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1. 发明申请

WO2007078975A3 METHOD AND SYSTEM FOR USING A TWO-PHASES SUBSTRATE CLEANING COMPOUND 审中-公开
标题翻译：使用两相基板清洗化合物的方法和系统
公开(公告)号：WO2007078975A3
公开(公告)日：2008-08-28
申请号：PCT/US2006048706
申请日：2006-12-19
申请人： LAM RES CORP , KOROLIK MIKHAIL , FREER ERIK M , DE LARIOS JOHN M , MIKHAYLICHENKO KATRINA , RAVKIN MIKE , REDEKER FRED
发明人： KOROLIK MIKHAIL , FREER ERIK M , DE LARIOS JOHN M , MIKHAYLICHENKO KATRINA , RAVKIN MIKE , REDEKER FRED
IPC分类号： C09G1/00 , C09G1/02
CPC分类号： C11D11/0047 , B08B7/02 , C11D1/146 , C11D3/2079 , C11D9/02 , C11D17/0013 , C11D17/0017 , C23G1/18 , G03F7/423 , H01L21/02052 , H01L21/31133 , H01L21/6708 , H01L21/67086
摘要： Cleaning compounds, apparatus, and methods to remove contaminants from a substrate surface are provided. An exemplary cleaning compound to remove particulate contaminants from a semiconductor substrate surface is provided. The cleaning compound includes a viscous liquid with a viscosity between about 1 cP to about 10,000 cP. The cleaning compound also includes a plurality of solid components dispersed in the viscous liquid, the plurality of. solid components interact with the particulate contaminants on the substrate surface to remove the particulate contaminants from the substrate surface.
摘要翻译：提供了清除化合物，设备和从基材表面除去污染物的方法。提供了从半导体衬底表面去除颗粒污染物的示例性清洁化合物。清洁化合物包括粘度在约1cP至约10,000cP之间的粘性液体。清洁化合物还包括分散在粘稠液体中的多个固体成分，多个。固体组分与基底表面上的颗粒污染物相互作用以从基底表面去除颗粒污染物。

2. 发明申请

WO03007348A3 APPARATUS AND METHOD FOR CONTROLLING GALVANIC CORROSION EFFECTS ON A SINGLE-WAFER CLEANING SYSTEM 审中-公开
标题翻译：用于控制单波浪清洁系统中的腐蚀性腐蚀效应的装置和方法
公开(公告)号：WO03007348A3
公开(公告)日：2003-08-21
申请号：PCT/US0222106
申请日：2002-07-11
申请人： LAM RES CORP , BOYD JOHN M , RAVKIN MIKE , MIKHAYLICH KATRINA A
发明人： BOYD JOHN M , RAVKIN MIKE , MIKHAYLICH KATRINA A
IPC分类号： H01L21/304 , H01L21/00 , H01L21/02 , H01L21/306 , H01L21/311 , H01L21/321
CPC分类号： H01L21/02057 , H01L21/02063 , H01L21/02074 , H01L21/67028 , H01L21/67034 , Y10S134/902
摘要： A method and apparatus for controlling galvanic corrosion effects on a single-wafer cleaning system are provided. In one embodiment, a method for minimizing galvanic corrosion effects in a single-wafer cleaning system is provided. The method initiates with applying a cleaning chemistry containing corrosion inhibitors to a surface of a wafer. Then, the surface of the wafer is exposed to the cleaning chemistry for a period of time. Next, a concentration gradient at an interface of the cleaning chemistry and the surface of the wafer is refreshed. Then, a rinsing agent and a drying agent are applied simultaneously to remove the cleaning chemistry , wherein the drying agent dries the surface of the wafer prior to a concentration of the corrosion inhibitors being diluted to a level insufficient to provide corrosion protection.
摘要翻译：提供了一种用于控制对单晶片清洁系统的电偶腐蚀影响的方法和装置。在一个实施例中，提供了一种用于最小化单晶片清洁系统中的电偶腐蚀效应的方法。该方法通过将包含腐蚀抑制剂的清洁化学品施加到晶片的表面来启动。然后，将晶片的表面暴露于清洁化学品一段时间。接下来，刷新清洁化学品和晶片表面的界面处的浓度梯度。然后，同时施加漂洗剂和干燥剂以除去清洁化学品，其中干燥剂在将腐蚀抑制剂的浓度稀释至不足以提供防腐蚀的水平之前将晶片的表面干燥。

3. 发明申请

WO2008054829A3 WINE-MAKING PRESS 审中-公开
标题翻译：葡萄酒制作
公开(公告)号：WO2008054829A3
公开(公告)日：2008-12-24
申请号：PCT/US2007026461
申请日：2007-12-29
申请人： PROVINA INC , SNELL GREGORY , LORINEZ THOMAS , RAVKIN MIKE , RODGERS THURMAN , PHIPPS RICHARD
发明人： SNELL GREGORY , LORINEZ THOMAS , RAVKIN MIKE , RODGERS THURMAN , PHIPPS RICHARD
IPC分类号： B30B9/30
CPC分类号： C12G1/00 , C12G2200/31
摘要： A wine-making pressing and fermenting apparatus that contains a compression- fermentation tank and a press plate moveable relative to the bottom of the tank due to engagement of a lead screw with a nut. According to one embodiment, the nut is fixed to the press tube that extends downward from the tank cover and engages the lead screw threaded into the nut from below and driven into rotation by the motor located under the tank in the tank supporting structure. According to another embodiment, the nut is fixed to the tank tube that extends upward from the tank bottom and engages the lead screw threaded into the nut from above and driven into rotation by the motor located over the tank and supported by the tank cover. The press plate has a plurality of through openings for squeezing out the grape juice.
摘要翻译：一种制酒压榨和发酵设备，其包含压缩发酵罐和压板，其由于螺杆与螺母的接合而相对于罐的底部可移动。根据一个实施例，螺母固定到从罐盖向下延伸的压力管中，并从下方接合螺纹拧入螺母的导螺杆，并通过位于油箱支撑结构中的油箱下方的马达驱动旋转。根据另一个实施例，螺母被固定到从罐底部向上延伸的罐管，并且从上方接合螺纹拧入螺母的导螺杆，并由位于罐上方的电动机驱动旋转，并由油箱盖支撑。压板具有多个用于挤出葡萄汁的通孔。

4. 发明申请

WO2004030051A3 SYSTEM FOR SUBSTRATE PROCESSING WITH MENISCUS, VACUUM, IPA VAPOR, DRYING MANIFOLD 审中-公开
标题翻译：用于半透膜，真空，IPA蒸气，干燥歧管的基底处理系统
公开(公告)号：WO2004030051A3
公开(公告)日：2004-09-02
申请号：PCT/US0331051
申请日：2003-09-30
申请人： LAM RES CORP
发明人： WOODS CARL , GARCIA JAMES P , DE LARIOS JOHN , RAVKIN MIKE , REDEKER FRED C , NICKHOU AFSHIN
IPC分类号： H01L21/00
CPC分类号： H01L21/67051 , H01L21/67028 , H01L21/67034
摘要： An apparatus and method for processing a wafer is provided. The system and method are designed to process a surface of a wafer using a meniscus. The meniscus is controlled and is capable of being moved over the surface of the wafer to enable cleaning, rinsing, chemical processing, and drying. The apparatus can be defined using a number of configurations to enable specific processing of the wafer surface using the meniscus, and such configurations can include the use of proximity heads.
摘要翻译：提供了一种用于处理晶片的设备和方法。该系统和方法被设计成使用弯月面来处理晶片的表面。弯月面是受控制的，并且能够移动到晶片的表面上以实现清洁，冲洗，化学处理和干燥。该设备可以使用多种配置来定义，以使得能够使用弯月面对晶片表面进行特定的处理，并且这样的配置可以包括使用邻近头。

5. 发明申请

WO0124234A3 A METHOD FOR CLEANING AND TREATING A SEMICONDUCTOR WAFER AFTER CHEMICAL MECHANICAL POLISHING 审中-公开
标题翻译：一种在化学机械抛光后清洗和处理半导体波长的方法
公开(公告)号：WO0124234A3
公开(公告)日：2002-01-17
申请号：PCT/US0027139
申请日：2000-09-28
申请人： LAM RES CORP
发明人： MIKHAYLICH KATRINA A , RAVKIN MIKE
IPC分类号： C11D7/06 , C09K13/08 , C11D7/18 , C11D7/26 , C11D7/32 , C11D7/60 , C11D17/08 , H01L21/02 , H01L21/304 , H01L21/321 , H01L21/306
CPC分类号： H01L21/02074 , Y10S134/902
摘要： A method is provided for cleaning a surface of a semiconductor wafer after a CMP operation. In one example, an improved cleaning chemical (ICC) is applied to the surface of the wafer. The ICC is configured to transform a copper film on the surface of the wafer into a water soluble form. The wafer surface is scrubbed. The wafer is then rinsed with a liquid. The scrubbing and the rinsing are configured to remove a controlled amount of the water soluble copper from the surface of the wafer and the brush, wherein the applying, the scrubbing, and the rinsing are performed in a brush box.
摘要翻译：提供了一种在CMP操作之后清洁半导体晶片的表面的方法。在一个示例中，将改进的清洁化学品（ICC）施加到晶片的表面。 ICC被配置为将晶片表面上的铜膜转化成水溶性形式。晶片表面被擦洗。然后用液体冲洗晶片。洗涤和冲洗被配置为从晶片和刷子的表面去除受控量的水溶性铜，其中施加，洗涤和漂洗在刷盒中进行。

6. 发明申请

WO2004030052A2 METHOD AND APPARATUS FOR DRYING SEMICONDUCTOR WAFER SURFACES USING A PLURALITY OF INLETS AND OUTLETS HELD IN CLOSE PROXIMITY TO THE WAFER SURFACES 审中-公开
标题翻译：使用多个进入晶圆表面的入口和出口来干燥半导体晶片表面的方法和设备
公开(公告)号：WO2004030052A2
公开(公告)日：2004-04-08
申请号：PCT/US0331136
申请日：2003-09-30
申请人： LAM RES CORP
发明人： DE LARIOS JOHN M , GARCIA JAMES P , WOODS CARL , RAVKIN MIKE , REDEKER FRITZ , BOYD JOHN , NICKHOU AFSHIN
IPC分类号： H01L21/00
CPC分类号： H01L21/67051 , H01L21/67028 , H01L21/67034
摘要： One of many embodiments of a substrate preparation system is provided which includes a head having a head surface where the head surface is proximate to a surface of the substrate. The system also includes a first conduit for delivering a first fluid to the surface of the substrate through the head, and a second conduit for delivering a second fluid to the surface of the substrate through the head, where the second fluid is different than the first fluid. The system also includes a third conduit for removing each of the first fluid and the second fluid from the surface of the substrate where the first conduit, the second conduit and the third conduit act substantially simultaneously. In an alternative embodiment, a method for processing a substrate is provided that includes generating a fluid meniscus on a surface of the substrate and applying acoustic energy to the fluid meniscus. The method also includes moving the fluid meniscus over the surface the substrate to process the surface of the substrate.
摘要翻译：提供了衬底制备系统的许多实施例之一，其包括具有头表面的头部，其中头部表面靠近衬底的表面。该系统还包括用于通过头部将第一流体输送至基底表面的第一导管以及用于通过头部将第二流体输送至基底表面的第二导管，其中第二流体不同于第一流体流体。该系统还包括第三管道，用于从第一管道，第二管道和第三管道基本同时起作用的衬底表面去除第一流体和第二流体中的每一个。在替代实施例中，提供了一种用于处理基板的方法，其包括在基板的表面上产生流体弯月面并且将声能施加到流体弯月面。该方法还包括将流体弯月面移动到衬底的表面上以处理衬底的表面。

7. 发明申请

WO0172430A3 DRIP MANIFOLD FOR UNIFORM CHEMICAL DELIVERY 审中-公开
公开(公告)号：WO0172430A3
公开(公告)日：2002-03-07
申请号：PCT/US0109823
申请日：2001-03-27
申请人： LAM RES CORP
发明人： ANDERSON DON E , MIKHAYLICH KATRINA A , RAVKIN MIKE , DELARIOS JOHN M
IPC分类号： B05B1/02 , B05B1/20 , B08B1/04 , B08B3/04 , H01L21/00 , H01L21/304
CPC分类号： H01L21/67051 , B08B1/04 , B08B3/04 , Y10S134/902 , Y10S239/19
摘要： A drip manifold (220) having drip nozzles (200) configured to form controlled droplets (204a) is provided for use in wafer cleaning systems (120). The drip manifold (220) includes a plurality of drip nozzles (200) that are secured to the drip manifold (220). Each of the plurality of drip nozzles (200) has a passage (205) defined between a first end (201a) and a second end (201b). A sapphire orifice (202) is defined within the passage (205) and is located at the first end (201a) of the drip nozzle (200). The sapphire orifice (202) is angled to produce a fluid stream that is reflected within the passage (205) and toward the second end (201b) to form one or more uniform drops (204a) over a brush (300).
摘要翻译：设置有用于形成受控液滴（204a）的具有滴水嘴（200）的滴水歧管（220）用于晶片清洁系统（120）。滴水歧管（220）包括固定在滴水歧管（220）上的多个滴水嘴（200）。多个滴水喷嘴（200）中的每一个具有限定在第一端（201a）和第二端（201b）之间的通道（205）。蓝宝石孔口（202）被限定在通道（205）内并且位于滴水嘴（200）的第一端（201a）处。蓝宝石孔口（202）成角度以产生在通道（205）内反射并朝向第二端（201b）反射的流体流，以在刷子（300）上方形成一个或多个均匀的液滴（204a）。

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