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1. 发明申请

WO1988007317A1 SOLDER PASTE REPLACEMENT METHOD AND ARTICLE 审中-公开
标题翻译：焊膏替代方法和文章
公开(公告)号：WO1988007317A1
公开(公告)日：1988-09-22
申请号：PCT/US1988000619
申请日：1988-03-01
申请人： WESTERN DIGITAL CORPORATION
发明人： WESTERN DIGITAL CORPORATION , ELLIOTT, James
IPC分类号： H05K03/34
CPC分类号： B23K1/20 , B23K1/085 , B23K2101/40 , H05K3/26 , H05K3/3421 , H05K3/3468 , H05K3/3489 , H05K2201/10689 , H05K2203/044 , H05K2203/0485 , Y02P70/613
摘要： A method for soldering surface mountable electronic components (40) to a printed circuit board (10) is described. The method involves the use of a wave soldering machine (22) to coat the pads (12) of the printed circuit board (10) with solder (26). After the pads (12) are coated with solder (26), the entire surface of the board (10) is covered with flux paste (38). Then, surface mountable electronic components (40) are positioned on the board (10). The viscous flux (38) coating holds the leads of each electronic component (40) to the pads (12) until the board (10) is placed in a furnace. The heat from the furnace first melts the flux (38) which chemically cleans the surface of the solder coated pads (12). Further increases in temperature melt the solder coating (44) to solder the component leads (42) to the pads (12). When the board (10) is subsequently removed from the furnace, the solder cools and resolidifies to electrically and mechanically connect the leads (42) to the pads (12).
摘要翻译：描述了将表面可安装的电子部件（40）焊接到印刷电路板（10）的方法。该方法包括使用波峰焊机（22）用焊料（26）涂覆印刷电路板（10）的焊盘（12）。在焊盘（12）涂覆有焊料（26）之后，板（10）的整个表面被焊剂膏（38）覆盖。然后，表面安装电子元件（40）位于板（10）上。粘性通量（38）涂层将每个电子部件（40）的引线保持到焊盘（12），直到板（10）放置在炉中。来自炉子的热量首先熔化焊剂（38），其通过化学清洁焊料涂覆的焊盘（12）的表面。熔化焊料涂层（44）的温度进一步升高以将部件引线（42）焊接到焊盘（12）。当板（10）随后从炉中取出时，焊料冷却并重新固化以将引线（42）电连接和机械地连接到焊盘（12）。

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