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1. 发明申请

WO2006097875A1 METHOD OF PRODUCING A COMPONENT WITH A SURFACE STRUCTURE, CERAMIC COMPONENT AND APPLICATION OF SUCH A METHOD 审中-公开
标题翻译：用表面结构生产组分的方法，陶瓷组分及其应用
公开(公告)号：WO2006097875A1
公开(公告)日：2006-09-21
申请号：PCT/IB2006/050751
申请日：2006-03-10
申请人： KONINKLIJKE PHILIPS ELECTRONICS N.V. , VERSCHUUREN, Marcus, A. , DE GRAAF, Jan , KOP, Theo, A.
发明人： VERSCHUUREN, Marcus, A. , DE GRAAF, Jan , KOP, Theo, A.
IPC分类号： B28B1/26 , B22F3/22
CPC分类号： B28B1/44 , B28B1/26 , Y10T428/31
摘要： A method of producing a component with a surface structure (4) includes providing a suspension of particles susceptible to sintering in a liquid medium, providing a stamp element (2) having a structured surface (7) provided with a negative imprint of at least a part of the surface structure (4), providing a mould (1) including a receptacle (5), introducing a quantity of the suspension (6) in the receptacle (5), and applying the structured surface (7) of the stamp element (2) to the suspension in the receptacle. The receptacle of the mould has least one porous wall (8,9). The structured surface (7) of the stamp element (2) is applied whilst at least part of the liquid medium is drained through the porous wall(s) (8,9)
摘要翻译：一种制备具有表面结构（4）的组分的方法包括提供易于在液体介质中烧结的颗粒的悬浮液，提供具有结构化表面（7）的印模元件（2），所述结构化表面（7）具有至少一个提供表面结构（4）的一部分，提供包括容器（5）的模具（1），将一定量的悬浮液（6）引入容器（5）中，并且将印模元件的结构化表面（7）（2）到容器中的悬架。模具的容器具有至少一个多孔壁（8,9）。施加印模元件（2）的结构化表面（7），同时至少部分液体介质通过多孔壁（8,9）排出，

2. 发明申请

WO2006126123A1 ILLUMINATION SYSTEM WITH LEDS 审中-公开
标题翻译： LED照明系统
公开(公告)号：WO2006126123A1
公开(公告)日：2006-11-30
申请号：PCT/IB2006/051474
申请日：2006-05-10
申请人： KONINKLIJKE PHILIPS ELECTRONICS N.V. , WOLF, Ronald, M. , DE GRAAF, Jan , VAN SPRANG, Hans , VERSCHUUREN, Marcus, A. , KOP, Theo, A.
发明人： WOLF, Ronald, M. , DE GRAAF, Jan , VAN SPRANG, Hans , VERSCHUUREN, Marcus, A. , KOP, Theo, A.
IPC分类号： H01L33/00
CPC分类号： H01L33/641 , H01L33/58 , H01L2224/48091 , H01L2224/73265 , H01L2924/00014
摘要： An illumination system has a plurality of light-emitting diode chips (R, G, B). Each light-emitting diode chip comprises a LED substrate (2) provided with a light-emitting layer (1) for emitting light. The LED chips are arranged on an optical substrate (10) with pre¬ determined optical properties. The light-emitting layer of the LEDs faces the optical substrate. Light emitted by the at least one light-emitting diode chip is being emitted via a light-egress window (11) facing away from light-emitting layer. The optical substrate comprises a heat-spreading means. Preferably, the optical substrate comprises a translucent polycrystalline ceramic material acting as heat-spreading means. Preferably, the heat- spreading means comprises a metallization layer (16) and/or a heat sink (17) applied at a side of the optical substrate facing away from the light-egress window. Preferably, the LEDs are embedded in the optical substrate.
摘要翻译：照明系统具有多个发光二极管芯片（R，G，B）。每个发光二极管芯片包括设置有用于发光的发光层（1）的LED基板（2）。 LED芯片被布置在具有预定光学特性的光学基板（10）上。 LED的发光层面向光学基板。由至少一个发光二极管芯片发射的光通过面向远离发光层的出光窗口（11）发射。光学基板包括散热装置。优选地，光学基板包括作为热扩散装置的半透明多晶陶瓷材料。优选地，散热装置包括金属化层（16）和/或散热器（17），该散热器（17）被施加在远离光出口的光学基板的一侧。优选地，LED嵌入在光学基板中。

3. 发明申请

WO2006114726A2 A COOLING DEVICE FOR A LIGHT-EMITTING SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING SUCH A COOLING DEVICE 审中-公开
标题翻译：用于发光半导体器件的冷却装置和制造这种冷却装置的方法
公开(公告)号：WO2006114726A2
公开(公告)日：2006-11-02
申请号：PCT/IB2006/051206
申请日：2006-04-19
申请人： KONINKLIJKE PHILIPS ELECTRONICS N.V. , DE GRAAF, Jan , NICOLE, Céline, C., S. , VERSCHUUREN, Marcus, A. , VAN SPRANG, Hans , KOP, Theo, A. , MARRA, Johan , WOLF, Ronald, M.
发明人： DE GRAAF, Jan , NICOLE, Céline, C., S. , VERSCHUUREN, Marcus, A. , VAN SPRANG, Hans , KOP, Theo, A. , MARRA, Johan , WOLF, Ronald, M.
IPC分类号： H01L33/00
CPC分类号： F28D15/0233 , F28D15/0266 , F28D15/043 , F28D2021/0029 , F28F3/12 , F28F21/04 , H01L33/50 , H01L33/641 , H01L33/648
摘要： A cooling device for cooling a light-emitting semiconductor device, such as a LED device (20), comprises a ceramic plate (15) having coolant-conveying channels (12) incorporated therein. The ceramic plate (15) is adapted for forming an integral part of the optical system of the light-emitting semiconductor device (20) and to cool a light-emitting portion (26) of the light-emitting semiconductor device (20). A method of forming a cooling device comprises the steps of forming a charge of ceramic particles, embossing the charge with a stamp to form coolant-conveying channels in the charge, hardening the charge, and providing a cover on top of the channels to seal them.
摘要翻译：用于冷却诸如LED装置（20）的发光半导体装置的冷却装置包括其中结合有冷却剂输送通道（12）的陶瓷板（15）。陶瓷板（15）适于形成发光半导体器件（20）的光学系统的一体部分并冷却发光半导体器件（20）的发光部分（26）。形成冷却装置的方法包括以下步骤：形成陶瓷颗粒的电荷，用印模压印电荷以在电荷中形成冷却剂输送通道，使电荷硬化，以及在通道的顶部上提供盖以将它们密封。

4. 发明申请

WO2006087651A2 LIGHT EMITTING DEVICE COMPRISING INORGANIC LIGHT EMITTING DIODE(S) 审中-公开
标题翻译：包含无机发光二极管的发光装置（S）
公开(公告)号：WO2006087651A2
公开(公告)日：2006-08-24
申请号：PCT/IB2006/050393
申请日：2006-02-07
申请人： KONINKLIJKE PHILIPS ELECTRONICS N.V. , DE GRAAF, Jan , VAN SPRANG, Hans , VERSCHUUREN, Marcus, A.
发明人： DE GRAAF, Jan , VAN SPRANG, Hans , VERSCHUUREN, Marcus, A.
IPC分类号： H01L33/00
CPC分类号： H01L33/505 , H01L25/0753 , H01L33/44 , H01L33/58 , H01L2924/0002 , H01L2933/0091 , H01L2924/00
摘要： The present invention relates to a light emitting device (10) comprising at least one inorganic light emitting diode (LED) (14) for emitting primary light, a luminescent plate (12) supporting on a first side the LED(s), which plate is adapted to convert the wavelength of at least part of said primary light from the LED(s), and light scattering means for coupling out light from the luminescent plate. The invention makes it possible to omit any bulky extraction optics, and allows for a flat and compact LED module design. The present invention also relates to a method for the manufacture of such a light emitting device.
摘要翻译：本发明涉及一种发光器件（10），其包括用于发射初级光的至少一个无机发光二极管（LED）（14），支撑在第一侧上的发光板（12）（一个或多个）LED，该板适于转换来自LED的至少部分所述初级光的波长，以及用于耦合出来自发光板的光的光散射装置。本发明使得可以省略任何庞大的提取光学器件，并且允许扁平且紧凑的LED模块设计。本发明还涉及制造这种发光器件的方法。

5. 发明申请

WO2008018003A2 NANOPARTICLE BASED INORGANIC BONDING MATERIAL 审中-公开
标题翻译：纳米粒子基无机结合材料
公开(公告)号：WO2008018003A2
公开(公告)日：2008-02-14
申请号：PCT/IB2007/053084
申请日：2007-08-06
申请人： KONINKLIJKE PHILIPS ELECTRONICS N.V. , POPOVICI, Mihaela-Ioana , VERSCHUUREN, Marcus, A. , KLEYNEN, Christian , DE GRAAF, Jan
发明人： POPOVICI, Mihaela-Ioana , VERSCHUUREN, Marcus, A. , KLEYNEN, Christian , DE GRAAF, Jan
IPC分类号： H01L33/00
CPC分类号： H01L33/58 , H01L27/15 , H01L33/44
摘要： A method for the production of a light emitting device is provided, comprising providing at least one LED (10) and at least one optical element (13); arranging a bonding material (12), comprising a stable colloidal sol of inorganic metal oxide nanoparticles dispersed in a liquid medium, on a light emitting surface (11) of said at least one LED and/or on a surface of said at least one optical element (13); (c) placing said at least one optical element (13) on the light emitting surface (11) of said at least one LED (10) with said bonding material (12) there between to form at least one assembly; and curing said bonding material to form an inorganic bond. The bonding material may be cured at temperatures not detrimental to the LED, while the resulting bond is photo -thermally stable.
摘要翻译：提供了一种用于制造发光器件的方法，其包括提供至少一个LED（10）和至少一个光学元件（13）; 在所述至少一个LED的发光表面（11）上和/或在所述至少一个光学元件的表面上布置包括分散在液体介质中的无机金属氧化物纳米颗粒的稳定胶态溶胶的结合材料（12）元素（13）; （c）将所述至少一个光学元件（13）放置在所述至少一个LED（10）的发光表面（11）上，其间具有所述结合材料（12）以形成至少一个组件; 并固化所述结合材料以形成无机结合。键合材料可以在不会对LED有害的温度下固化，而所产生的键合是光热稳定的。

6. 发明申请

WO2006109261A1 LIGHT-EMITTING DEVICE 审中-公开
标题翻译：发光装置
公开(公告)号：WO2006109261A1
公开(公告)日：2006-10-19
申请号：PCT/IB2006/051128
申请日：2006-04-12
申请人： KONINKLIJKE PHILIPS ELECTRONICS N.V. , VERSCHUUREN, Marcus, A. , PEETERS, Martinus, P., J. , KEURSTEN, Theodora, A., P., M. , DE GRAAF, Jan
发明人： VERSCHUUREN, Marcus, A. , PEETERS, Martinus, P., J. , KEURSTEN, Theodora, A., P., M. , DE GRAAF, Jan
IPC分类号： H01L33/00
CPC分类号： H01L33/58 , Y10T156/10
摘要： The present invention relates to a light-emitting device comprising at least one light-emitting diode (LED) chip (12), and an inorganic optical element (14) being connected to the chip(s) by means of a bond (16). The light-emitting device is characterized in that the bond is of a bonding material comprising a matrix including silicon and oxygen atoms with hydrocarbon groups directly bonded to at least a fraction of the silicon atoms. Such inorganic-organic bonding material has very high photo and thermal stability. As a result, high power and high lumen LED chips can be deployed, whereby high brightness light- emitting devices can be realized. The present invention also relates to a method for the manufacture of such light-emitting device.
摘要翻译：本发明涉及包括至少一个发光二极管（LED）芯片（12）的发光器件和通过键（16）连接到芯片的无机光学元件（14）。该发光装置的特征在于该键是由包括硅和氧原子的基体的键合材料，其中烃基直接键合至至少一部分硅原子。这种无机 - 有机键合材料具有非常高的光和热稳定性。结果，可以部署高功率和高流明LED芯片，由此可以实现高亮度发光装置。本发明还涉及制造这种发光装置的方法。

7. 发明申请

WO2007138502A2 INORGANIC PHOSPHOR BODIES FOR LIGHT EMITTING DIODES 审中-公开
标题翻译：无机磷光体用于发光二极管
公开(公告)号：WO2007138502A2
公开(公告)日：2007-12-06
申请号：PCT/IB2007/051738
申请日：2007-05-09
申请人： KONINKLIJKE PHILIPS ELECTRONICS N.V. , VERSCHUUREN, Marcus, A. , PEETERS, Martinus, P., J. , DE GRAAF, Jan , VISSER, Cornelis, G. , HENDRIKS, Rene J. , BRUNNER, Klemens
发明人： VERSCHUUREN, Marcus, A. , PEETERS, Martinus, P., J. , DE GRAAF, Jan , VISSER, Cornelis, G. , HENDRIKS, Rene J. , BRUNNER, Klemens
IPC分类号： H01L33/50
CPC分类号： C09K11/02 , C09K11/08 , H01L33/505 , H01L2933/0041
摘要： An inorganic phosphor body (102) for a light emitting diode, comprising an inorganic luminescent material is provided. A bonding precursor material (103) is arranged on a surface of said inorganic phosphor body (102), and the bonding precursor material comprises an at least partly hydro lyzed organically modified silane. The attachment of the bonding precursor material to the inorganic phosphor body is separated from the bonding of the inorganic phosphor body to a light emitting diode. Thus, the attachment of the bonding precursor material to the inorganic phosphor body may be performed at conditions detrimental to the LED.
摘要翻译：提供了一种用于发光二极管的无机荧光体（102），其包括无机发光材料。接合前体材料（103）设置在所述无机荧光体（102）的表面上，并且粘合前体材料包含至少部分水解的有机改性的硅烷。将粘合前体材料附着到无机荧光体上与无机荧光体与发光二极管的接合分离。因此，可以在不利于LED的条件下进行粘结前体材料附着到无机荧光体上。

8. 发明申请

WO2009147602A2 SILICONE RUBBER MATERIAL FOR SOFT LITHOGRAPHY 审中-公开
标题翻译：硅胶橡胶材料软剥离
公开(公告)号：WO2009147602A2
公开(公告)日：2009-12-10
申请号：PCT/IB2009/052276
申请日：2009-05-29
申请人： KONINKLIJKE PHILIPS ELECTRONICS N.V. , VERSCHUUREN, Marcus, A.
发明人： VERSCHUUREN, Marcus, A.
IPC分类号： C08L83/04 , C08L83/07 , B41N1/00
CPC分类号： B29C59/02 , B29K2083/005 , B41C1/08 , B41N1/12 , B82Y10/00 , B82Y40/00 , C08G77/12 , C08G77/20 , C08G77/80 , C08L83/04 , G03F7/0002 , Y10T428/24802 , C08L83/00
摘要： The present invention relates to a silicone rubber like material and a printing device including a stamp layer (100;201) comprising such a material. The material is suitable for use in soft lithography as it enables stable features having dimensions in the nanometer range to be obtained on a substrate, and also allows for the accommodation onto rough and non-flat substrate surfaces. The invention also relates to methods for manufacturing the silicone rubber like material and stamp layer (100;201) and use thereof in lithographic processes.
摘要翻译：本发明涉及一种硅橡胶类材料和一种包括这种材料的印模层（100; 201）的印刷装置。该材料适用于软光刻，因为它能够在基板上获得具有在纳米范围内的尺寸的稳定特征，并且还允许适应于粗糙和非平坦的基板表面。本发明还涉及用于制造硅橡胶状材料和印模层（100; 201）的方法及其在光刻工艺中的应用。

9. 发明申请

WO2009115961A1 CALIBRATION CAMERA WITH SPECTRAL DEPTH 审中-公开
标题翻译：校准摄像机与光谱深度
公开(公告)号：WO2009115961A1
公开(公告)日：2009-09-24
申请号：PCT/IB2009/051042
申请日：2009-03-13
申请人： KONINKLIJKE PHILIPS ELECTRONICS N. V. , MEIJER, Eduard, J. , DE GRAAF, Jan , VERSCHUUREN, Marcus, A.
发明人： MEIJER, Eduard, J. , DE GRAAF, Jan , VERSCHUUREN, Marcus, A.
IPC分类号： G03B15/05 , G03B15/03 , H04N3/08 , H04N5/225 , H04N1/60
CPC分类号： H04N5/2256 , G03B15/05 , G03B2215/05 , G03B2215/0585 , H04N17/002
摘要： An imaging device (300), a lighting control system (400) including the imaging device (300), and a method for aligning with a reference image lighting of a site (220) illuminated by least one light source (240) are provided. The imaging device (300) and/or the lighting control system (400) include at least one processor (410) configured to control the imaging device (300) and the light source (240). The imaging device (300) has an array of reflectors (320) including selectable reflectors; a lens configured to receive image rays (330) for forming an image including pixels and provide the image rays (330) to the array of reflectors (320) for reflection as reflected rays (355); and a detector (310) configured to receive the reflected rays (355) and detect characteristics of each pixel of the image for form a resolved image. The processor (410) is further configured to sequentially select each reflector (350) of the array of reflectors (320) for reflecting the reflected rays (355) towards the detector (310).
摘要翻译：提供了一种成像设备（300），包括成像设备（300）的照明控制系统（400）和用于与由至少一个光源（240）照明的场所（220）的参考图像照明进行对准的方法。成像设备（300）和/或照明控制系统（400）包括配置成控制成像设备（300）和光源（240）的至少一个处理器（410）。成像装置（300）具有包括可选反射器的反射器阵列（320）配置为接收用于形成包括像素的图像的图像射线（330），并将所述图像射线（330）提供给所述反射器阵列（320）以作为反射射线（355）反射; 以及被配置为接收所述反射光线（355）并检测所述图像的每个像素的特征以形成分辨图像的检测器（310）。处理器（410）还被配置为顺序地选择反射器阵列（320）的每个反射器（350），以将反射光线（355）反射到检测器（310）。

10. 发明申请

WO2010035232A1 ASSEMBLY WITH ABSORBING SENSOR LAYER 审中-公开
标题翻译：组装与吸收传感器层
公开(公告)号：WO2010035232A1
公开(公告)日：2010-04-01
申请号：PCT/IB2009/054181
申请日：2009-09-24
申请人： KONINKLIJKE PHILIPS ELECTRONICS N.V. , FORCALES, Manuel , GOMEZ RIVAS, Jaime , VERSCHUUREN, Marcus, A. , GIANNINI, Vincenzo
发明人： FORCALES, Manuel , GOMEZ RIVAS, Jaime , VERSCHUUREN, Marcus, A. , GIANNINI, Vincenzo
IPC分类号： G01N21/55
CPC分类号： G01N21/552
摘要： The invention relates to an assembly for detecting the presence of a target based on a detection of a resonance associated to surface polaritons, such as long-range surface exciton polaritons (LRSEP). The invention relates to an assembly to be used in connection with a bio-sensor. The assembly comprising a carrier substrate (1) and a sensor layer (2) positioned on the carrier substrate. The sensor layer is of a material having a complex permittivity with an imaginary part being greater than or similar to the real part.
摘要翻译：本发明涉及一种用于基于与表面极化子（例如远距离表面激子极化子（LRSEP））相关联的共振的检测来检测靶的存在的组件。本发明涉及一种与生物传感器结合使用的组件。所述组件包括载体衬底（1）和位于载体衬底上的传感器层（2）。传感器层是具有复数介电常数的材料，其虚部大于或类似于实部。

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