会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 7. 发明申请
    • MICROSTRIP ANTENNA
    • MICROSTRIP天线
    • WO2011103841A3
    • 2012-04-05
    • PCT/CN2011073006
    • 2011-04-19
    • HUAWEI TECH CO LTDFENG ZUJIANTANG ZHENYULIAO XINGGUO ZHILI
    • FENG ZUJIANTANG ZHENYULIAO XINGGUO ZHILI
    • H01Q13/08
    • H01Q9/0457H01Q5/378H01Q9/0414
    • A microstrip antenna is provided in the embodiments of the present invention. The microstrip antenna includes that: four layers of medium plates are set in parallel; a first microstrip patch is set in the middle of the upper surface of the first layer of medium plate; a second microstrip patch is set in the middle of the upper surface of the second layer of medium plate; a first grounded layer is set on the upper surface of the third layer of medium plate, a coupling window is set in the middle of the first grounded layer, and a central conductor is set in the middle of the lower surface of the third layer of medium plate; a second grounded layer is set on the lower surface of the forth layer of medium plate; and the third layer of medium plate and the forth layer of medium plate are unsymmetrical media, so that the upper electric field of the central conductor is higher than the lower electric field. The microstrip provided in the embodiments of the present invention enhances the energy coupling efficiency, ensures the antenna bandwidth, reduces backward radiation of the microstrip antenna, the front to back ratio of the microstrip antenna is thereby improved. The integrated thickness of the microstrip antenna is greatly reduced, which is advantageous for integrating transmission and reception circuits of the antenna.
    • 在本发明的实施例中提供微带天线。 微带天线包括:四层中板平行设置; 第一微带贴片设置在第一层中板的上表面的中间; 第二微带贴片设置在第二层中板的上表面的中间; 第一接地层设置在第三层介质板的上表面上,在第一接地层的中间设置耦合窗,并且在第三层的下表面的中间设置中心导体 中板; 第二接地层设置在介质板的第四层的下表面上; 第三层介质板和第四层介质是不对称介质,使得中心导体的上电场高于下电场。 在本发明实施例中提供的微带线增强了能量耦合效率,确保了天线带宽,减少了微带天线的反向辐射,从而提高了微带天线的前后比。 微带天线的集成厚度大大降低,有利于天线的发送和接收电路的集成。