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1. 发明申请

WO2005101592A3 FEMTOSECOND LASER PROCESSING SYSTEM WITH PROCESS PARAMETERS, CONTROLS AND FEEDBACK 审中-公开
标题翻译：具有过程参数，控制和反馈的FEMTOSECOND激光加工系统
公开(公告)号：WO2005101592A3
公开(公告)日：2005-11-17
申请号：PCT/US2005008622
申请日：2005-03-14
申请人： IMRA AMERICA INC , SHAH LAWRENCE , BOVATSEK JAMES M , ARAI ALAN Y , YAMAMOTO TADASHI , PATEL RAJESH S , HARTER DONALD J
发明人： SHAH LAWRENCE , BOVATSEK JAMES M , ARAI ALAN Y , YAMAMOTO TADASHI , PATEL RAJESH S , HARTER DONALD J
IPC分类号： G01J11/00 , H01S3/00 , H01S3/067 , H01S3/10 , H01S3/102 , H01S3/109 , H01S3/13 , H01S3/16 , H01S3/23
CPC分类号： H01S3/10038 , G01J11/00 , H01S3/0014 , H01S3/005 , H01S3/0057 , H01S3/0064 , H01S3/0078 , H01S3/06754 , H01S3/10023 , H01S3/10061 , H01S3/102 , H01S3/1024 , H01S3/108 , H01S3/109 , H01S3/1305 , H01S3/1618
摘要： A femtosecond laser based laser processing system having a femtosecond laser, frequency conversion optics, beam manipulation optics, target motion control, processing chamber, diagnostic systems and system control modules. The femtosecond laser based laser processing system allows for the utilization of the unique heat control in micromachining, and the system has greater output beam stability, continuously variable repetition rate and unique temporal beam shaping capabilities.
摘要翻译：飞秒激光激光处理系统，具有飞秒激光，变频光学，光束操纵光学，目标运动控制，处理室，诊断系统和系统控制模块。基于飞秒激光的激光处理系统允许利用微加工中的独特热控制，并且该系统具有更大的输出光束稳定性，连续可变的重复率和独特的时间光束整形能力。

2. 发明申请

WO2005099957A2 PULSED LASER PROCESSING WITH CONTROLLED THERMAL AND PHYSICAL ALTERATIONS 审中-公开
标题翻译：具有受控热和物理变化的脉冲激光加工
公开(公告)号：WO2005099957A2
公开(公告)日：2005-10-27
申请号：PCT/US2005008623
申请日：2005-03-14
申请人： IMRA AMERICA INC , YAMAMOTO TADASHI , HARTER DONALD J , PATEL RAJESH S , ARAI ALAN Y
发明人： YAMAMOTO TADASHI , HARTER DONALD J , PATEL RAJESH S , ARAI ALAN Y
IPC分类号： B23K26/00 , B23K26/06
CPC分类号： B23K26/0624 , B23K26/0622
摘要： Laser machining of material using a burst of ultrashort laser pulses, tailoring the pulse width, pulse separation duration, wavelength, and polarization to maximize the positive effect of thermal and physical changes achieved by the previous pulse on the laser-matter interaction. Manipulations of pulse width, pulse separation duration, and pulse energies of pulses within a burst can be used to achieve better processing results. Wavelength and polarization of a laser beam may be varied pulse-to-pulse in a burst in order to produce maximum laser-matter interaction.
摘要翻译：使用超短激光脉冲的脉冲激光加工材料，定制脉冲宽度，脉冲间隔持续时间，波长和极化，以最大化由激光物质相互作用上的先前脉冲实现的热和物理变化的积极影响。可以使用脉冲宽度，脉冲间隔持续时间和突发脉冲的脉冲能量来实现更好的处理结果。激光束的波长和极化可以在脉冲串中脉冲 - 脉冲变化，以产生最大的激光物质相互作用。

3. 发明申请

WO2006079083A3 LASER MATERIAL MICROMACHINING WITH GREEN FEMTOSECOND PULSES 审中-公开
标题翻译：激光材料MICROMACHINING与绿色FEMTOSECOND脉冲
公开(公告)号：WO2006079083A3
公开(公告)日：2007-11-01
申请号：PCT/US2006002531
申请日：2006-01-23
申请人： IMRA AMERICA INC , BOVATSEK JAMES , ARAI ALAN Y , SHAH LAWRENCE , YOSHINO FUMIYO
发明人： BOVATSEK JAMES , ARAI ALAN Y , SHAH LAWRENCE , YOSHINO FUMIYO
IPC分类号： B23K26/36
CPC分类号： B23K26/0624 , B23K26/0006 , B23K26/364 , B23K26/40 , B23K2203/172 , B23K2203/30 , B23K2203/42 , B23K2203/50 , C03B33/0222 , H01S3/0057
摘要： Various embodiments of a system described herein relate to micromachining materials using ultrashort visible laser pulses. The ultrashort laser pulses may be green and have a wavelength between about 500 to 550 nanometers in some embodiments. Additionally, the pulses may have a pulse duration of less than one picosecond in certain embodiments.
摘要翻译：本文所述的系统的各种实施例涉及使用超短可见激光脉冲的微加工材料。在一些实施例中，超短激光脉冲可以是绿色的并且具有在约500至550纳米之间的波长。另外，在某些实施例中，脉冲可以具有小于1皮秒的脉冲持续时间。

4. 发明申请

WO2006079083A9 LASER MATERIAL MICROMACHINING WITH GREEN FEMTOSECOND PULSES 审中-公开
标题翻译：激光材料MICROMACHINING与绿色FEMTOSECOND脉冲
公开(公告)号：WO2006079083A9
公开(公告)日：2006-09-28
申请号：PCT/US2006002531
申请日：2006-01-23
申请人： IMRA AMERICA INC , BOVATSEK JAMES , ARAI ALAN Y , SHAH LAWRENCE , YOSHINO FUMIYO
发明人： BOVATSEK JAMES , ARAI ALAN Y , SHAH LAWRENCE , YOSHINO FUMIYO
IPC分类号： H01S3/10
CPC分类号： B23K26/0624 , B23K26/0006 , B23K26/364 , B23K26/40 , B23K2203/172 , B23K2203/30 , B23K2203/42 , B23K2203/50 , C03B33/0222 , H01S3/0057
摘要： Various embodiments of a system described herein relate to micromachining materials using ultrashort visible laser pulses. The ultrashort laser pulses may be green and have a wavelength between about 500 to 550 nanometers in some embodiments. Additionally, the pulses may have a pulse duration of less than one picosecond in certain embodiments.
摘要翻译：本文所述的系统的各种实施例涉及使用超短可见激光脉冲的微加工材料。在一些实施例中，超短激光脉冲可以是绿色的并且具有在约500至550纳米之间的波长。另外，在某些实施例中，脉冲可以具有小于1皮秒的脉冲持续时间。

5. 发明申请

WO2009114375A2 TRANSPARENT MATERIAL PROCESSING WITH AN ULTRASHORT PULSE LASER 审中-公开
标题翻译：具有ULTRASH脉冲激光的透明材料加工
公开(公告)号：WO2009114375A2
公开(公告)日：2009-09-17
申请号：PCT/US2009036126
申请日：2009-03-05
申请人： IMRA AMERICA INC , ARAI ALAN Y , CHO GYU C , XU JINGZHOU , YOSHINO FUMIYO , ZHANG HAIBIN , BOVATSEK JAMES
发明人： ARAI ALAN Y , CHO GYU C , XU JINGZHOU , YOSHINO FUMIYO , ZHANG HAIBIN , BOVATSEK JAMES
IPC分类号： H01L21/027
CPC分类号： B23K26/0624 , B23K26/0057 , B23K26/006 , B23K26/0087 , B23K26/0676 , B23K26/083 , B23K26/0869 , B23K26/21 , B23K26/324 , B23K26/359 , B23K26/364 , B23K26/40 , B23K26/402 , B23K26/53 , B23K26/55 , B23K2203/50 , B23K2203/54 , B28D5/00 , B28D5/0011 , B29C65/1606 , B29C65/1612 , B29C65/1619 , B29C65/1629 , B29C65/1635 , B29C65/1638 , B29C65/1654 , B29C65/1658 , B29C65/1687 , B29C65/38 , B29C66/1122 , B29C66/43 , B29C66/71 , B29C66/73161 , B29C66/73366 , B29C66/73921 , B29C66/836 , B29C66/952 , B29K2995/0026 , B41M5/26 , B41M5/262 , B41M5/267 , C03B23/006 , C03B33/102 , C03C23/0025 , H01L21/268 , H01L21/78 , B29K2069/00
摘要： Methods, devices, and systems for ultrashort pulse laser processing of optically transparent materials are disclosed, with example applications in scribing, marking, welding, and joining. For example, ultrashort laser pulses create scribe features with one pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. Slightly modifying the ultrashort pulse laser processing conditions produces sub-surface marks. When properly arranged, these marks are clearly visible with correctly aligned illumination. Reflective marks may also be formed with control of laser parameters. A transparent material other than glass may be utilized. A method for welding transparent materials uses ultrashort laser pulses to create a bond through localized heating. In some embodiments of transparent material processing, a multifocus beam generator simultaneously forms multiple beam waists spaced depthwise relative to the transparent material, thereby increasing processing speed.
摘要翻译：公开了用于光学透明材料的超短脉冲激光加工的方法，装置和系统，例如在划线，标记，焊接和接合中的应用。例如，超短激光脉冲通过激光束穿过材料产生一次划线特征，其中至少一个划线特征形成在材料表面下方。稍微修改超短脉冲激光加工条件会产生次表面痕迹。正确布置时，这些标记在正确对齐的照明下清晰可见。还可以通过激光参数的控制来形成反射标记。可以使用玻璃以外的透明材料。用于焊接透明材料的方法使用超短激光脉冲通过局部加热产生粘结。在透明材料处理的一些实施例中，多焦点光束发生器同时形成相对于透明材料沿深度方向间隔开的多个光束束，从而提高处理速度。

6. 发明申请

WO2015108991A3 LASER-BASED MODIFICATION OF TRANSPARENT MATERIALS 审中-公开
标题翻译：基于激光的透明材料改性
公开(公告)号：WO2015108991A3
公开(公告)日：2015-10-15
申请号：PCT/US2015011420
申请日：2015-01-14
申请人： IMRA AMERICA INC
发明人： OTA MICHIHARU , ARAI ALAN Y , LIU ZHENLIN
IPC分类号： B23K26/36 , B23K26/06 , B23K26/08 , B23K26/38 , B23K26/40
CPC分类号： B23K26/0624 , B23K26/0604 , B23K26/082 , B23K26/36 , B23K26/364 , B23K26/38 , B23K26/382 , B23K26/40 , B23K26/402 , B23K2203/50 , B23K2203/54 , C03B33/102
摘要： In certain embodiments a method and system for laser-based material processing of a material is disclosed. In at least one preferred implementation temporally overlapping pulse series are generated with separate pulsed laser sources, for example nanosecond (NS) and ultrashort pulse (USP) sources (NS-USP). Pulses are delivered to the material as a series of spatially and temporally overlapping pulse pairs. The material can, but need not, be a transparent material. In some applications of transparent material processing, it was found the combination of pulses both substantially more material modification and high machining quality than obtainable with either individual pulse series taken alone. Other micromachining methods and arrangement are disclosed for formation of fine features on or within a substrate. Such methods and arrangements may generally be applied with a NS-USP combination, or with other sources.
摘要翻译：在某些实施例中，公开了用于材料的基于激光的材料处理的方法和系统。在至少一个优选实施方式中，利用分离的脉冲激光源，例如纳秒（NS）和超短脉冲（USP）源（NS-USP）产生时间重叠的脉冲序列。脉冲作为一系列空间和时间重叠的脉冲对被传送到材料。材料可以但不必是透明材料。在透明材料加工的一些应用中，发现脉冲组合可以实现更多的材料修改和高的加工质量，而不是单独采用单个脉冲序列可获得的。公开了其他微加工方法和装置，用于在衬底上或衬底内形成精细特征。这些方法和装置通常可以与NS-USP组合或与其他来源一起应用。

7. 发明申请

WO2016122821A3 LASER-BASED MODIFICATION OF TRANSPARENT MATERIALS 审中-公开
标题翻译：透明材料的激光改性
公开(公告)号：WO2016122821A3
公开(公告)日：2016-09-22
申请号：PCT/US2015068066
申请日：2015-12-30
申请人： IMRA AMERICA INC
发明人： TURNER MARK , ARAI ALAN Y , OTA MICHIHARU
IPC分类号： B23K26/082 , B23K26/142 , B23K26/146 , B23K26/382 , B23K26/402
CPC分类号： B23K26/382 , B23K26/0624 , B23K26/064 , B23K26/0676 , B23K26/082 , B23K26/142 , B23K26/146 , B23K26/402 , B23K2203/50 , B23K2203/52 , B23K2203/54
摘要： The present disclosure provides examples of a laser-based material processing system for liquid-assisted, ultrashort pulse (USP) laser micromachining. An example material processing application includes drilling thru-holes or blind holes in a nearly transparent glass workpiece (substrate) (1005) using parallel processing with an n x m array of focused laser beams (1040). Methods and systems are disclosed herein which provide for formation of high aspect ratio holes with low taper in fine pitch arrangements.
摘要翻译：本公开提供了用于液体辅助超短脉冲（USP）激光微加工的基于激光的材料处理系统的实例。示例性材料处理应用包括使用具有n×m聚焦激光束阵列（1040）的并行处理在几乎透明的玻璃工件（基板）（1005）中钻孔通孔或盲孔。本文公开的方法和系统提供了形成具有细锥度布置的低锥度的高纵横比孔。

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