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    • 2. 发明申请
    • APPARATUS AND METHOD OF IMPROVING IMPEDANCE MATCHING BETWEEN AN RF SIGNAL AND A MULTI-SEGMENTED ELECTRODE
    • 改善RF信号与多分辨电极之间的阻抗匹配的装置和方法
    • WO2002071631A2
    • 2002-09-12
    • PCT/US2002/005588
    • 2002-02-27
    • TOKYO ELECTRON LIMITEDJETVIC, JovanMITROVIC, Andrej
    • JETVIC, JovanMITROVIC, Andrej
    • H04B
    • H01J37/32082H01J37/32183
    • An apparatus and method of improving impedance matching between a RF signal and a multi-segmented electrode in a plasma reactor powered by the RF signal. The apparatus and method phase shifts the RF signal driving one or more electrode segment of the multi-segmented electrode, amplifies the RF signal, and matches an impedance of the RF signal with an impedance of the electrode segment, where the RF signal is modulated prior to matching of the impedance of the RF signal. The apparatus and method directionally couples an output of the matching of the impedance of the RF signal and the electrode segment, and adjusts the output of the matching of the impedance of the RF signal such that a directionally coupled output signal and a reference signal representing the RF signal at the output of the master RF oscillator produces a demodulated signal of minimal amplitude.
    • 一种改善由RF信号供电的等离子体反应器中的RF信号和多段电极之间的阻抗匹配的装置和方法。 该装置和方法相位移动驱动多分段电极的一个或多个电极段的RF信号,放大RF信号,并将RF信号的阻抗与电极段的阻抗匹配,其中RF信号先前被调制 以匹配RF信号的阻抗。 该装置和方法定向耦合RF信号和电极段的阻抗匹配的输出,并且调整RF信号的阻抗匹配的输出,使得定向耦合的输出信号和表示 在主RF振荡器的输出处的RF信号产生最小振幅的解调信号。
    • 7. 发明申请
    • METHOD AND APPARATUS FOR TRANSFERRING HEAT FROM A SUBSTRATE TO A CHUCK
    • 用于将热量从基片转移到卡盘的方法和设备
    • WO2002075790A2
    • 2002-09-26
    • PCT/US2002/002816
    • 2002-02-04
    • TOKYO ELECTRON LIMITEDMITROVIC, AndrejLIU, Lianjun
    • MITROVIC, AndrejLIU, Lianjun
    • H01L21/00
    • H01L21/67109C23C16/4586C30B25/10C30B25/12H01L21/6831H01L21/6833
    • A chuck method of and apparatus (50, 150, 300) for supporting a substrate (W) during processing of the substrate, where the substrate has a lower surface (W L ). The apparatus facilitates heat transfer away from the substrate during processing of the substrate. The apparatus comprises a chuck body (60) having an outer edge (70) and a rough upper surface (64 U ). The substrate is arranged adjacent the rough surface such that the substrate lower surface and the roughened upper surface form a gap (100) therebetween. The apparatus further includes a central gas conduit (80) passing through the chuck body. The central conduit has a second end (82b) open to the roughened upper surface and a first end opposite the second end connected to a gas source (86). The conduit is arranged such that a gas can flow through the conduit into the gap and toward the chuck body outer edge. The gas used has an atomic or molecular weight that is greater than that of helium. The surface roughness, the substrate lower surface and the flow of the heavier gas in the gap contribute to defining an accommodation coefficient α and a mean free path λ such that the ratio α/λ is higher than that of prior art apparatus.
    • 一种用于在衬底的处理期间支撑衬底(W)的卡盘方法和设备(50,150,300),其中衬底具有下表面(W >)。 该设备有助于在处理基板期间从基板传递热量。 该设备包括具有外边缘(70)和粗糙上表面(64)的卡盘主体(60)。 衬底布置在粗糙表面附近,使得衬底下表面和粗糙化的上表面在其间形成间隙(100)。 该设备还包括穿过卡盘主体的中心气体导管(80)。 中心导管具有对粗糙的上表面敞开的第二端(82b)和与连接到气体源(86)的第二端相对的第一端。 导管布置成使得气体可以通过导管流入间隙并朝向卡盘主体外边缘。 所用气体的原子或分子量大于氦气。 表面粗糙度,基板下表面和间隙中较重气体的流动有助于确定调节系数α和平均自由程λ,使得比率α/λ高于现有技术设备的α/λ。
    • 8. 发明申请
    • METHOD AND SYSTEM FOR TEMPERATURE CONTROL OF A SUBSTRATE
    • 基板温度控制方法及系统
    • WO2004095531A2
    • 2004-11-04
    • PCT/US2004/006078
    • 2004-03-17
    • TOKYO ELECTRON LTDMITROVIC, Andrej
    • MITROVIC, Andrej
    • H01L
    • H01L21/67248H01L21/67103H01L21/67109
    • A substrate holder for supporting a substrate in a processing system and controlling the temperature thereof is described. The substrate holder comprises a first heating element positioned in a first region for elevating the temperature of the first region. A second heating element positioned in a second region is configured to elevate the temperature in the second region. Furthermore, a first controllably insulating element is positioned below the first heating element, and is configured to control the transfer of heat between the substrate and at least one cooling element positioned therebelow in the first region. A second controllably insulating element is positioned below the second heating element and is configured to control the transfer of heat between the substrate and at least one cooling element positioned therebelow in the second region.
    • 描述了用于在处理系统中支撑衬底并控制其温度的衬底保持器。 衬底保持器包括位于第一区域中的第一加热元件,用于升高第一区域的温度。 定位在第二区域中的第二加热元件构造成升高第二区域中的温度。 此外,第一可控绝缘元件位于第一加热元件的下方,并且被配置为控制基板与位于第一区域中的至少一个冷却元件之间的热传递。 第二可控绝缘元件位于第二加热元件的下方,并且被配置为控制基板与位于第二区域中的至少一个冷却元件之间的热传递。