method optionally includes immersion of the process interface in polishing media.a
摘要翻译：通过化学机械平坦化（CMP）抛光诸如半导体晶片等的衬底表面的设备包括可旋转的晶片台板，该晶片台板抵靠具有抛光垫的圆锥体保持，该抛光垫沿着弯曲表面的切向长度圆锥形的身体。抛光垫可选地是张紧在锥形体上的皮带或固定安装在锥形体上的锥形垫。该设备包括壳体或处理容器以基本上密封处理界面区域，特别是在抛光介质中使用化学浆料的地方。还公开了抛光诸如半导体晶片的衬底的方法。该方法可选地包括将处理界面浸入抛光介质中.a

5. 发明申请

WO2007117301A2 BALL CONTACT COVER FOR COPPER LOSS REDUCTION AND SPIKE REDUCTION 审中-公开
标题翻译：用于铜减少和减少焦距的球接触罩
公开(公告)号：WO2007117301A2
公开(公告)日：2007-10-18
申请号：PCT/US2006/060421
申请日：2006-11-01
申请人： APPLIED MATERIALS, INC. , MANENS, Antoine P. , DUBOUST, Alain , OLGADO, Donald J.k. , WANG, Yan , SALAS-VERNIS, Jose , CHANG, Shou-sung
发明人： MANENS, Antoine P. , DUBOUST, Alain , OLGADO, Donald J.k. , WANG, Yan , SALAS-VERNIS, Jose , CHANG, Shou-sung
IPC分类号： B24B37/16
CPC分类号： B24B37/16 , B23H5/08 , H01L21/32125
摘要： Embodiments of the invention generally provide a method and apparatus for processing a substrate in an electrochemical mechanical planarizing system. In one embodiment, a contact assembly for electrochemically processing a substrate includes a housing having a ball disposed in a passage formed through the housing. The ball is adapted to extend partially from the housing to contact the substrate during processing. The housing comprises a conductive material. In another embodiment, the housing comprises a lower housing and a contact cover wherein the contact cover comprises a conductive material.
摘要翻译：本发明的实施方案通常提供用于在电化学机械平面化系统中处理衬底的方法和装置。在一个实施例中，用于电化学处理衬底的接触组件包括具有设置在通过壳体形成的通道中的球的壳体。该球适于在加工过程中从壳体部分延伸以接触基底。壳体包括导电材料。在另一个实施例中，壳体包括下壳体和接触盖，其中接触盖包括导电材料。

6. 发明申请

WO02078900A3 APPARATUS AND METHODS FOR ALIGNING A SURFACE OF AN ACTIVE RETAINER RING WITH A WAFER SURFACE FOR CHEMICAL MECHANICAL POLISHING 审中-公开
标题翻译：用于化学机械抛光用于表面的活性保持环的表面的装置和方法
公开(公告)号：WO02078900A3
公开(公告)日：2003-04-10
申请号：PCT/US0210153
申请日：2002-03-28
申请人： LAM RES CORP , SALDANA MIGUEL A , WILLIAMS DAMON VINCENT
发明人： SALDANA MIGUEL A , WILLIAMS DAMON VINCENT
IPC分类号： B24B37/04 , B24B37/16 , B24B37/32 , H01L21/304 , B24B41/06 , B24B49/16
CPC分类号： B24B37/32 , B24B37/16
摘要： A CMP system and methods reduce a cause of differences between an edge profile of a chemical mechanical polished edge of a wafer and a center profile of a chemical mechanical polished central portion of the wafer within the edge. The wafer is mounted on a carrier surface 210 of a wafer carrier 212 so that a wafer axis 224 of rotation is gimballed for universal movement relative to a spindle axis 218 of rotation of a wafer spindle 220 . A retainer ring 226 limits wafer movement on the carrier surface 210 perpendicular to the wafer axis. The retainer ring 226 is mounted on and movable relative to the wafer carrier 212 . A linear bearing 230 is configured with a housing 320 and a shaft 326 so that a direction of permitted movement between the wafer carrier 212 and the retainer ring 226 is only movement parallel to the wafer axis 224, so that a wafer plane and a retainer ring 226 may be co-planar.
摘要翻译： CMP系统和方法减少了晶片的化学机械抛光边缘的边缘轮廓与边缘内的晶片的化学机械抛光中心部分的中心轮廓之间的差异的原因。晶片安装在晶片载体212的载体表面210上，使得晶片轴线224旋转以相对于晶片主轴220的主轴轴线218进行通用移动。保持环226限制垂直于晶片轴线的载体表面210上的晶片移动。保持环226安装在晶片载体212上并相对于晶片载体212可移动。线性轴承230被构造为具有壳体320和轴326，使得晶片载体212和保持环226之间允许的移动方向仅仅是平行于晶片轴线224的运动，使得晶片平面和保持环 226可以是共面的。

7. 发明申请

WO2003016070A2 INTEGRATED PLATEN ASSEMBLY FOR A CHEMICAL MECHANICAL PLANARIZATION SYSTEM 审中-公开
标题翻译：支持抛光网的方法和装置
公开(公告)号：WO2003016070A2
公开(公告)日：2003-02-27
申请号：PCT/US2002/025665
申请日：2002-08-12
申请人： APPLIED MATERIALS, INC.
发明人： FRANKLIN, Timothy, J. , MAROHL, Dan, A.
IPC分类号： B42B
CPC分类号： B24B37/16 , B24B9/10 , B24B21/04 , B24B21/20
摘要： Generally, a method and apparatus for supporting a web of polishing material. In one embodiment, the apparatus includes a platen and a blocker valve. The platen includes a support surface adapted to support the polishing material and a port fluidly coupled to the support surface. A housing that includes a supply port and an exit port has a venturi body disposed therein. The blocker valve has a first state whereby a flow through the housing and blocker valve causes vacuum to be drawn through the port disposed in the platen by the venturi body. In another embodiment, the flow through the venturi may be reversed by changing the state of the blocker valve to blow air through the port disposed in the platen, thereby placing the polishing material and the support surface of the platen in a spaced-apart relation.
摘要翻译：通常，用于支撑抛光材料的网状物的方法和装置102.在一个实施例中，该装置包括压板230和阻塞阀314.压板包括适于支撑抛光材料的支撑表面和流体耦合到支撑面。包括供给口304和出口306的壳体具有设置在其中的文丘里管本体310。阻塞阀具有第一状态，由此通过壳体和阻塞阀的流动导致真空通过文丘里管体设置在压板中的端口被抽吸。在另一个实施例中，可以通过改变阻塞阀的状态来改变通过文丘里管310的流动，从而通过布置在压板中的端口284吹送空气，从而将抛光材料和压板的支撑表面放置在间隔开的位置关系。

8. 发明申请

WO2017030873A1 WAFER CHUCK FEATURING REDUCED FRICTION SUPPORT SURFACE 审中-公开
标题翻译：减速器减速摩擦支撑表面
公开(公告)号：WO2017030873A1
公开(公告)日：2017-02-23
申请号：PCT/US2016/046436
申请日：2016-08-10
申请人： M CUBED TECHNOLOGIES, INC.
发明人： GRATRIX, Edward J.
IPC分类号： B24B37/14 , B24B37/16 , G03F7/20 , H01L21/683 , H01L21/687
CPC分类号： H01L21/68735 , B24B37/14 , B24B37/16 , B24B37/30 , G03F7/707 , H01L21/6875 , H01L21/68757
摘要： Grinding, lapping and polishing basically work by making scratches in the body being ground, lapped or polished. The scratches typically are linear. The scratches gives rise to a directionality component of friction: the friction coefficient is less in the direction along the scratch than in a direction orthogonal, or across, the scratch. In a wafer handling/chucking situation, one wants the wafer to settle on the chuck, which involves the outer regions of the wafer moving radially with respect to the chuck. One can reduce friction in the radial direction by giving the lapping scratches a preferred orientation, namely, radial. This can be achieved by making the final passes of the lapping tool move predominantly in radial directions.
摘要翻译：研磨，研磨和抛光基本上通过在身体上划伤，研磨或抛光来进行。划痕通常是线性的。划痕引起了摩擦的方向性分量：摩擦系数沿着划痕的方向小于沿着正交或横过划痕的方向。在晶片处理/夹紧情况下，希望晶片沉降在卡盘上，其包括晶片的外部区域相对于卡盘径向移动。通过给研磨划痕提供优选的取向，即径向，可以减小径向摩擦。这可以通过使研磨工具的最终通过主要沿径向移动来实现。

9. 发明申请

WO2014144861A1 POLISHING SYSTEM WITH FRONT SIDE PRESSURE CONTROL 审中-公开
标题翻译：具有前侧压力控制的抛光系统
公开(公告)号：WO2014144861A1
公开(公告)日：2014-09-18
申请号：PCT/US2014/029450
申请日：2014-03-14
申请人： APPLIED MATERIALS, INC.
发明人： CHANG, Shou-Sung , FUJIKAWA, Takashi , CHEN, Hung Chih , BUTTERFIELD, Paul D.
IPC分类号： H01L21/304
CPC分类号： B24B37/005 , B24B37/042 , B24B37/10 , B24B37/16 , B24B37/32 , B24B49/16
摘要： A polishing apparatus includes a platen having a first surface to support a polishing pad and a second surface, a carrier head to hold a substrate against the polishing pad, a plurality of through-holes defined in the platen, and a pad pressure control assembly adjacent on a side of the platen opposite the carrier head.
摘要翻译：抛光装置包括具有支撑抛光垫的第一表面和第二表面的压板，用于将衬底保持在抛光垫上的载体头，限定在压板中的多个通孔和相邻的衬垫压力控制组件在压板的与承载头相对的一侧。

10. 发明申请

WO2013011921A1 研磨パッド审中-公开
标题翻译：抛光垫
公开(公告)号：WO2013011921A1
公开(公告)日：2013-01-24
申请号：PCT/JP2012/067835
申请日：2012-07-12
申请人：東レ株式会社 , 竹内奈々 , 福田誠司 , 奥田良治
发明人：竹内　奈々 , 福田　誠司 , 奥田　良治
IPC分类号： B24B37/26 , H01L21/304
CPC分类号： B24B37/26 , B24B37/16 , B24D11/00
摘要：　研磨パッドは、少なくとも研磨層を有する研磨パッドであって、前記研磨層は研磨面に側面を有する溝を備え、前記側面の少なくとも一方は、前記研磨面から連続し、前記研磨面とのなす角度がαである第１の側面、および該第１の側面から連続し、前記研磨面と平行な面とのなす角度がβである第２の側面から構成され、前記研磨面とのなす角度αは９５度より大きく、前記研磨面と平行な面とのなす角度βは９５度より大きく、かつ、前記研磨面と平行な面とのなす角度βが前記研磨面とのなす角度αよりも小さいものであり、前記研磨面から前記第１の側面と前記第２の側面の屈曲点までの屈曲点深さが０．２ｍｍより大きく、３．０ｍｍ以下であることを特徴とする。
摘要翻译：一种抛光垫，其至少具有抛光层，其中：具有侧表面的槽设置在所述抛光层的抛光表面上; 所述侧表面中的至少一个由与所述抛光表面连续的第一侧表面构成，并与所述抛光表面形成角度（a），并且所述第二侧表面与所述第一侧表面连续地形成角度（ß）平面与抛光面平行; 与抛光面形成的角度（a）大于95度; 与平行于抛光表面的平面形成的角度（β）大于95度并且小于与抛光表面形成的角度（a）; 并且从抛光表面到第一侧表面和第二侧表面之间的折叠点的折痕深度大于0.2mm且为3.0mm以下。

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