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    • 1. 发明申请
    • METHOD FOR THE PRODUCTION OF AN INTEGRATED SEMICONDUCTOR CIRCUIT
    • 生产集成半导体电路的方法
    • WO2004030028A3
    • 2004-06-03
    • PCT/DE0303068
    • 2003-09-16
    • INFINEON TECHNOLOGIES AGGOEBEL BERNDMOLL PETERSCHUMANN DIRKSEIDL HARALD
    • GOEBEL BERNDMOLL PETERSCHUMANN DIRKSEIDL HARALD
    • H01L20060101H01L21/768H01L21/8239H01L21/8242H01L27/108
    • H01L27/10888H01L21/76895H01L27/10864H01L27/10894
    • The invention relates to a method for the production of an integrated semiconductor circuit, whereby electrical contacts (20), for first conducting structures (1), are produced in the memory region (I) and the first conducting structures (1) are contacted, without contacting second conducting structures (2) arranged laterally with respect to the first conducting structures (1), which laterally border the first conducting structures (1) or are arranged too close to the same to be selectively lithographically masked. According to the invention, the first conducting structures (1) are contacted, whereby a conducting layer (L) is deposited and structured after a planarisation in the memory region at the level of the first conducting structures (1) above the second conducting structures (2), which is applied in the logic region for the generation of gate electrodes, for example. Intermediate contacts (10) are thus structured which are so wide that contact holes for the electrical contacts can be fitted thereon. The deposition of a nitride layer for the protection of the second conducting layer (2) is thus superfluous.
    • 本发明涉及一种用于制造在其中为第一导电结构(1)的存储器区域(I)(20)制备的半导体集成电路的电接触,并且所述第一导电结构(1)由所述第一结构没有横向导电接触 (2)(1)设置在第二导电图案,以接触施加于第一导电图案的侧面(1)抵接或挨着它们紧密地布置成选择性地掩蔽以它们能够光刻。 根据本发明,第一导电结构(1)由所述存储区域在已经在所述逻辑区域被使用过的第二导电结构(2)平坦化,导电层(L)后上面的第一导电结构(1)的电平相接触,例如用于生产栅电极的 变得分离和结构化。 这个中间触点(10)是结构化的,其宽度足以使电触点(20)的触点孔可以调节到它们。 不需要沉积氮化物层以保护第二导电结构(2)。
    • 4. 发明申请
    • SEMICONDUCTOR MEMORY CELL ARRANGEMENT AND METHOD FOR PRODUCING THE SAME
    • 半导体存储器单元装置和方法及其
    • WO0211200A8
    • 2002-04-11
    • PCT/DE0102798
    • 2001-07-23
    • INFINEON TECHNOLOGIES AGGOEBEL BERNDLUETZEN JOERNPOPP MARTINSEIDL HARALD
    • GOEBEL BERNDLUETZEN JOERNPOPP MARTINSEIDL HARALD
    • H01L21/8242H01L27/108
    • H01L27/10864
    • The invention relates to a semiconductor memory cell arrangement comprising dynamic memory cells (10) which each have a trench capacitor (1) and a vertical selection transistor (2). Said vertical selection transistor (2) is situated essentially above the trench capacitor (1) and has a series of layers which is offset from the inner electrode of the trench capacitor (1) and which is connected to said inner electrode (11) of the trench capacitor (1). An active intermediate layer (22) is completely surrounded by an insulator layer (24) and a gate electrode layer (25) which is connected to a word line (7). The dynamic memory cells (10) are arranged in the form of a matrix, the trench capacitors (1) and the corresponding vertical selection transistors (2) of the dynamic memory cells (10) succeeding each other in a line and/or column sequence, respectively.
    • 具有动态存储单元的半导体存储器单元阵列(10),每一个都具有严重的电容器(1)和一个verikalen选择晶体管(2),其特征在于,垂直选择晶体管(2)基本上高于WOM严重电容器(1)被布置和相对的内部电极 被严重电容器(1)与一个布置成与严重电容器(1),其特征在于,有源中间层(22)被封闭具有完全的绝缘体层(24)和栅电极层(25)的内电极(11)偏移的层序列 Worleitung(7)连接,其中,所述动态存储单元(10)被布置成矩阵,和坟墓电容器(1)和相关联的垂直选择Transistore(2)的动态存储器单元(10),每行和/或列状连续的。