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    • 8. 发明申请
    • COMPOSITIONS CONTAINING TIN NANOPARTICLES AND METHODS FOR USE THEREOF
    • 含纳米纳米粒子的组合物及其使用方法
    • WO2011109660A2
    • 2011-09-09
    • PCT/US2011027089
    • 2011-03-03
    • LOCKHEED CORPZINN ALFRED A
    • ZINN ALFRED A
    • H01B1/02
    • H01B1/22B22F1/0018B22F1/0062B22F9/24B23K35/262C01P2004/62C01P2004/64C22F1/16H05K1/092Y10S977/773Y10S977/777
    • Compositions containing tin nanoparticles and electrically conductive particles are described herein. The tin nanoparticles can have a size below about 25 nm so as to make the compositions fusable at temperatures below that of bulk tin (m.p. = 232°C). Particularly, when the tin nanoparticles are less than about 10 nm in size, the compositions can have a fusion temperature of less than about 200°C. The compositions can contain a whisker suppressant to inhibit or substantially minimize the formation of tin whiskers after tin nanoparticle fusion. In some embodiments, the compositions contain tin nanoparticles, electrically conductive particles comprising copper particles, and a whisker suppressant comprising nickel particles. Methods for using the present compositions are also described herein. The present compositions can be used as a lead solder replacement that allows rework to be performed.
    • 本文描述了含有锡纳米颗粒和导电颗粒的组合物。 锡纳米颗粒可以具有低于约25nm的尺寸,以使组合物在低于体积锡的温度下熔化(m.p. = 232℃)。 特别地,当锡纳米颗粒尺寸小于约10nm时,组合物可以具有小于约200℃的熔化温度。 组合物可以含有晶须抑制剂,以在锡纳米颗粒熔融后抑制或基本上最小化锡晶须的形成。 在一些实施方案中,组合物含有锡纳米颗粒,包含铜颗粒的导电颗粒和包含镍颗粒的晶须抑制剂。 本文还描述了使用本发明组合物的方法。 本发明的组合物可以用作允许返工进行的铅焊料替代物。