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    • 4. 发明申请
    • NANOSTRUCTURED SOLDERED OR BRAZED JOINTS MADE WITH REACTIVE MULTILAYER FOILS
    • 具有反应性多层玻璃的纳米结构的或焊接的接头
    • WO2005042240A2
    • 2005-05-12
    • PCT/US2004014974
    • 2004-05-13
    • UNIV JOHNS HOPKINS
    • BESNOIN ETIENNEKNIO OMARWEIHS TIMOTHY PWANG JIAPING
    • B23K1/00B23K31/12B23K35/02B23K35/34C06B45/14B32B
    • B23K35/34B23K1/0006B23K1/0016B23K31/12B23K35/0238B23K2201/40B23K2203/05B23K2203/10C06B45/14
    • Self-propagating formation reactions in nanostructured multilayer foils provide rapid bursts of heat at room temperature and therefore can act as local heat sources to melt solder or braze layers and join materials. This reactive joining method provides very localized heating to the components and rapid cooling across the joint. The rapid cooling results in a very fine microstructure of the solder or braze material. The scale of the fine microstructure of the solder or braze material is dependant on cooling rate of the reactive joints which varies with geometries and properties of the foils and components. The microstructure of the solder or braze layer of the joints formed by melting solder in a furnace is much coarser due to the slow cooling rate. Reactive joints with finer solder or braze microstructure show higher shear strength compared with those made by conventional furnace joining with much coarser solder or braze microstructure. It is expected that the reactive joints may also have better fatigue properties compared with conventional furnace joints.
    • 纳米结构多层箔片中的自蔓延形成反应在室温下提供快速的热量爆发,因此可作为局部热源熔化焊料或钎焊层并连接材料。 该反应性接合方法为组件提供非常局部的加热并且跨接头快速冷却。 快速冷却导致焊料或钎焊材料的非常精细的微观结构。 焊料或钎焊材料的细微微结构的尺度取决于随着箔和组件的几何形状和性质而变化的反应性接头的冷却速率。 由于缓慢的冷却速率,熔化焊料在熔炉中形成的接头的焊料或钎焊层的微观结构更加粗糙。 与具有更粗糙的焊料或钎焊微观结构的常规炉连接制成的反应性接头相比,具有更好的焊料或钎焊组织的反应性接头显示出更高的剪切强度。 预期与传统的炉接头相比,反应接头也可具有更好的疲劳特性。