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1. 发明申请

WO2008017050A9 SMART COMPONENT-BASED MANAGEMENT TECHNIQUES IN A SUBSTRATE PROCESSING SYSTEM 审中-公开
标题翻译：基于智能组件的基础处理系统管理技术
公开(公告)号：WO2008017050A9
公开(公告)日：2008-03-20
申请号：PCT/US2007075113
申请日：2007-08-02
申请人： LAM RES CORP , BENJAMIN NEIL , GOTTSCHO RICHARD ALAN , BRIGHT NICOLAS , STEGER ROBERT
发明人： BENJAMIN NEIL , GOTTSCHO RICHARD ALAN , BRIGHT NICOLAS , STEGER ROBERT
IPC分类号： G06F19/00
CPC分类号： G06Q10/06 , G05B2219/31291 , G05B2219/31421 , G05B2219/45031 , Y02P90/10
摘要： A method of component management in a substrate processing system is disclosed. The substrate processing system has a set of components, at least a plurality of components of the set of components being designated to be smart components, each component of the plurality of components having an intelligent component enhancement (ICE). The method includes querying the plurality of components to request their respective unique identification data from their respective ICEs. The method further includes receiving unique identification data from the plurality of components if any of the plurality of components responds to the querying. The method additionally includes flagging the first component for corrective action if a first component of the plurality of components fails to provide first component unique identification data when the first component identification data is expected.
摘要翻译：公开了一种衬底处理系统中的部件管理方法。衬底处理系统具有一组组件，该组组件中的至少多个组件被指定为智能组件，该多个组件中的每个组件具有智能组件增强（ICE）。该方法包括查询多个组件以从它们各自的ICE请求它们各自的唯一标识数据。该方法还包括如果多个组件中的任何组件响应于查询，则从多个组件接收唯一标识数据。该方法还包括如果多个部件中的第一部件在预期第一部件识别数据时未能提供第一部件唯一识别数据，则标记第一部件以进行纠正动作。

2. 发明申请

WO2008017050A3 SMART COMPONENT-BASED MANAGEMENT TECHNIQUES IN A SUBSTRATE PROCESSING SYSTEM 审中-公开
标题翻译：基于组件的管理技术在基板处理系统中的应用
公开(公告)号：WO2008017050A3
公开(公告)日：2008-10-30
申请号：PCT/US2007075113
申请日：2007-08-02
申请人： LAM RES CORP , BENJAMIN NEIL , GOTTSCHO RICHARD ALAN , BRIGHT NICOLAS , STEGER ROBERT
发明人： BENJAMIN NEIL , GOTTSCHO RICHARD ALAN , BRIGHT NICOLAS , STEGER ROBERT
IPC分类号： G06F19/00
CPC分类号： G06Q10/06 , G05B2219/31291 , G05B2219/31421 , G05B2219/45031 , Y02P90/10
摘要： A method of component management in a substrate processing system is disclosed. The substrate processing system has a set of components, at least a plurality of components of the set of components being designated to be smart components, each component of the plurality of components having an intelligent component enhancement (ICE). The method includes querying the plurality of components to request their respective unique identification data from their respective ICEs. The method further includes receiving unique identification data from the plurality of components if any of the plurality of components responds to the querying. The method additionally includes flagging the first component for corrective action if a first component of the plurality of components fails to provide first component unique identification data when the first component identification data is expected.
摘要翻译：公开了一种基板处理系统中的部件管理方法。衬底处理系统具有一组组件，该组组件中的至少多个组件被指定为智能组件，多个组件的每个组件具有智能组件增强（ICE）。该方法包括查询多个组件以从它们各自的ICE请求它们各自的唯一标识数据。该方法还包括如果多个组件中的任何组件响应于查询，则从多个组件接收唯一的标识数据。该方法另外包括：如果在预期第一组件识别数据时多个组件的第一组件不能提供第一组件唯一标识数据，则标记第一组件以用于校正动作。

3. 发明申请

WO2005028994A3 SYSTEM AND METHOD FOR INTEGRATED MULTI-USE OPTICAL ALIGNMENT 审中-公开
标题翻译：用于集成多用途光学对准的系统和方法
公开(公告)号：WO2005028994A3
公开(公告)日：2005-05-19
申请号：PCT/US2004025517
申请日：2004-08-05
申请人： LAM RES CORP , PERRY ANDREW , STEGER ROBERT , BENJAMIN NEIL
发明人： PERRY ANDREW , STEGER ROBERT , BENJAMIN NEIL
IPC分类号： G01C1/00 , H01L21/68 , H01L21/00
CPC分类号： G01C1/00 , H01J2237/30438 , H01L21/681
摘要： An optical alignment system for use in a semiconductor processing system is provided. The optical alignment system includes a wafer chuck that has an alignment feature integrated into the top surface of the wafer chuck. In addition, a beam-forming system, which is capable of emitting an optical signal onto the alignment feature, is disposed above the wafer chuck. Also, a detector in included that can detect an amplitude of the optical signal emitted onto the alignment feature. In one aspect, the alignment feature can be a reflective alignment feature that reflects a portion of the optical signal back to the beam detector. In additional aspect, the alignment feature can be a transmittance alignment feature capable of allowing a portion of the optical signal to pass through the wafer chuck to the detector. In this aspect, the detector can be disposed below the wafer chuck.
摘要翻译：提供了一种用于半导体处理系统的光学对准系统。该光学对准系统包括晶片卡盘，该晶片卡盘具有集成在晶片卡盘的顶表面中的对准特征。另外，能够将光信号发射到对准特征上的光束形成系统设置在晶片卡盘上方。另外，包括的检测器可以检测发射到对准特征上的光信号的幅度。在一个方面，对准特征可以是将光信号的一部分反射回光束检测器的反射对准特征。在另外的方面中，对准特征可以是能够允许一部分光信号通过晶片卡盘到达检测器的透射比对特征。在这方面，检测器可以设置在晶片卡盘下方。

4. 发明申请

WO2006068805A9 METHOD AND APPARATUS FOR CONTROLLING SPATIAL TEMPERATURE DISTRIBUTION 审中-公开
标题翻译：用于控制空间温度分布的方法和装置
公开(公告)号：WO2006068805A9
公开(公告)日：2006-08-24
申请号：PCT/US2005043801
申请日：2005-12-01
申请人： LAM RES CORP , BENJAMIN NEIL , STEGER ROBERT J
发明人： BENJAMIN NEIL , STEGER ROBERT J
IPC分类号： C23F4/00 , H01L21/683 , H01L21/00 , H01L21/02 , H01L21/3065
CPC分类号： H01L21/67248 , H01J37/32724 , H01J2237/2001 , H01J2237/334 , H01L21/67069 , H01L21/67103 , H01L21/6833 , H01L21/68714
摘要： A chuck for a plasma processor comprises a temperature-controlled base, a thermal insulator, a flat support, and a heater. The temperature-controlled base is controlled in operation a temperature below the desired temperature of a workpiece. The thermal insulator is disposed over at least a portion of the temperature-controlled base. The flat support holds a workpiece and is disposed over the thermal insulator. A heater is embedded within the flat support and/or mounted to an underside of the flat support. The heater includes a plurality of heating elements that heat a plurality of corresponding heating zones. The power supplied and/or temperature of each heating element is controlled independently. The heater and flat support have a combined temperature rate change of at least 1°C per second.
摘要翻译：用于等离子体处理器的卡盘包括温度控制的基座，绝热体，平坦的支架和加热器。温度控制的基座在工作温度下控制在低于工件所需温度的温度。热绝缘体设置在温度受控基底的至少一部分上。平面支撑件保持工件并且设置在绝热体上方。加热器嵌入在平坦支撑件内和/或安装到平坦支撑件的下侧。加热器包括加热多个相应的加热区域的多个加热元件。每个加热元件的供电功率和/或温度独立地被控制。加热器和平坦支架的组合温度变化率每秒至少为1°C。

5. 发明申请

WO2009006151A3 ARRAYS OF INDUCTIVE ELEMENTS FOR MINIMIZING RADIAL NON-UNIFORMITY IN PLASMA 审中-公开
标题翻译：用于最小化等离子体中的径向非均匀性的感应元件阵列
公开(公告)号：WO2009006151A3
公开(公告)日：2009-03-05
申请号：PCT/US2008068154
申请日：2008-06-25
申请人： LAM RES CORP , BENJAMIN NEIL
发明人： BENJAMIN NEIL
IPC分类号： H01L21/3065
CPC分类号： H01J37/321
摘要： An arrangement for enabling local control of power delivery within a plasma processing system having a plasma processing chamber during processing of a substrate is provided. The arrangement includes a dielectric window and an inductive arrangement. The inductive arrangement is disposed above the dielectric window to enable power to couple with a plasma in the plasma processing system. The inductive arrangement includes a set of inductive elements, which provides the local control of power delivery to create a substantially uniform plasma in the plasma processing chamber.
摘要翻译：提供了一种用于在处理衬底期间能够在具有等离子体处理室的等离子体处理系统内对功率输送进行局部控制的装置。该布置包括电介质窗口和电感布置。感应装置设置在介电窗口上方以使功率能够与等离子体处理系统中的等离子体耦合。感应装置包括一组感应元件，其提供功率输送的局部控制以在等离子体处理室中产生基本均匀的等离子体。

6. 发明申请

WO03034463A3 TUNABLE MULTI-ZONE GAS INJECTION SYSTEM 审中-公开
标题翻译：可控多区域气体注入系统
公开(公告)号：WO03034463A3
公开(公告)日：2003-06-19
申请号：PCT/US0232057
申请日：2002-10-09
申请人： LAM RES CORP , COOPERBERG DAVID J , VAHEDI VAHID , RATTO DOUGLAS , SINGH HARMEET , BENJAMIN NEIL
发明人： COOPERBERG DAVID J , VAHEDI VAHID , RATTO DOUGLAS , SINGH HARMEET , BENJAMIN NEIL
IPC分类号： H05H1/46 , C23C16/44 , C23C16/455 , C23C16/507 , C23F4/00 , H01J37/32 , H01L21/205 , H01L21/3065 , C23C16/50
CPC分类号： C23C16/45574 , C23C16/507 , H01J37/321 , H01J37/3244 , H01J2237/3323 , H01J2237/3344
摘要： A tunable multi-zone injection system for a plasma processing system for plasma processing of substrates (13) such as semiconductor wafers. The system includes a plasma processing chamber (10), a substrate support (16) for supporting a substrate within the processing chamber, a dielectric member (20) having an interior surface facing the substrate support, the dielectric member forming a wall of the processing chamber, a gas injector (22) fixed to part of or removably mounted in an opening in the dielectric window, the gas injector including a plurality of gas outlets supplying process gas at adjustable flow rates to multiple zones of the chamber, and an RF energy source (19) such as a planar or non-planar spiral coil (18) which inductively couples RF energy through the dielectric member and into the chamber to energize the process gas into a plasma state. The injector can include an on-axis outlet supplying process gas at a first flow rate to a central zone and off-axis outlets supplying the same process gas at a second flow rate to an annular zone surrounding the central zone. The arrangement permits modification of gas delivery to meet the needs of a particular processing regime by allowing independent adjustment of the gas flow to multiple zones in the chamber. In addition, compared to consumable showerhead arrangements, a removably mounted gas injector can be replaced more easily and economically.
摘要翻译：一种用于等离子体处理系统的可调多区域注入系统，用于诸如半导体晶片的衬底（13）的等离子体处理。该系统包括等离子体处理室（10），用于在处理室内支撑衬底的衬底支撑件（16），具有面向衬底支撑件的内表面的电介质构件（20），该电介质构件形成处理壁腔室，固定到电介质窗口中的开口的一部分或可移除地安装在介电窗口中的开口中的气体注入器（22），气体注射器包括多个气体出口，其以可调节的流量向腔室的多个区域提供处理气体，并且RF能量源极（19），例如平面或非平面螺旋线圈（18），其将RF能量通过电介质构件感应耦合并进入腔室，以将处理气体激励成等离子体状态。喷射器可以包括轴向出口，其以第一流量向中心区域供应处理气体，并且离轴出口以相同的处理气体以第二流量供应到围绕中心区域的环形区域。该装置允许气体输送的修改以通过允许独立调节气体流到腔室中的多个区域来满足特定处理状态的需要。此外，与消耗式喷头装置相比，可以更容易且经济地更换可移除安装的气体喷射器。

7. 发明申请

WO2011049620A3 HEATING PLATE WITH PLANAR HEATER ZONES FOR SEMICONDUCTOR PROCESSING 审中-公开
标题翻译：带有平面加热区的加热板用于半导体加工
公开(公告)号：WO2011049620A3
公开(公告)日：2011-11-03
申请号：PCT/US2010002794
申请日：2010-10-20
申请人： LAM RES CORP , SINGH HARMEET , GAFF KEITH , BENJAMIN NEIL , COMENDANT KEITH
发明人： SINGH HARMEET , GAFF KEITH , BENJAMIN NEIL , COMENDANT KEITH
IPC分类号： H01L21/68
CPC分类号： H01L21/67103 , C23C14/50 , C23C14/541 , C23C16/4586 , C23C16/46 , C23C16/509 , H01J37/32091 , H01J37/32724 , H01J2237/327 , H01J2237/332 , H01J2237/3321 , H01J2237/3323 , H01J2237/334 , H01J2237/3342 , H01J2237/3343 , H01L21/02274 , H01L21/0262 , H01L21/28556 , H01L21/3065 , H01L21/31116 , H01L21/31138 , H01L21/32136 , H01L21/67109 , H01L21/67248 , H01L21/6831 , H05B1/0233 , H05B3/00 , H05B3/26 , Y10T29/49083 , Y10T29/49099
摘要： A heating plate for a substrate support assembly in a semiconductor plasma processing apparatus, comprises multiple independently controllable planar heater zones arranged in a scalable multiplexing layout, and electronics to independently control and power the planar heater zones. A substrate support assembly in which the heating plate is incorporated includes an electrostatic clamping electrode and a temperature controlled base plate. Methods for manufacturing the heating plate include bonding together ceramic or polymer sheets having planar heater zones, power supply lines, power return lines and vias.
摘要翻译：用于半导体等离子体处理设备中的基板支撑组件的加热板包括以可缩放多路复用布局布置的多个独立可控的平面加热器区域以及用于独立地控制和驱动平面加热器区域的电子设备。其中结合有加热板的基板支撑组件包括静电夹持电极和温控基板。用于制造加热板的方法包括将具有平面加热器区域的陶瓷或聚合物片，电源线，电力返回线和过孔接合在一起。

8. 发明申请

WO2009006147A3 INTEGRATED STEERABILITY ARRAY ARRANGEMENT FOR MINIMIZING NON-UNIFORMITY 审中-公开
标题翻译：集成可控性阵列安排，以最小化非均匀性
公开(公告)号：WO2009006147A3
公开(公告)日：2009-02-19
申请号：PCT/US2008068144
申请日：2008-06-25
申请人： LAM RES CORP , BENJAMIN NEIL
发明人： BENJAMIN NEIL
IPC分类号： H01L21/3065
CPC分类号： H05H1/46 , C23C16/45563 , C23C16/505 , C23C16/509 , C23C16/52 , H01J37/32366 , H01J37/3244 , H01J37/32449 , H01J37/32834
摘要： An integrated steerability array arrangement for managing plasma uniformity within a plasma processing environment to facilitate processing of a substrate is provided. The arrangement includes an array of electrical elements. The arrangement also includes an array of gas injectors, wherein the array of electrical elements and the array of gas injectors are arranged to create a plurality of plasma regions, each plasma region of the plurality of plasma regions being substantially similar. The arrangement further includes an array of pumps, wherein individual one of the array of pumps being interspersed among the array of electrical elements and the array of gas injectors. The array of pumps is configured to facilitate local removal of gas exhaust to maintain a uniform plasma region within the plasma processing environment.
摘要翻译：提供了一种用于管理等离子体处理环境中的等离子体均匀性以便于衬底处理的集成可控性阵列布置。该装置包括一组电气元件。该布置还包括气体喷射器阵列，其中电气元件阵列和气体喷射器阵列被布置成产生多个等离子体区域，多个等离子体区域中的每个等离子体区域基本相似。该装置还包括一组泵，其中泵阵列中的单独一个泵散布在电气元件阵列和气体喷射器阵列之间。泵的阵列被配置为便于局部去除气体排气以在等离子体处理环境内保持均匀的等离子体区域。

9. 发明申请

WO03003449A2 CERAMIC ELECTROSTATIC CHUCK ASSEMBLY AND METHOD OF MAKING 审中-公开
标题翻译：陶瓷静电块组件及其制造方法
公开(公告)号：WO03003449A2
公开(公告)日：2003-01-09
申请号：PCT/US0218093
申请日：2002-06-10
申请人： LAM RES CORP , NAKAJIMA SHU , BENJAMIN NEIL
发明人： NAKAJIMA SHU , BENJAMIN NEIL
IPC分类号： H01L21/3065 , H01L21/683 , H02N13/00 , H01L21/68
CPC分类号： H01L21/6833
摘要： A sintered ceramic electrostatic chucking device (ESC) which includes a patterned electrostatic clamping electrode embedded in a ceramic body wherein the clamping electrode includes at least one strip of a sintered electrically conductive material arranged in a fine pattern. Due to the fineness of the electrode pattern employed, stresses induced during manufacture of the ESC are reduced such that the clamping electrode remains substantially planar after the sintering operation. The resulting ESC allows for improved clamping uniformity. Another ESC includes an insulating or semi-conducting body and a clamping electrode having a high resistivity and or a high lateral impedance. The electrostatic chucking device provides improved RF coupling uniformity when RF energy is coupled thorough the clamping electrode from an underlying RF electrode. The RF electrode can be a separate baseplate or it can be a part of the chuck. The ESC's may be used to support semiconductor substrates such as semiconductor wafers in plasma processing equipment.
摘要翻译：一种烧结陶瓷静电夹持装置（ESC），其包括嵌入在陶瓷体中的图案化静电夹持电极，其中所述夹持电极包括布置成精细图案的至少一个烧结导电材料条。由于所使用的电极图案的细度，ESC制造期间引起的应力减小，使得夹紧电极在烧结操作之后保持基本平坦。所得的ESC允许改进的夹紧均匀性。另一个ESC包括绝缘或半导电体和具有高电阻率或高横向阻抗的夹持电极。当RF能量通过来自底层RF电极的钳位电极耦合时，静电夹持装置提供改进的RF耦合均匀性。 RF电极可以是单独的基板，也可以是卡盘的一部分。 ESC可用于支持诸如等离子体处理设备中的半导体晶片的半导体衬底。

10. 发明申请

WO03026364A8 PLASMA PROCESSOR COIL 审中-公开
标题翻译：等离子处理器线圈
公开(公告)号：WO03026364A8
公开(公告)日：2004-01-15
申请号：PCT/US0229223
申请日：2002-09-16
申请人： LAM RES CORP
发明人： BENJAMIN NEIL , COOPERBERG DAVID
IPC分类号： H05H1/46 , H01J37/32
CPC分类号： H05H1/46 , H01J37/321
摘要： A plasma processor coil can include a shorting turn ohmically or only reactively coupled to plural multi-turn, co-planar, interleaved spiral, parallel connected windings. A separate capacitor can be associated with each winding to shunt current from one portion of that winding to another portion of the winding. The spacing between adjacent turns of peripheral portions of each winding can differ from the spacing between adjacent turns of interior portions of each winding. The coil can have a length that is short relative to the wavelength of RF excitation for the coil.
摘要翻译：等离子体处理器线圈可以包括欧姆地或仅反应地耦合到多个多匝，共面，交错的螺旋，并联的绕组的短路匝。单独的电容器可以与每个绕组相关联以将电流从该绕组的一部分分流到绕组的另一部分。每个绕组的周边部分的相邻匝之间的间隔可以不同于每个绕组的内部部分的相邻匝间的间隔。线圈可以具有相对于线圈的RF激励波长短的长度。

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