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    • 4. 发明申请
    • EFFICIENT HEAT TRANSFER FROM CONDUCTION-COOLED CIRCUIT CARDS
    • 从导电冷却电路卡进行有效的热传递
    • WO2015126745A8
    • 2015-11-05
    • PCT/US2015015769
    • 2015-02-13
    • LOCKHEED CORP
    • STUTZMAN RANDALL JDANDO CHARLES H IIILONG CLINT
    • H05K7/20
    • H05K7/20B23K20/002B23K20/08H05K7/2039H05K7/2049H05K7/20545
    • A conduction-cooled card assembly (100) is disclosed that includes a conduction-cooling frame (102), a printed wiring board (104) mounted on the frame, and a wedgelock fastener (122). The conduction- cooling frame has a thermal management interface (124) adapted to transfer heat from the frame to a chassis (128), and the wedgelock fastener is adapted to press the thermal management interface of the conduction-cooling frame against a rail of the chassis.. The assembly also has one or more of the following characteristics: (a) the thermal management interface of the conduction-cooling frame is made primarily of a first material and a portion of the thermal management interface that is adapted to engage the wedgelock fastener or the rail of the chassis is made of a second material that is softer than the first material, and (b) the wedgelock fastener is made primarily of a first material and a portion of the wedgelock fastener that is adapted to engage the thermal management interface or another rail of the chassis is made of a second material that is softer than the first material. A chassis for conduction-cooled card assemblies is also disclosed which comprises a housing and at least first and second rails within the housing that are adapted to receive a conduction-cooled card assembly therebetween. At least one of the first and second rails is made primarily of a first material and has a surface portion made of a second material that is softer than the first material.
    • 公开了一种传导冷却卡组件(100),其包括传导冷却框架(102),安装在框架上的印刷线路板(104)和楔形锁紧件(122)。 传导冷却框架具有适于将热量从框架传递到底盘(128)的热管理界面(124),并且楔形锁紧件适于将导电冷却框架的热管理界面压靠在导轨 组件还具有一个或多个以下特征:(a)传导 - 冷却框架的热管理界面主要由第一材料和热管理界面的一部分构成,该部分适于接合楔形锁 紧固件或底盘的轨道由比第一材料柔软的第二材料制成,并且(b)楔形锁紧件主要由第一材料制成,并且楔形锁紧件的一部分适于接合热管理 底盘的接口或另一个导轨由比第一材料软的第二材料制成。 还公开了一种用于传导冷却的卡组件的底架,其包括壳体以及壳体内的至少第一和第二轨道,其适于在其间容纳传导冷却卡组件。 第一轨道和第二轨道中的至少一个主要由第一材料制成,并且具有由比第一材料更软的第二材料制成的表面部分。
    • 8. 发明申请
    • HIGH-POWER MULTI-FUNCTION MILLIMETER-WAVE SIGNAL GENERATION USING OPO AND DFG
    • 使用OPO和DFG的大功率多功能微波信号发生
    • WO2014035843A3
    • 2014-05-08
    • PCT/US2013056533
    • 2013-08-23
    • LOCKHEED CORP
    • HU YONGDANXING ANDREWHENDERSON ANGUS
    • G02F1/35
    • G02F1/3534G02F1/0128G02F1/3501G02F1/353G02F1/3532G02F1/3551G02F1/39G02F2001/3503G02F2001/3507G02F2203/13H01S3/0078H01S3/0092H01S3/0675
    • Apparatus and method for high-power multi-function millimeter-wavelength (THz-frequency) signal generation using OPO and DFG in a single cavity. In some embodiments, the OPO-DFG cavity includes an optical parametric oscillator (OPO) non-linear material that receives pump light IP having pump-light frequency and generates two different lower intermediate frequencies of light - an OPO-signal beam IS and a spatially/temporally overlapping OPO-idler beam II. A difference-frequency generator non-linear material then receives the two intermediate-frequency beams II and IS, and the DFG then generates a THz-frequency output signal that has a frequency equal to the difference between the two intermediate frequencies. In some embodiments, a single-piece crystal of non-linear material is used for both OPO and DFG functions. Some embodiments use a bow-tie ring having four mirrors that define the optical path: an IP-beam-entry mirror, an IP-light-extraction mirror to remove unconverted IP-beam, an II-beam-extraction mirror, and an IS-beam-extraction mirror, and a fifth ITHz-beam-extraction mirror.
    • 在单腔中使用OPO和DFG的大功率多功能毫米波(THz频)信号产生装置和方法。 在一些实施例中,OPO-DFG空腔包括光学参数振荡器(OPO)非线性材料,其接收具有泵浦光频率的泵浦光IP并产生两个不同的下中间频率的光 - OPO信号光束IS和空间上 /时间重叠的OPO惰轮II。 然后,差分频率发生器非线性材料接收两个中频光束II和IS,然后DFG产生具有等于两个中间频率之间的差的频率的THz频率输出信号。 在一些实施例中,非线性材料的单片晶体用于OPO和DFG功能。 一些实施例使用具有限定光路的四个反射镜的蝴蝶结环:IP光束入射镜,用于去除未转换的IP光束的IP光提取镜,II光束提取镜和IS 光束提取镜和第五个ITHz光束提取镜。
    • 9. 发明申请
    • METHOD AND PHASE-CHANGE GAIN-FIBER HOLDER THAT CONTROL TEMPERATURE RISE AND UNIFORMITY WITH MINIMAL STRESS
    • 用最小应力控制温度上升和均匀性的方法和相变增益纤维支架
    • WO2014032033A2
    • 2014-02-27
    • PCT/US2013056528
    • 2013-08-23
    • LOCKHEED CORP
    • XING ANDREW
    • F28F9/00
    • F28F9/00F28D15/02F28D15/0266F28F23/00G02B6/4268G02B6/4457
    • A thermal-management optical-fiber packaging system that includes an optical fiber and a temperature-management device configured to remove excess heat from the optical fiber. In some embodiments, the temperature-management device includes a first housing having a first outer-perimeter surface and an inner volume facing a first inner surface (wherein the inner volume has a length), a plurality of fiber-support members coupled to, and/or integral with, the first inner surface of the first housing, wherein each of the fiber-support members has one or more small-area-of-contact supports arranged along the length of the inner volume, and wherein each small-area-of-contact support is configured to provide a small area (e.g., a point) of contact with the optical fiber, and wherein the optical fiber follows a coiled path around the inner volume. A thermal-management material surrounds the optical fiber except at those locations where the optical fiber contacts the fiber-support members.
    • 一种热管理光纤封装系统,其包括光纤和被配置为从光纤去除多余热量的温度管理装置。 在一些实施例中,温度管理装置包括具有第一外周表面和面对第一内表面(其中内部体积具有长度)的内部容积的第一壳体,多个光纤支撑构件耦合到 /或与第一壳体的第一内表面成一体,其中每个纤维支撑构件具有沿着内部容积的长度布置的一个或多个小区域接触支撑件,并且其中, 触点支撑被配置成提供与光纤接触的小区域(例如,点),并且其中光纤遵循围绕内部体积的盘绕路径。 除了光纤接触光纤支撑部件的位置之外,热管理材料围绕光纤。