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    • 3. 发明申请
    • PRODUCTION OF ELECTRONIC DEVICES
    • 电子设备的生产
    • WO2005022664A2
    • 2005-03-10
    • PCT/GB2004/003754
    • 2004-09-02
    • PLASTIC LOGIC LIMITEDCAIN, PaulMENON, AnoopSIRRINGHAUS, HenningWATTS, James, D.WERNE, Tim, VonBROWN, Thomas, M.
    • CAIN, PaulMENON, AnoopSIRRINGHAUS, HenningWATTS, James, D.WERNE, Tim, VonBROWN, Thomas, M.
    • H01L51/40
    • B82Y10/00B82Y30/00H01L51/0004H01L51/0012H01L51/0021H01L51/0516H01L51/0541H01L51/0545
    • A method of producing a metal element of an electronic device on a substrate, including the steps of: forming a mixture of a material comprising metal atoms with a liquid, depositing the material from the liquid mixture onto a substrate, and then irradiating at least part of the deposited material with light to increase the electrical conductivity of the deposited material. A method of producing one or more elements of an electronic device, including the steps of : providing a substrate including one or more underlying elements of the electronic device and a thermally patternable layer overlying said one or more underlying elements; and using said one or more underlying elements to locally generate heat and thereby selectively induce a change in corresponding portions of said thermally pattemable layer; and wherein either the change selectively induced in said corresponding portions directly results in the definition of one or more elements of the electronic device in a position determined by that of said one or more underlying elements, or alternatively including the additional step of using the change selectively induced in said one or more corresponding portions to facilitate the formation of one or more elements of the electronic device in a position determined by that of said one or more underlying elements. A method of producing an element of an electronic device, including the steps of: (a) providing a substrate; (b) depositing on said substrate a layer of a switchable material, which changes its physical or chemical properties upon irradiation with light or heating causing a change of its surface energy properties; (c) irradiatively inducing at selected regions of a layer of switchable material a change in physical or chemical properties that alters the surface energy of said selected regions and thereby forming a surface energy pattern on its surface; and (d) without removing said layer of switchable material in either irradiated selected regions or non-irradiated regions from the substrate depositing over the surface energy pattern produced in step (c) a material for forming an element of the electronic device such that the surface energy pattern controls the deposition of said material.
    • 一种在基板上制造电子器件的金属元件的方法,包括以下步骤:将包含金属原子的材料与液体的混合物形成,将材料从液体混合物沉积到基底上,然后将至少部分 的沉积材料,以增加沉积材料的导电性。 一种制造电子设备的一个或多个元件的方法,包括以下步骤:提供包括电子设备的一个或多个下层元件的基板和覆盖所述一个或多个下层元件的可热图案化层; 并且使用所述一个或多个下层元件局部产生热量,从而选择性地诱导所述热可变层的相应部分的变化; 并且其中在所述相应部分中选择性地诱发的所述变化直接导致所述电子设备的一个或多个元件的定义在由所述一个或多个下层元件的位置确定的位置中,或者可选地包括选择性地使用所述变化的附加步骤 在所述一个或多个对应部分中感应以促​​进在由所述一个或多个下层元件的位置确定的位置中形成电子设备的一个或多个元件。 一种制造电子器件元件的方法,包括以下步骤:(a)提供衬底; (b)在所述基板上沉积一层可切换材料,其在用光或加热照射时改变其物理或化学性质,导致其表面能特性的变化; (c)在可切换材料层的选定区域辐射诱导改变所述选定区域的表面能,从而在其表面上形成表面能量图案的物理或化学性质的变化; 和(d)在从步骤(c)中产生的表面能量图案上沉积超过在步骤(c)中产生的表面能量图案的任何照射的选定区域或非照射区域中的所述可切换材料层不移除用于形成电子器件的元件的材料, 能量图案控制所述材料的沉积。