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    • 5. 发明申请
    • METHOD AND APPARATUS FOR APPLYING A SHEET TO A SUBSTRATE
    • 将片材施用于基材的方法和设备
    • WO2008068701A2
    • 2008-06-12
    • PCT/IB2007/054888
    • 2007-12-03
    • KONINKLIJKE PHILIPS ELECTRONICS N.V.VERSCHUUREN, Marcus, A.MEGENS, Mischa
    • VERSCHUUREN, Marcus, A.MEGENS, Mischa
    • B05D1/28
    • B05D1/28B05C1/027B82Y10/00B82Y40/00G03F7/0002
    • The invention provides a method and apparatus for laminating a sheet to a substrate in a stress free and distortion-less manner. The method comprises providing the sheet and substrate such that an attractive force between them exists that is capable of bringing the sheet and surface together at least when their distance is shorter than a critical distance. The method creates these conditions by locally making an initial contact between the sheet and substrate such that at a contact front, being the boundary between areas where the substrate and sheet are in contact and those where they are not in contact, these conditions exist. In a further step the sheet and substrate are allowed to gradually make contact such that the contact front advances along either of the substrate or sheet surface therewith increasing the contacting area between the substrate and the sheet. The method is advantages when used during imprint lithography or embossing processes or other processes where feature patterns need to be transferred from the substrate to the surface or vice versa.
    • 本发明提供了一种以无应力和无变形的方式将薄片层压到衬底上的方法和设备。 该方法包括提供片材和基材,使得它们之间存在吸引力,其至少在它们的距离短于临界距离时能够将片材和表面结合在一起。 该方法通过在片材和基材之间局部地进行初始接触而产生这些条件,使得在接触前方,作为基材和片材接触的区域与它们不接触的区域之间的边界,存在这些条件。 在进一步的步骤中,允许片材和基材逐渐接触,使得接触前沿沿着基材或片材表面中的任一个前进,由此增加基材和片材之间的接触面积。 该方法在压印平版印刷或压印过程或其他特征图案需要从基片转印到表面或反过来的过程中使用时是有利的。