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1. 发明申请

WO2018128995A1 SYSTEMS AND METHODS FOR DEFECT MATERIAL CLASSIFICATION 审中-公开
公开(公告)号：WO2018128995A1
公开(公告)日：2018-07-12
申请号：PCT/US2018/012103
申请日：2018-01-02
申请人： KLA-TENCOR CORPORATION
发明人： ZHAO, Guoheng , LEONG, Jenn-Kuen , KIRK, Michael
IPC分类号： H01L21/66 , H01L21/67
摘要： A inspection system includes an illumination source to generate an illumination beam, focusing elements to direct the illumination beam to a sample, a detector, collection elements configured to direct radiation emanating from the sample to the detector, a detection mode control device to image the sample in two or more detection modes such that the detector generates two or more collection signals based on the two or more detection modes, and a controller. Radiation emanating from the sample includes at least radiation specularly reflected by the sample and radiation scattered by the sample. The controller determines defect scattering characteristics associated with radiation scattered by defects on the sample based on the two or more collection signals. The controller also classifies the one or more particles according to a set of predetermined defect classifications based on the one or more defect scattering characteristics.

2. 发明申请

WO2015175702A1 IMAGE ACQUISITION SYSTEM, IMAGE ACQUISITION METHOD, AND INSPECTION SYSTEM 审中-公开
标题翻译：图像采集系统，图像采集方法和检测系统
公开(公告)号：WO2015175702A1
公开(公告)日：2015-11-19
申请号：PCT/US2015/030634
申请日：2015-05-13
申请人： KLA-TENCOR CORPORATION
发明人： ZHAO, Guoheng , STOKOWSKI, Stanley E. , HILL, Andrew , DE GREEVE, Johan , VAN DER BURGT, Maarten , VAN GILS, Karel
IPC分类号： G01B11/25
CPC分类号： G06T7/586 , G01B11/0608 , G01B11/2513 , G01B11/2522 , G06T2207/10052 , G06T2207/20208 , H04N5/37206
摘要： The invention relates to an image acquisition system and an image acquisition method, as well as to an inspection system having at least one such image acquisition system. A projector projects a pattern on a surface of a sample, a camera records light intensity information from within at least two detection fields defined by the camera on the surface of the sample. A relative motion between the sample on the one hand and the camera and projector on the other hand is generated. From the acquired at least one image a height profile of the surface of the sample may be inferred. The pattern may comprise a number of sub-patterns related to each other by a phase shift. Alternatively, the pattern may be a fringe pattern.
摘要翻译：本发明涉及一种图像获取系统和图像获取方法，以及具有至少一个这样的图像采集系统的检查系统。投影仪在样品的表面上投影图案，照相机记录来自样品表面上由照相机限定的至少两个检测区域内的光强度信息。另一方面，生成样品与相机和投影仪之间的相对运动。从所获取的至少一个图像可以推断出样品表面的高度分布。该图案可以包括通过相移彼此相关的多个子图案。或者，图案可以是条纹图案。

3. 发明申请

WO2014164929A1 DEFECT DETECTION USING SURFACE ENHANCED ELECTRIC FIELD 审中-公开
标题翻译：使用表面增强电场的缺陷检测
公开(公告)号：WO2014164929A1
公开(公告)日：2014-10-09
申请号：PCT/US2014/023817
申请日：2014-03-11
申请人： KLA-TENCOR CORPORATION
发明人： ZHAO, Guoheng , SHORTT, David W.
IPC分类号： H01L21/027
CPC分类号： G01N21/94 , G01N21/33 , G01N21/47 , G01N21/8806 , G01N21/9501 , G01N2021/8848 , G01N2201/06113
摘要： A system and method for detecting scattered light from particles on a wafer which have been excited by an enhanced electric field induced by an evanescent wave. A solid immersion lens is positioned proximate to the wafer surface. The front flat surface of the lens is parallel to the wafer surface such that an air gap is maintained. A deep ultra violet light source emits a laser beam illuminating the surface through the solid immersion lens at the critical angle thereby generating an evanescent wave. An enhanced electric field induced by the evanescent wave is generated at the wafer surface. The air gap distance is less than the wavelength emitted by the DUV light source. The solid immersion lens is supported by a lens support. The scattered light of the particles excited by the enhanced electric field is coupled by the solid immersion lens to the far field and collected by a first and a second lenses. A detector receives the collected signal and generates a corresponding detector signal. A processor receives and analyzes the detector signal to identify defects.
摘要翻译：一种用于检测已经被ev逝波引起的增强电场激发的晶片上的颗粒的散射光的系统和方法。固体浸没透镜位于晶片表面附近。透镜的前平坦表面平行于晶片表面，从而保持气隙。深紫外光源以临界角发射通过固体浸没透镜照射表面的激光束，从而产生ev逝波。在晶片表面产生由ev逝波引起的增强电场。气隙距离小于由DUV光源发出的波长。固体浸没透镜由透镜支撑件支撑。由增强电场激发的粒子的散射光通过固体浸没透镜耦合到远场并由第一和第二透镜收集。检测器接收收集的信号并产生相应的检测器信号。处理器接收并分析检测器信号以识别缺陷。

4. 发明申请

WO2014100480A1 GENERATING AN ARRAY OF SPOTS ON INCLINED SURFACES 审中-公开
标题翻译：产生一个包含在表面上的点阵列
公开(公告)号：WO2014100480A1
公开(公告)日：2014-06-26
申请号：PCT/US2013/076695
申请日：2013-12-19
申请人： KLA-TENCOR CORPORATION
发明人： ZHAO, Guoheng
IPC分类号： G01B11/30 , G01N21/956 , G02B5/18
CPC分类号： G01N21/9501 , G01N21/8806 , G01N21/956 , G02B27/0905 , G02B27/0944 , G02B27/425
摘要： A system which may be used to generate a plurality of spots on a surface is provided. The spots may be aligned with the incident plane of oblique illumination. The system may include a diffractive optical element configured to split a beam into a plurality of beams by generating a plurality of diffraction orders. The system may also include a focusing lens configured to focus at least some of the plurality of beams on the surface in the plurality of spots. At least some of the plurality of beams may be focused on the surface at an oblique illumination angle. The system may also include an illumination source positioned off-axis relative to an optical axis of the diffractive optical element. Using the system, a plurality of spots may be generated on an inclined surface.
摘要翻译：提供了可用于在表面上产生多个点的系统。斑点可以与倾斜照明的入射平面对齐。该系统可以包括衍射光学元件，其被配置为通过产生多个衍射级将光束分割成多个光束。该系统还可以包括聚焦透镜，其配置成将多个光束中的至少一些聚焦在多个光斑中的表面上。多个光束中的至少一些可以以倾斜照明角度聚焦在表面上。该系统还可以包括相对于衍射光学元件的光轴离轴设置的照明源。使用该系统，可以在倾斜表面上产生多个点。

5. 发明申请

WO2008121561A1 STABILIZING A SUBSTRATE USING A VACUUM PRELOAD AIR BEARING CHUCK 审中-公开
标题翻译：使用真空预紧空气轴承座稳定基板
公开(公告)号：WO2008121561A1
公开(公告)日：2008-10-09
申请号：PCT/US2008/057539
申请日：2008-03-19
申请人： KLA-TENCOR CORPORATION , ZHAO, Guoheng , BELYAEV, Alexander , WOLTERS, Christian H. , DOYLE, Paul Andrew , DANDO, Howard W. , VAEZ-IRAVANI, Mehdi
发明人： ZHAO, Guoheng , BELYAEV, Alexander , WOLTERS, Christian H. , DOYLE, Paul Andrew , DANDO, Howard W. , VAEZ-IRAVANI, Mehdi
IPC分类号： F16C32/06 , B21D53/10
CPC分类号： B25B11/005 , F16C29/025 , F16C32/0603 , H01L21/67784 , H01L21/6838
摘要： Substrate processing method and apparatus are disclosed. The apparatus includes a chuck having a surface with one or more gas flow openings configured to provide a flow of gas to the surface. The surface includes one or more vacuum channels distributed across the surface. The vacuum channels permit vacuum to be drawn therethrough. In the method a substrate may be supported proximate the chuck surface with a back surface of the substrate sufficiently close to the chuck surface that a flow of gas and vacuum can maintain the substrate back surface and the chuck surface in a spaced-apart relationship. Gas flow is provided to the chuck surface through the gas flow openings and vacuum is drawn through one or more vacuum channels. The substrate is moved along a direction substantially perpendicular to the surface of the substrate.
摘要翻译：公开了基板处理方法和装置。该装置包括具有一个表面的卡盘，该表面具有一个或多个气体流动开口，该气体流动开口被配置为向表面提供气体流。表面包括分布在表面上的一个或多个真空通道。真空通道允许真空从中抽出。在该方法中，衬底可以靠近卡盘表面支撑，衬底的后表面足够靠近卡盘表面，气体和真空流可以以间隔的关系保持衬底背面和卡盘表面。通过气体流动开口将气流提供给卡盘表面，并通过一个或多个真空通道抽真空。衬底沿着基本上垂直于衬底表面的方向移动。

6. 发明申请

WO2015196163A1 IN-LINE WAFER EDGE INSPECTION, WAFER PRE-ALIGNMENT, AND WAFER CLEANING 审中-公开
标题翻译：在线波形边缘检查，波形预排列和波形清洗
公开(公告)号：WO2015196163A1
公开(公告)日：2015-12-23
申请号：PCT/US2015/036820
申请日：2015-06-19
申请人： KLA-TENCOR CORPORATION
发明人： NICOLAIDES, Lena , TSAI, Ben-Ming Benjamin , AJI, Prashant A. , GASVODA, Michael , STOKOWSKI, Stanley E. , ZHAO, Guoheng , WEN, Youxian , MAHADEVAN, Mohan , HORN, Paul D. , VOLLRATH, Wolfgang
IPC分类号： H01L21/66 , H01L21/027
CPC分类号： G01N21/9503 , G01N2201/06113 , G03F7/7085 , H01L22/12
摘要： Disclosed are methods and apparatus for inspecting and processing semiconductor wafers. The system includes an edge detection system for receiving each wafer that is to undergo a photolithography process. The edge detection system comprises an illumination channel for directing one or more illumination beams towards a side, top, and bottom edge portion that are within a border region of the wafer. The edge detection system also includes a collection module for collecting and sensing output radiation that is scattered or reflected from the edge portion of the wafer and an analyzer module for locating defects in the edge portion and determining whether each wafer is within specification based on the sensed output radiation for such wafer. The photolithography system is configured for receiving from the edge detection system each wafer that has been found to be within specification. The edge detection system is coupled in-line with the photolithography system.
摘要翻译：公开了用于检查和处理半导体晶片的方法和装置。该系统包括边缘检测系统，用于接收将进行光刻工艺的每个晶片。边缘检测系统包括用于将一个或多个照明光束朝向位于晶片的边界区域内的侧面，顶部和底部边缘部分引导的照明通道。边缘检测系统还包括用于收集和感测从晶片的边缘部分散射或反射的输出辐射的收集模块和用于定位边缘部分中的缺陷的分析器模块，并且基于所感测到的每个晶片是否在规格范围内这种晶片的输出辐射。光刻系统被配置为从边缘检测系统接收已发现在规格范围内的每个晶片。边缘检测系统与光刻系统成对连接。

7. 发明申请

WO2012138460A3 LED SOLAR ILLUMINATOR 审中-公开
公开(公告)号：WO2012138460A3
公开(公告)日：2012-10-11
申请号：PCT/US2012/028910
申请日：2012-03-13
申请人： KLA-TENCOR CORPORATION , ZHAO, Guoheng , LEVY, Ady , SALNIK, Alex , VAEZ-IRAVANI, Mehdi , NICOLAIDES, Lena , NGAI, Samuel S.H.
发明人： ZHAO, Guoheng , LEVY, Ady , SALNIK, Alex , VAEZ-IRAVANI, Mehdi , NICOLAIDES, Lena , NGAI, Samuel S.H.
IPC分类号： G01N21/01 , F21V8/00 , F21S2/00 , G01R31/26
摘要： An apparatus for illuminating a target surface, the apparatus having a plurality of LED arrays, where each of the arrays has a plurality of individually addressable LEDs, and where at least one of the arrays is disposed at an angle of between about forty-five degrees and about ninety degrees relative to the target surface, where all of the arrays supply light into a light pipe, the light pipe having interior walls made of a reflective material, where light exiting the light pipe illuminates the target surface, and a controller for adjusting an intensity of the individually addressable light sources.

8. 发明申请

WO2012082501A3 WAFER INSPECTION 审中-公开
公开(公告)号：WO2012082501A3
公开(公告)日：2012-06-21
申请号：PCT/US2011/063849
申请日：2011-12-07
申请人： KLA-TENCOR CORPORATION , ZHAO, Guoheng , LEONG, Jenn-Kuen , VAEZ-IRAVANI, Mehdi
发明人： ZHAO, Guoheng , LEONG, Jenn-Kuen , VAEZ-IRAVANI, Mehdi
IPC分类号： H01L21/66
摘要： A system configured to inspect a wafer and its operating method, the system comprising: an illumination subsystem configured to illuminate the wafer; a collection subsystem configured to collect light scattered from the wafer and to preserve the polarization of the scattered light; an optical element configured to separate the scattered light collected in different segments of the collection numerical aperture of the collection subsystem, wherein the optical element is positioned at a Fourier plane or a conjugate of the Fourier plane of the collection subsystem; a polarizing element configured to separate the scattered light in one of the different segments into different portions of the scattered light based on polarization; and a detector configured to detect one of the different portions of the scattered light and to generate output responsive to the detected light, wherein the output is used to detect defects on the wafer.

9. 发明申请

WO2009111407A2 MULTI-SPOT SCANNING SYSTEM AND METHOD 审中-公开
标题翻译：多点扫描系统和方法
公开(公告)号：WO2009111407A2
公开(公告)日：2009-09-11
申请号：PCT/US2009/035749
申请日：2009-03-02
申请人： KLA-TENCOR CORPORATION , ZHAO, Guoheng , RUNYON, Rex , VAEZ-IRAVANI, Mehdi
发明人： ZHAO, Guoheng , RUNYON, Rex , VAEZ-IRAVANI, Mehdi
IPC分类号： H01L21/66
CPC分类号： G01N21/9501 , G01N21/8806 , G01N2201/10 , G01N2201/104 , G02B26/123 , Y10S359/90
摘要： A multi-spot scanning technique using a spot array having a predetermined gap between spots can advantageously provide scalability to a large number of spots as well as the elimination of cross-talk between channels. The multi-spot scanning technique can select a number of spots for the spot array (1D or 2D), determine a separation between the spots to minimize crosstalk, and perform a scan on a wafer using the spot array and a full field of view (FOV). Performing the scan includes performing a plurality of scan line cycles, wherein each scan line cycle can fill in gaps left by previous scan line cycles. This 'delay and fill' scan allows large spacing between spots, thereby eliminating cross-talk at the detector plane. In one embodiment, the scan is begun and ended outside a desired scan area on the wafer to ensure full scan coverage.
摘要翻译：使用具有点之间的预定间隙的点阵列的多点扫描技术可以有利地提供对大量斑点的可扩展性以及消除通道之间的串扰。多点扫描技术可以选择点阵列（1D或2D）的多个斑点，确定斑点之间的间隔以最小化串扰，并使用斑点阵列和全视场对晶片进行扫描（ FOV）。执行扫描包括执行多个扫描线周期，其中每个扫描线周期可以填充先前扫描线周期留下的间隙。这种“延迟和填充”扫描允许斑点之间的大间距，从而消除检测器平面处的串扰。在一个实施例中，扫描开始并结束在晶片上期望的扫描区域的外部，以确保全扫描覆盖。

10. 发明申请

WO2017136011A3 METHOD AND SYSTEM FOR OPTICAL THREE-DIMENSIONAL TOPOGRAPHY MEASUREMENT 审中-公开
公开(公告)号：WO2017136011A3
公开(公告)日：2017-08-10
申请号：PCT/US2016/060599
申请日：2016-11-04
申请人： KLA-TENCOR CORPORATION
发明人： ZHAO, Guoheng , VAN DER BURGT, Maarten , LIU, Sheng , HILL, Andy , DE GREEVE, Johan , VAN GILS, Karel
IPC分类号： G01N21/956 , G01N21/39 , G02B27/22
摘要： For three-dimensional topography measurement of a surface of an object patterned illumination is projected on the surface through an objective. A relative movement between the object and the objective is carried out, and plural images of the surface are recorded through the objective by a detector. The direction of the relative movement includes an oblique angle with an optical axis of the objective. Height information for a given position on the surface is derived from a variation of the intensity recorded from the respective position. Also, patterned illumination and uniform illumination may be projected alternatingly on the surface, while images of the surface are recorded during a relative movement of the object and the objective along an optical axis of the objective. Uniform illumination is used for obtaining height information for specular structures on the surface, patterned illumination is used for obtaining height information on other parts of the surface.

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