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    • 1. 发明申请
    • VERTICALLY TRANSLATABLE CHUCK ASSEMBLY AND METHOD FOR A PLASMA REACTOR SYSTEM
    • 用于等离子体反应器系统的垂直可翻转组件和方法
    • WO02059933A3
    • 2002-10-10
    • PCT/US0148851
    • 2001-12-20
    • TOKYO ELECTRON LTDJOHNSON WAYNE LFINK STEVEN TBROWNING JEFFJEVTIC JOVAN
    • JOHNSON WAYNE LFINK STEVEN TBROWNING JEFFJEVTIC JOVAN
    • H01J37/32H01L21/00
    • H01L21/67069H01J37/32082H01J37/32174
    • A chuck assembly (110) for supporting a workpiece (116) within a plasma reactor chamber (60) having sidewalls (64) surrounding an interior region (65) capable of supporting a plasma. The assembly includes a chuck base (130) and a plurality of support arms (150A-150C) extending outwardly from the chuck base perimeter to the chamber sidewalls. The support arms are adapted to support the chuck base within the interior region, while also being adapted to provide a path for mechanically, electrically, pneumatically and/or fluidly communicating with the chuck assembly from outside the chamber. The chuck assembly includes a workpiece support member (160) arranged above the chuck base, capable of supporting the workpiece and serving as a chuck electrode. The workpiece support member is supported by one or more vertical translation member (168) arranged between and operatively connected to the chuck base and the workpiece support member. The chuck assembly includes a match network (180MN), wherein at least a portion of the match network is mounted directly to the workpiece support member. The use of the support arms allows for the positioning of a vacuum pump system (250) directly beneath the chuck assembly.
    • 一种用于在具有围绕能够支撑等离子体的内部区域(65)的侧壁(64)的等离子体反应器室(60)内支撑工件(116)的卡盘组件(110)。 组件包括卡盘基座(130)和从卡盘基部周边向外延伸到腔室侧壁的多个支撑臂(150A-150C)。 所述支撑臂适于在所述内部区域内支撑所述卡盘基座,同时还适于提供用于从所述腔室外部与所述卡盘组件机械,电气,气动和/或流体连通的路径。 卡盘组件包括布置在卡盘基座上方的能够支撑工件并用作卡盘电极的工件支撑构件(160)。 工件支撑构件由一个或多个垂直平移构件(168)支撑,该垂直平移构件布置在卡盘基座和工件支撑构件之间并且可操作地连接到卡盘基座和工件支撑构件上。 卡盘组件包括匹配网络(180MN),其中匹配网络的至少一部分直接安装到工件支撑构件。 支撑臂的使用允许将真空泵系统(250)直接定位在卡盘组件的正下方。
    • 7. 发明申请
    • PLASMA REACTOR WITH REDUCED REACTION CHAMBER
    • 具有降低反应室的等离子体反应器
    • WO0233729A3
    • 2002-08-01
    • PCT/US0132094
    • 2001-10-15
    • TOKYO ELECTRON LTDFINK STEVEN T
    • FINK STEVEN T
    • H01J37/20H01J37/32H01L21/00
    • H01L21/67069H01J37/20H01J37/321H01J37/32743
    • A plasma reactor apparatus (100) includes plasma generating assembly (150) that is moveable between a first and second position. The plasma generating assembly (150) includes an inductive coil assembly (216) that is coupled to a source of RF energy. In the first position, acces is provided for mounting a wafer (101) onto a chuck assembly (250). In the second position, the plasma generating assembly (150) and the substrate chuck assembly (250) form an enclosed area (300) about the wafer (101). Process gas is used to fill the enclosed space (300) while a vacuum is created in the enclosed space (300). RF energy is applied to the inductive coil (218) and plasma is formed in the enclosed space (300) in order to process the wafer (101).
    • 等离子体反应器装置(100)包括可在第一和第二位置之间移动的等离子体发生组件(150)。 等离子体生成组件(150)包括耦合到RF能量源的感应线圈组件(216)。 在第一位置,提供了用于将晶片(101)安装到卡盘组件(250)上的接口。 在第二位置,等离子体发生组件(150)和衬底卡盘组件(250)形成围绕晶片(101)的封闭区域(300)。 当封闭空间(300)中产生真空时,使用工艺气体填充封闭空间(300)。 将RF能量施加到感应线圈(218),并且在封闭空间(300)中形成等离子体以便处理晶片(101)。
    • 8. 发明申请
    • METHOD AND APPARATUS TO DETERMINE CONSUMABLE PART CONDITION
    • 确定消耗部分条件的方法和装置
    • WO2006071341A3
    • 2007-06-07
    • PCT/US2005038176
    • 2005-10-25
    • TOKYO ELECTRON LTDFINK STEVEN T
    • FINK STEVEN T
    • H01L21/306C23C16/00
    • H01L21/67288H01J37/32935
    • A system for monitoring a condition of a consumable component (8) in a substrate processing system (1) that includes a tapered plug (2) having a first axis (23), a second axis (24) that intersects the first axis, a top portion (25) with first width (B), a bottom portion (26) with a second width (D), and sidewalls (27) joining said top and bottom portions respectively. The tapered plug has a cross sectional profile that is substantially parallel to the top and bottom portions and a cross sectional width that varies according to a location where the cross sectional profile intersects the second axis. At least one of the tapered plugs is inserted into at least one consumable component of the substrate processing system such that the top portion of the tapered plug is exposed to a processing environment of a plasma processing system.
    • 一种用于监测衬底处理系统(1)中的消耗部件(8)的状态的系统,其包括具有第一轴线(23)的锥形塞(2),与第一轴线相交的第二轴线(24) 具有第一宽度(B)的顶部(25),具有第二宽度(D)的底部部分(26)和分别连接所述顶部和底部的侧壁(27)。 锥形塞具有基本上平行于顶部和底部的横截面轮廓,并且横截面宽度根据截面轮廓与第二轴线相交的位置而变化。 将至少一个锥形插塞插入到基板处理系统的至少一个可消耗部件中,使得锥形插塞的顶部暴露于等离子体处理系统的处理环境。