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1. 发明申请

WO2008036571A3 AN INTEGRATED CIRCUIT MICRO-COOLER WITH DOUBLE-SIDED TUBES OF A CNT ARRAY 审中-公开
标题翻译：一种CNT阵列双面管集成电路微调器
公开(公告)号：WO2008036571A3
公开(公告)日：2008-10-30
申请号：PCT/US2007078517
申请日：2007-09-14
申请人： NANOCONDUCTION INC , DANGELO CARLOS , OLSON DARIN
发明人： DANGELO CARLOS , OLSON DARIN
IPC分类号： H01L23/34
CPC分类号： H01L23/373 , B82Y10/00 , H01L2224/16 , H01L2224/73253 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/10253 , H01L2924/00
摘要： Heat sink structures employing carbon nanotube or nanowire arrays exposed from both opposite surfaces of the structure to reduce the thermal interface resistance between an integrated circuit chip and the heat sink are disclosed. In one embodiment, the nanotubes are cut to essentially the same length over the surface of the structure. Carbon nanotube arrays are combined with a thermally conductive metal filler disposed between the nanotubes. This structure produces a thermal interface with high axial and lateral thermal conductivities.
摘要翻译：公开了采用从结构的两个相对表面暴露的碳纳米管或纳米线阵列以减小集成电路芯片和散热器之间的热界面电阻的散热器结构。在一个实施例中，纳米管在结构的表面上被切割成基本相同的长度。碳纳米管阵列与布置在纳米管之间的导热金属填料结合。该结构产生具有高轴向和侧向导热率的热界面。

2. 发明申请

WO2004068545A3 METHOD AND APPARATUS FOR THE USE OF SELF-ASSEMBLED NANOWIRES FOR THE REMOVAL OF HEAT FROM INTEGRATED CIRCUITS 审中-公开
标题翻译：使用自组装纳米线从集成电路中去除热量的方法和装置
公开(公告)号：WO2004068545A3
公开(公告)日：2005-02-17
申请号：PCT/US2004001787
申请日：2004-01-23
申请人： NANOCONDUCTION INC , DANGELO CARLOS
发明人： DANGELO CARLOS
IPC分类号： H01L21/768 , H01L23/367 , H01L23/522 , H01L23/532 , H01L21/4763 , H01L21/44 , H01L21/48 , H01L23/48
CPC分类号： B82Y10/00 , H01L21/76838 , H01L21/76879 , H01L23/3677 , H01L23/5226 , H01L23/53276 , H01L2221/1094 , H01L2924/0002 , H01L2924/00
摘要： This invention relates to the conduction of heat within the structure of an integrated circuit. The invention discloses a heat conduction device and a method of fabricating same, that utilizes thermally conductive vias to extract heat from local power generating regions of the substrate to top or bottom surfaces of the integrated circuit die. Conductive vias contain self-assembled carbon nanotubes for the enhancement of heat conduction out of the integrated circuit.
摘要翻译：本发明涉及集成电路结构内的热传导。本发明公开了一种导热装置及其制造方法，其利用导热通孔将热量从基板的局部发电区域提取到集成电路管芯的顶表面或底表面。导电通孔包含用于增强集成电路中的热传导的自组装碳纳米管。

3. 发明申请

WO2008036568A3 AN INTEGRATED CIRCUIT MICRO-COOLER HAVING MULTI-LAYERS OF TUBES OF A CNT ARRAY 审中-公开
标题翻译：具有CNT阵列的多层管的集成电路微型冷却器
公开(公告)号：WO2008036568A3
公开(公告)日：2008-06-26
申请号：PCT/US2007078509
申请日：2007-09-14
申请人： NANOCONDUCTION INC , DANGELO CARLOS , OLSON DARIN
发明人： DANGELO CARLOS , OLSON DARIN
IPC分类号： H01L23/34
CPC分类号： H01L23/373 , B82Y10/00 , H01L2224/16 , H01L2224/73253 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/10253 , Y10S977/742 , Y10S977/762 , H01L2924/00
摘要： Heat sink structures employing mutli-layers of carbon nanotube or nanowire arrays to reduce the thermal interface resistance between an integrated circuit chip and the heat sink are disclosed. In one embodiment, the nanotubes are cut to essentially the same length over the surface of the structure. Carbon nanotube arrays are combined with a thermally conductive metal filler disposed between the nanotubes. This structure produces a thermal interface with high axial and lateral thermal conductivities.
摘要翻译：公开了采用多层碳纳米管或纳米线阵列以降低集成电路芯片和散热片之间的热界面电阻的散热结构。在一个实施例中，在结构的表面上将纳米管切割成基本相同的长度。碳纳米管阵列与布置在纳米管之间的导热金属填料结合。该结构产生具有高轴向和横向热导率的热界面。

4. 发明申请

WO2006130816A2 IN-CHIP STRUCTURES AND METHODS FOR REMOVING HEAT FROM INTEGRATED CIRCUITS 审中-公开
标题翻译：用于从集成电路中去除热的芯片结构和方法
公开(公告)号：WO2006130816A2
公开(公告)日：2006-12-07
申请号：PCT/US2006021421
申请日：2006-05-31
申请人： NANOCONDUCTION INC , DANGELO CARLOS , PADMAKUMAR BALA
发明人： DANGELO CARLOS , PADMAKUMAR BALA
CPC分类号： H01L23/373 , H01L23/3677 , H01L23/3736 , H01L2924/0002 , H01L2924/00
摘要： An in-chip system and method for removing heat from integrated circuits is disclosed. One embodiment is a substrate with a front side and a back side. The front side of the substrate is capable of having formed thereon a plurality of transistors. A plurality of structures within the substrate contain a solid heat conductive media comprising carbon nanotubes and/or a metal, such as copper. At least some of the plurality of structures extend from the back side of the substrate into the substrate. In some embodiments, the carbon nanotubes are formed within the substrate using a catalyst.
摘要翻译：公开了一种用于从集成电路中去除热量的片上系统和方法。一个实施例是具有前侧和后侧的基板。基板的前侧能够在其上形成有多个晶体管。衬底内的多个结构包含包含碳纳米管和/或诸如铜的金属的固体导热介质。多个结构中的至少一些从衬底的背面延伸到衬底中。在一些实施方案中，使用催化剂在基材内形成碳纳米管。

5. 发明申请

WO2005041256A2 SYSTEM AND METHOD USING SELF-ASSEMBLED NANO STRUCTURES IN THE DESIGN AND FABRICATION OF AN INTEGRATED CIRCUIT MICRO-COOLER 审中-公开
标题翻译：使用自组装纳米结构在集成电路微型冷却器的设计和制造中的系统和方法
公开(公告)号：WO2005041256A2
公开(公告)日：2005-05-06
申请号：PCT/US2004027449
申请日：2004-08-25
申请人： NANOCONDUCTION INC , DANGELO CARLOS
发明人： DANGELO CARLOS
IPC分类号： H01L23/373 , H01L23/473 , H01L25/065 , H01L
CPC分类号： H01L23/473 , B82Y10/00 , H01L23/373 , H01L25/0652 , H01L2224/16 , H01L2224/73253 , H01L2924/01019 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/10253 , Y10S977/742 , Y10S977/762 , Y10S977/763 , H01L2924/00
摘要： Heat sink structures employing carbon nanotube or nanowire arrays to reduce the thermal interface resistance between an integrated circuit chip and the heat sink are disclosed. Carbon nanotube arrays are combined with a thermally conductive metal filler disposed between the nanotubes. This structure produces a thermal interface with high axial and lateral thermal conductivities.
摘要翻译：公开了使用碳纳米管或纳米线阵列来降低集成电路芯片和散热片之间的热界面电阻的散热结构。碳纳米管阵列与布置在纳米管之间的导热金属填料结合。该结构产生具有高轴向和横向热导率的热界面。

6. 发明申请

WO2007053649A3 METHOD AND APPARATUS FOR ESTABLISHING OPTIMAL THERMAL CONTACT BETWEEN OPPOSING SURFACES 审中-公开
标题翻译：在对照表面之间建立最佳热接触的方法和装置
公开(公告)号：WO2007053649A3
公开(公告)日：2009-05-14
申请号：PCT/US2006042562
申请日：2006-10-31
申请人： NANOCONDUCTION INC , XU KEVIN , SUHIR EPHRAIM , DANGELO CARLOS
发明人： XU KEVIN , SUHIR EPHRAIM , DANGELO CARLOS
IPC分类号： H05K7/20
CPC分类号： H01L23/433 , H01L23/4006 , H01L2924/0002 , H01L2924/00
摘要： To achieve optimal thermal contact between opposing surfaces, it is necessary to align such surfaces so that maximum contact is achieved. In a semiconductor package (400), it is necessary to align the surface of a semiconductor integrated circuit (IC) (260) and a heat sink surface (270), where the heat sink contains a nano-composite wire structure. By using a self-aligned structure (210) that forces the alignment of the IC surface and the heat sink, maximum thermal contact between the two surfaces is achieved. The self-alignment of a pressure measurement device for same is also disclosed.
摘要翻译：为了实现相对表面之间的最佳热接触，需要对准这些表面以便实现最大的接触。在半导体封装（400）中，必须使半导体集成电路（IC）（260）和散热片表面（270）的表面对齐，其中散热器包含纳米复合导线结构。通过使用迫使IC表面和散热器对准的自对准结构（210），实现两个表面之间的最大热接触。还公开了用于其的压力测量装置的自对准。

7. 发明申请

WO2008085559A3 INTEGRATED CIRCUIT MICRO-COOLER HAVING TUBES OF A CNT ARRAY IN ESSENTIALLY THE SAME HEIGHT OVER A SURFACE 审中-公开
公开(公告)号：WO2008085559A3
公开(公告)日：2008-11-13
申请号：PCT/US2007078511
申请日：2007-09-14
申请人： NANOCONDUCTION INC , DANGELO CARLOS , OLSON DARIN
发明人： DANGELO CARLOS , OLSON DARIN
IPC分类号： H01L23/34
CPC分类号： H01L23/373 , B82Y10/00 , H01L2224/16 , H01L2224/73253 , H01L2924/01019 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/10253 , H01L2924/00
摘要： Heat sink structures employing carbon nanotube or nanowire arrays to reduce the thermal interface resistance between an integrated circuit chip and the heat sink, where the nanotubes are cut to essentially the same length over the surface of the structure, are disclosed. Carbon nanotube arrays are combined with a thermally conductive metal filler disposed between the nanotubes. This structure produces a thermal interface having high axial and lateral thermal conductivities.

8. 发明申请

WO2008085559A9 INTEGRATED CIRCUIT MICRO-COOLER HAVING TUBES OF A CNT ARRAY IN ESSENTIALLY THE SAME HEIGHT OVER A SURFACE 审中-公开
标题翻译：具有CNT阵列管的集成电路微调器基本上在相同高度上的表面上
公开(公告)号：WO2008085559A9
公开(公告)日：2008-09-18
申请号：PCT/US2007078511
申请日：2007-09-14
申请人： NANOCONDUCTION INC , DANGELO CARLOS , OLSON DARIN
发明人： DANGELO CARLOS , OLSON DARIN
IPC分类号： H01L23/34
CPC分类号： H01L23/373 , B82Y10/00 , H01L2224/16 , H01L2224/73253 , H01L2924/01019 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/10253 , H01L2924/00
摘要： Heat sink structures employing carbon nanotube or nanowire arrays to reduce the thermal interface resistance between an integrated circuit chip and the heat sink, where the nanotubes are cut to essentially the same length over the surface of the structure, are disclosed. Carbon nanotube arrays are combined with a thermally conductive metal filler disposed between the nanotubes. This structure produces a thermal interface having high axial and lateral thermal conductivities.
摘要翻译：公开了采用碳纳米管或纳米线阵列的散热器结构，以减小集成电路芯片和散热器之间的热界面电阻，其中纳米管在结构的表面上被切割成基本相同的长度。碳纳米管阵列与布置在纳米管之间的导热金属填料结合。该结构产生具有高轴向和侧向导热率的热界面。

9. 发明申请

WO2007137095A3 CARBON NANOTUBE-BASED STRUCTURES AND METHODS FOR REMOVING HEAT FROM SOLID-STATE DEVICES 审中-公开
标题翻译：基于碳纳米管的结构和从固态装置中除去热的方法
公开(公告)号：WO2007137095A3
公开(公告)日：2008-07-24
申请号：PCT/US2007069080
申请日：2007-05-16
申请人： NANOCONDUCTION INC , DANGELO CARLOS , SUHIR EPHRAIM , DEY SUBRATA , WACKER BARBARA , XU YUAN , BOREN ARTHUR , OLSEN DARIN , ZHANG YI , SCHWARTZ PETER , PADMAKUMAR BALA
发明人： DANGELO CARLOS , SUHIR EPHRAIM , DEY SUBRATA , WACKER BARBARA , XU YUAN , BOREN ARTHUR , OLSEN DARIN , ZHANG YI , SCHWARTZ PETER , PADMAKUMAR BALA
IPC分类号： F28F13/18 , B82B1/00 , D01F9/127
CPC分类号： H01L23/373 , B82Y10/00 , B82Y30/00 , C23C16/0281 , C23C16/26 , C23C28/00 , C23C28/322 , C23C28/34 , C23C28/345 , H01L24/29 , H01L24/32 , H01L33/641 , H01L2224/29193 , H01L2224/32245 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01019 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01049 , H01L2924/0105 , H01L2924/01057 , H01L2924/01073 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/04953 , H01L2924/12041 , H01L2924/14 , H01L2924/15747 , H01L2924/19043 , H01L2924/351 , H01L2924/00
摘要： Thermally conductive devices including carbon nanotubes for dissipating heat from solid-state devices are disclosed. The nanotube elements of the invention may be characterized using Raman spectroscopy, and accepted or rejected based on the ratio of the D peak to the G peak of the spectrum. The thermally conductive devices may further include a phase change material that increases lateral heat conduction between the carbon nanotubes.
摘要翻译：公开了包括用于从固态器件散热的碳纳米管的导热器件。本发明的纳米管元件可以使用拉曼光谱法进行表征，并且基于D峰与光谱的G峰的比率被接受或拒绝。导热装置还可以包括增加碳纳米管之间的横向热传导的相变材料。

10. 发明申请

WO2008060644A3 APPARATUS AND METHOD FOR COOLING ICS USING NANO-ROD BASED CHIP-LEVEL HEAT SINKS 审中-公开
标题翻译：使用纳米级芯片级散热器冷却ICS的装置和方法
公开(公告)号：WO2008060644A3
公开(公告)日：2009-04-16
申请号：PCT/US2007064541
申请日：2007-03-21
申请人： NANOCONDUCTION INC
发明人： DANGELO CARLOS
IPC分类号： G06F1/20 , F25D23/12 , F28D15/00 , F28F7/00 , F28F25/10 , H01B7/42 , H01B9/06 , H01L23/24 , H02G3/03 , H05K5/00 , H05K7/20
CPC分类号： H01L23/473 , B82Y10/00 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A method and apparatus for overcoming the problems of rapidly increasing complexity and cost and degrading reliability measures in connection with the cooling of a multi-chip mounted on an electronic printed circuit board. Accordingly, there are combined a) nano-structures materials for micro or nano-scale heat transfer from a substrate; b) small dimension heat sinks or heat spreaders matched to the mico-scale heat transfer to control the spread resistance; c) nano-scale cooling channel surfaces or micro-channel heat exchangers to improve heat transfer coefficients of the hot components to the cooling agent, air or liquid; and d) sharing of the active device such as a fan, pump, compressor, etc., that are responsible for moving the cooling agent in an active cooling embodiment. By providing appropriate passage for the cooling agent an effective and efficient cooling of the hot surfaces is achieved.
摘要翻译：一种用于克服安装在电子印刷电路板上的多芯片的冷却的复杂性和成本快速增加以及降低可靠性措施的问题的方法和装置。因此，组合了a）纳米结构材料用于从基底进行微量或纳米尺度的热传递; b）小尺寸散热器或散热器与微尺度传热匹配，以控制传播阻力; c）纳米级冷却通道表面或微通道热交换器，以改善热组分对冷却剂，空气或液体的传热系数; 以及d）在主动冷却实施例中共享负责将冷却剂移动的主动装置，例如风扇，泵，压缩机等。通过为冷却剂提供适当的通道，实现了热表面的有效和有效的冷却。

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