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1. 发明申请

WO2017123888A1 IMPROVING DEFECT SENSITIVITY OF SEMICONDUCTOR WAFER INSPECTORS USING DESIGN DATA WITH WAFER IMAGE DATA 审中-公开
标题翻译：用晶圆图像数据设计数据提高半导体晶圆检测器的缺陷灵敏度
公开(公告)号：WO2017123888A1
公开(公告)日：2017-07-20
申请号：PCT/US2017/013362
申请日：2017-01-13
申请人： KLA-TENCOR CORPORATION
发明人： BRAUER, Bjorn , BHATTACHARYYA, Santosh , BANERJEE, Saibal , KULKARNI, Ashok V.
IPC分类号： H01L21/66 , H01L21/67
CPC分类号： G06T7/0006 , G06T7/001 , G06T2207/10061 , G06T2207/30148
摘要： Criticality of a detected defect can be determined based on context codes. The context codes can be generated for a region, each of which may be part of a die. Noise levels can be used to group context codes. The context codes can be used to automatically classify a range of design contexts present on a die without needing certain information a priori .
摘要翻译：根据上下文代码可以确定检测到的缺陷的严重性。上下文代码可以为一个区域生成，每个区域都可以是一个die的一部分。可以使用噪声级别对上下文代码进行分组。上下文代码可用于自动分类出现在芯片上的一系列设计上下文，而不需要先验信息。

2. 发明申请

WO2017112488A1 SHAPE BASED GROUPING 审中-公开
标题翻译：基于形状的分组
公开(公告)号：WO2017112488A1
公开(公告)日：2017-06-29
申请号：PCT/US2016/066681
申请日：2016-12-14
申请人： KLA-TENCOR CORPORATION
发明人： BANERJEE, Saibal , KULKARNI, Ashok V. , SARASWATULA, Jagdish , BHATTACHARYYA, Santosh
IPC分类号： H01L21/66
CPC分类号： G06T7/0006 , G06T2207/10061 , G06T2207/30148
摘要： Shape primitives are used for inspection of a semiconductor wafer or other workpiece. The shape primitives can define local topological and geometric properties of a design. One or more rules are applied to the shape primitives. The rules can indicate presence of a defect or the likelihood of a defect being present. A rule execution engine can search for an occurrence of the shape primitives covered by the at least one rule.
摘要翻译：使用形状基元来检查半导体晶片或其他工件。形状基元可以定义设计的局部拓扑和几何属性。一个或多个规则应用于形状基元。规则可以指示存在缺陷或存在缺陷的可能性。规则执行引擎可以搜索由至少一个规则覆盖的形状基元的出现。

3. 发明申请

WO2015175404A1 USING HIGH RESOLUTION FULL DIE IMAGE DATA FOR INSPECTION 审中-公开
标题翻译：使用高分辨率全数字图像数据进行检查
公开(公告)号：WO2015175404A1
公开(公告)日：2015-11-19
申请号：PCT/US2015/030145
申请日：2015-05-11
申请人： KLA-TENCOR CORPORATION
发明人： KULKARNI, Ashok V.
IPC分类号： H01L21/66
CPC分类号： G06T7/001 , G01B21/16 , G01N21/8806 , G01N21/8851 , G01N21/9501 , G01N23/2251 , G01N2021/8825 , G01N2021/8887 , G01N2201/10 , G01N2201/12 , G01N2223/6116 , G06F17/5045 , G06T7/60 , G06T7/74 , G06T2207/30148 , H01L21/67288 , H01L22/12
摘要： Methods and systems for determining a position of inspection data with respect to a stored high resolution die image are provided. One method includes aligning data acquired by an inspection system for alignment sites on a wafer with data for predetermined alignment sites. The predetermined alignment sites have a predetermined position in die image space of a stored high resolution die image for the wafer. The method also includes determining positions of the alignment sites in the die image space based on the predetermined positions of the predetermined alignment sites in the die image space. In addition, the method includes determining a position of inspection data acquired for the wafer by the inspection system in the die image space based on the positions of the alignment sites in the die image space.
摘要翻译：提供了用于确定检查数据相对于存储的高分辨率管芯图像的位置的方法和系统。一种方法包括将通过检查系统获取的数据对准用于晶片上的对准位置的数据与用于预定对准位置的数据。预定的对准位置在晶片的存储的高分辨率芯片图像的管芯图像空间中具有预定位置。该方法还包括基于管芯图像空间中的预定对准位置的预定位置来确定管芯图像空间中的对准位置的位置。此外，该方法包括基于管芯图像空间中的对准位置的位置来确定由管芯图像空间中的检查系统为晶片获取的检查数据的位置。

4. 发明申请

WO2015006230A1 METHODS AND SYSTEMS FOR DETECTING REPEATING DEFECTS ON SEMICONDUCTOR WAFERS USING DESIGN DATA 审中-公开
标题翻译：使用设计数据检测半导体波形上的重复缺陷的方法和系统
公开(公告)号：WO2015006230A1
公开(公告)日：2015-01-15
申请号：PCT/US2014/045601
申请日：2014-07-07
申请人： KLA-TENCOR CORPORATION
发明人： SHIFRIN, Eugene , KULKARNI, Ashok V. , BHASKAR, Kris , LYNCH, Graham Michael , JORDAN III, John Raymond , FANG, Chwen-Jiann
IPC分类号： H01L21/66
CPC分类号： G06F17/5081 , G01N21/9501 , G06F17/5045 , H01L22/12
摘要： Systems and methods for detecting defects on a wafer are provided. One method includes determining locations of all instances of a weak geometry in a design for a wafer. The locations include random, aperiodic locations. The weak geometry includes one or more features that are more prone to defects than other features in the design. The method also includes scanning the wafer with a wafer inspection system to thereby generate output for the wafer with one or more detectors of the wafer inspection system. In addition, the method includes detecting defects in at least one instance of the weak geometry based on the output generated at two or more instances of the weak geometry in a single die on the wafer.
摘要翻译：提供了用于检测晶片上的缺陷的系统和方法。一种方法包括在晶片的设计中确定弱几何的所有实例的位置。这些位置包括随机，不定期的位置。弱几何包括与设计中的其他特征相比更容易出现缺陷的一个或多个特征。该方法还包括用晶片检查系统扫描晶片，从而通过晶片检查系统的一个或多个检测器产生用于晶片的输出。此外，该方法包括基于在晶片上的单个管芯中的弱几何形状的两个或多个实例处产生的输出来检测弱几何形状的至少一个实例中的缺陷。

5. 发明申请

WO2017123555A1 GENERATING SIMULATED OUTPUT FOR A SPECIMEN 审中-公开
标题翻译：为样本生成模拟输出
公开(公告)号：WO2017123555A1
公开(公告)日：2017-07-20
申请号：PCT/US2017/012879
申请日：2017-01-10
申请人： KLA-TENCOR CORPORATION
发明人： BHASKAR, Kris , ZHANG, Jing , CHEN, Grace H. , KULKARNI, Ashok V. , KARSENTI, Laurent
IPC分类号： H01L21/66 , H01L21/67
CPC分类号： G06T7/0006 , G03F1/84 , G03F1/86 , G03F7/7065 , G06T7/0004 , G06T7/001 , G06T2207/10061 , G06T2207/20081 , G06T2207/30148
摘要： Methods and systems for generating simulated output for a specimen are provided. One method includes acquiring information for a specimen with one or more computer systems. The information includes at least one of an actual optical image of the specimen, an actual electron beam image of the specimen, and design data for the specimen. The method also includes inputting the information for the specimen into a learning based model. The learning based model is included in one or more components executed by the one or more computer systems. The learning based model is configured for mapping a triangular relationship between optical images, electron beam images, and design data, and the learning based model applies the triangular relationship to the input to thereby generate simulated images for the specimen.
摘要翻译：提供了用于生成样本的模拟输出的方法和系统。一种方法包括利用一个或多个计算机系统获取标本的信息。该信息包括样本的实际光学图像，样本的实际电子束图像和样本的设计数据中的至少一个。该方法还包括将样本的信息输入到基于学习的模型中。基于学习的模型被包括在由一个或多个计算机系统执行的一个或多个组件中。基于学习的模型被配置用于映射光学图像，电子束图像和设计数据之间的三角关系，并且基于学习的模型将三角关系应用于输入，从而生成样本的模拟图像。

6. 发明申请

WO2014168884A1 ADAPTIVE SAMPLING FOR SEMICONDUCTOR INSPECTION RECIPE CREATION, DEFECT REVIEW, AND METROLOGY 审中-公开
标题翻译：适用于半导体检测协调制度，缺陷审查和计量学的采样
公开(公告)号：WO2014168884A1
公开(公告)日：2014-10-16
申请号：PCT/US2014/033218
申请日：2014-04-07
申请人： KLA-TENCOR CORPORATION
发明人： KULKARNI, Ashok V.
IPC分类号： H01L21/00
CPC分类号： G06T7/0004 , G06T2207/10061 , G06T2207/30148
摘要： Methods and systems for adaptive sampling for semiconductor inspection recipe creation, defect review, and metrology are provided. The embodiments provide image processing and pattern recognition algorithms and an adaptive sampling method for extracting critical areas from SEM image patches for use in a wafer inspection system when design data for a semiconductor chip is not available. The embodiments also provide image processing and pattern recognition algorithms for efficiently discovering critical defects and significant deviations in the normal manufacturing process, using the output from a wafer inspection system and an adaptive sampling method to select wafer locations to be examined on a high resolution review or metrology tool.
摘要翻译：提供了半导体检测配方创建，缺陷检查和计量的自适应采样方法和系统。实施例提供图像处理和模式识别算法以及用于在半导体芯片的设计数据不可用时从用于晶片检查系统的SEM图像补片提取关键区域的自适应采样方法。这些实施例还提供图像处理和模式识别算法，用于在正常制造过程中有效地发现关键缺陷和显着偏差，使用晶片检查系统的输出和自适应采样方法来选择要在高分辨率评估中检查的晶片位置，计量工具。

7. 发明申请

WO2012015973A2 DYNAMIC CARE AREAS 审中-公开
标题翻译：动态护理区
公开(公告)号：WO2012015973A2
公开(公告)日：2012-02-02
申请号：PCT/US2011/045610
申请日：2011-07-27
申请人： KLA-TENCOR CORPORATION , KULKARNI, Ashok V. , CHEN, Chien-Huei Adam
发明人： KULKARNI, Ashok V. , CHEN, Chien-Huei Adam
IPC分类号： H01L21/66
CPC分类号： G05B23/0297 , G05B19/41875 , G05B2219/45031 , H01L22/12 , H01L22/20 , Y02P90/22
摘要： Various embodiments for determining dynamic care areas are provided.
摘要翻译：提供了用于确定动态护理区域的各种实施例。

8. 发明申请

WO2018089216A1 SYSTEM AND METHOD FOR GENERATION OF WAFER INSPECTION CRITICAL AREAS 审中-公开
标题翻译：用于生成晶片检测关键区域的系统和方法
公开(公告)号：WO2018089216A1
公开(公告)日：2018-05-17
申请号：PCT/US2017/058887
申请日：2017-10-27
申请人： KLA-TENCOR CORPORATION
发明人： UPPALURI, Prasanti , MANEPALLI, Rajesh , KULKARNI, Ashok V. , BANERJEE, Saibal , KIRKLAND, John
IPC分类号： H01L21/66 , H01L21/67
CPC分类号： G06T7/0004 , G06T7/0006 , G06T2207/10061 , G06T2207/30148 , H01L22/12
摘要： A method includes receiving one or more sets of wafer data, identifying one or more primitives from one or more shapes in one or more layers in the one or more sets of wafer data, classifying each of the one or more primitives as a particular primitive type, identifying one or more primitive characteristics for each of the one or more primitives, generating a primitive database of the one or more primitives, generating one or more rules based on the primitive database, receiving one or more sets of design data, applying the one or more rules to the one or more sets of design data to identify one or more critical areas, and generating one or more wafer inspection recipes including the one or more critical areas for an inspection sub-system.
摘要翻译：一种方法包括接收一组或多组晶圆数据，从一组或多组晶圆数据中的一个或多个层中的一个或多个形状中识别一个或多个基元，将一组或多组晶圆数据中的每一个或多个基元作为一个特定的原语类型，识别一个或多个原语的特征为每个所述一个或多个原语，生成所述一个或多个基元的原语数据库，基于原始数据库上生成一个或多个规则，接收一个或多个将一个或多个规则应用于一组或多组设计数据以识别一个或多个关键区域，并且生成包括用于检查子系统的一个或多个关键区域的一个或多个晶片检查配方。

9. 发明申请

WO2017123561A1 IMAGE BASED SPECIMEN PROCESS CONTROL 审中-公开
标题翻译：基于图像的样本过程控制
公开(公告)号：WO2017123561A1
公开(公告)日：2017-07-20
申请号：PCT/US2017/012890
申请日：2017-01-10
申请人： KLA-TENCOR CORPORATION
发明人： PARK, Allen , GAO, Lisheng , KULKARNI, Ashok V. , BANERJEE, Saibal , GU, Ping , RONG, Songnian , BHASKAR, Kris
IPC分类号： H01L21/66
CPC分类号： G06T7/0004 , G01N21/9501 , G06T7/001 , G06T2207/10056 , G06T2207/10061 , G06T2207/20081 , G06T2207/20084 , G06T2207/30148
摘要： Methods and systems for detecting anomalies in images of a specimen are provided. One system includes one or more computer subsystems configured for acquiring images generated of a specimen by an imaging subsystem. The computer subsystem(s) are also configured for determining one or more characteristics of the acquired images. In addition, the computer subsystem(s) are configured for identifying anomalies in the images based on the one or more determined characteristics without applying a defect detection algorithm to the images or the one or more characteristics of the images.
摘要翻译：提供了用于检测样本的图像中的异常的方法和系统。一个系统包括一个或多个计算机子系统，其被配置为采集由成像子系统产生的样本的图像。计算机子系统还被配置用于确定所获取图像的一个或多个特征。另外，（一个或多个）计算机子系统被配置用于基于一个或多个确定的特征来识别图像中的异常，而不对图像或图像的一个或多个特征应用缺陷检测算法。

10. 发明申请

WO2016172622A1 OUTLIER DETECTION ON PATTERN OF INTEREST IMAGE POPULATIONS 审中-公开
标题翻译：对图像人口模式的外部检测
公开(公告)号：WO2016172622A1
公开(公告)日：2016-10-27
申请号：PCT/US2016/029036
申请日：2016-04-22
申请人： KLA-TENCOR CORPORATION
发明人： BANERJEE, Saibal , KULKARNI, Ashok V.
IPC分类号： H01L21/66 , H01L21/027
CPC分类号： G06T7/001 , G06T2207/20021 , G06T2207/30148
摘要： Methods and systems for identifying outliers in multiple instances of a pattern of interest (POI) are provided. One system includes one or more computer subsystems configured for acquiring images generated by an imaging subsystem at multiple instances of a POI within a die formed on the specimen. The multiple instances include two or more instances that are located at aperiodic locations within the die. The computer subsystem(s) are also configured for determining a feature of each of the images generated at the multiple instances of the POI. In addition, the computer subsystem(s) are configured for identifying one or more outliers in the multiple instances of the POI based on the determined features.
摘要翻译：提供了用于识别感兴趣模式（POI）的多个实例中的异常值的方法和系统。一个系统包括一个或多个计算机子系统，其配置用于在形成在样本上的模具内的POI的多个实例处获取由成像子系统生成的图像。多个实例包括位于管芯内非周期位置的两个或多个实例。计算机子系统还被配置用于确定在POI的多个实例处生成的每个图像的特征。另外，计算机子系统被配置为基于所确定的特征来识别POI的多个实例中的一个或多个异常值。

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