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1. 发明申请

WO2002100620A1 脆性基板のスクライブ装置およびスクライブ方法审中-公开
标题翻译：用于筛选易碎物质的装置和方法
公开(公告)号：WO2002100620A1
公开(公告)日：2002-12-19
申请号：PCT/JP2002/005815
申请日：2002-06-11
申请人：三星ダイヤモンド工業株式会社 , 若山治雄
发明人：若山治雄
IPC分类号： B28D5/00
CPC分类号： C03B33/091 , B23K26/703 , C03B33/102
摘要： A method for scribing a fragile substrate, comprising the steps of heating a glass substrate (50) by continuously radiating a laser spot on the surface of the glass substrate (50) along an area in which a scribe line is formed at a temperature lower than the softening point of the glass substrate and, at the same time, continuously cooling the area near the laser spot by the cooling water injected from a cooling nozzle (37), whereby blind crack can be formed along the predicted scribe line. An imaging mechanism (40) images a blind crack forming area in proximity to an area on the surface of the glass substrate in which the cooling water is injected, and checks that the blind crack is formed based on the imaged image data.
摘要翻译：一种划伤易碎基材的方法，包括以下步骤：通过在玻璃基板（50）的表面上沿着形成有划线的区域连续照射玻璃基板（50）的步骤，该玻璃基板（50）的温度低于玻璃基板的软化点，并且同时通过从冷却喷嘴（37）喷射的冷却水连续地冷却激光光斑附近的区域，由此可以沿着预测划线形成盲目裂纹。成像机构（40）在靠近注入冷却水的玻璃基板的表面上的区域附近形成盲裂纹形成区域，并基于成像图像数据检查形成的盲裂纹。

2. 发明申请

WO02016276A1 METHOD AND DEVICE FOR CUTTING A FLAT GLASS PLATE INTO A NUMBER OF RECTANGULAR PLATES 审中-公开
标题翻译：方法和装置平板玻璃在几个矩形板切割
公开(公告)号：WO02016276A1
公开(公告)日：2002-02-28
申请号：PCT/EP2001/008397
申请日：2001-07-20
IPC分类号： B23K26/00 , B23K26/40 , C03B33/03 , C03B33/033 , C03B33/09 , C03B33/10
CPC分类号： C03B33/091 , B65G2249/04 , C03B33/03 , C03B33/102 , Y10T225/12 , Y10T225/304
摘要： The cutting of these rectangular plates with predetermined edge lengths is typically effected by means of a laser, which is displaced along the cutting lines, in conjunction with a trailing cooling spot for inducing a thermomechanical stress that is greater than the breaking strength of the glass, and by means of a mechanically induced initial crack at the beginning of the cutting line. When the flat glass plate (1) is in an initial position, a number of parallel first cutting lines (1-3) are made. Afterwards, the flat glass plate (1) that is cut up in such a manner is rotated 90 DEG , and the partial plates (2-5) are moved apart by virtue of the fact that a displaceable table segment of a cutting table is assigned to each partial plate. In this position, several parallel second cuts (4-9) are then made that are perpendicular to the first cuts, whereby, on each partial plate, an initial crack is induced on the leading edge. This enables the cutting up process to be effected in a working action with exact optimal placement of the initial crack on the plate edges.
摘要翻译：预定的边缘长度的这些矩形板的切削通常是由沿着切断线与用于诱导热机械应力，这是上述玻璃的断裂强度的后冷却斑结合的激光束的移动的手段，以及通过机械在鞍钢分别感应出的切割线初始裂纹的装置。在平板玻璃的基本位置（1）被执行的多个平行的第一截面线（1-3），然后将如此分割平板玻璃板（1）是由90°旋转，并由此被部分板（2-5）是由每个子面板移动分开切割台的可动表段被分配。然后多个平行的第二切口（4-9）的被进行了垂直于在该位置的第一切口，每个子面板时在初始裂纹的前缘诱导。因此，切割工艺可以在一个操作来完成与在板边缘上的初始裂纹的精确，最佳位置。

3. 发明申请

WO2009114375A2 TRANSPARENT MATERIAL PROCESSING WITH AN ULTRASHORT PULSE LASER 审中-公开
标题翻译：具有ULTRASH脉冲激光的透明材料加工
公开(公告)号：WO2009114375A2
公开(公告)日：2009-09-17
申请号：PCT/US2009036126
申请日：2009-03-05
申请人： IMRA AMERICA INC , ARAI ALAN Y , CHO GYU C , XU JINGZHOU , YOSHINO FUMIYO , ZHANG HAIBIN , BOVATSEK JAMES
发明人： ARAI ALAN Y , CHO GYU C , XU JINGZHOU , YOSHINO FUMIYO , ZHANG HAIBIN , BOVATSEK JAMES
IPC分类号： H01L21/027
CPC分类号： B23K26/0624 , B23K26/0057 , B23K26/006 , B23K26/0087 , B23K26/0676 , B23K26/083 , B23K26/0869 , B23K26/21 , B23K26/324 , B23K26/359 , B23K26/364 , B23K26/40 , B23K26/402 , B23K26/53 , B23K26/55 , B23K2203/50 , B23K2203/54 , B28D5/00 , B28D5/0011 , B29C65/1606 , B29C65/1612 , B29C65/1619 , B29C65/1629 , B29C65/1635 , B29C65/1638 , B29C65/1654 , B29C65/1658 , B29C65/1687 , B29C65/38 , B29C66/1122 , B29C66/43 , B29C66/71 , B29C66/73161 , B29C66/73366 , B29C66/73921 , B29C66/836 , B29C66/952 , B29K2995/0026 , B41M5/26 , B41M5/262 , B41M5/267 , C03B23/006 , C03B33/102 , C03C23/0025 , H01L21/268 , H01L21/78 , B29K2069/00
摘要： Methods, devices, and systems for ultrashort pulse laser processing of optically transparent materials are disclosed, with example applications in scribing, marking, welding, and joining. For example, ultrashort laser pulses create scribe features with one pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. Slightly modifying the ultrashort pulse laser processing conditions produces sub-surface marks. When properly arranged, these marks are clearly visible with correctly aligned illumination. Reflective marks may also be formed with control of laser parameters. A transparent material other than glass may be utilized. A method for welding transparent materials uses ultrashort laser pulses to create a bond through localized heating. In some embodiments of transparent material processing, a multifocus beam generator simultaneously forms multiple beam waists spaced depthwise relative to the transparent material, thereby increasing processing speed.
摘要翻译：公开了用于光学透明材料的超短脉冲激光加工的方法，装置和系统，例如在划线，标记，焊接和接合中的应用。例如，超短激光脉冲通过激光束穿过材料产生一次划线特征，其中至少一个划线特征形成在材料表面下方。稍微修改超短脉冲激光加工条件会产生次表面痕迹。正确布置时，这些标记在正确对齐的照明下清晰可见。还可以通过激光参数的控制来形成反射标记。可以使用玻璃以外的透明材料。用于焊接透明材料的方法使用超短激光脉冲通过局部加热产生粘结。在透明材料处理的一些实施例中，多焦点光束发生器同时形成相对于透明材料沿深度方向间隔开的多个光束束，从而提高处理速度。

4. 发明申请

WO2008156620A1 HIGH SPEED AND HIGH POWER LASER SCRIBING METHODS AND SYSTEMS 审中-公开
标题翻译：高速和高功率激光扫描方法和系统
公开(公告)号：WO2008156620A1
公开(公告)日：2008-12-24
申请号：PCT/US2008/007316
申请日：2008-06-12
申请人： TECHNOLINES, LLC , COSTIN, Darryl J. , COSTIN, Jr., Darryl J. , COSTIN, Kimberly L.
发明人： COSTIN, Darryl J. , COSTIN, Jr., Darryl J. , COSTIN, Kimberly L.
IPC分类号： B23K26/08
CPC分类号： B41M5/24 , B23K26/082 , B29C59/16 , B41M5/26 , B44C1/228 , C03B33/102 , C03C23/0025
摘要： A method of scribing a graphic on a material is provided, in which laser output is applied to the material. The laser output is moved relative to the material at a high speed greater than 10 m per second, and at a high power greater than 500 W, to scribe a graphic on a surface of the material. Also provided is a system for scribing a graphic on a material. The method and system of the invention are especially useful in the scribing of building materials.
摘要翻译：提供了一种在材料上刻划图形的方法，其中将激光输出应用于材料。激光输出以大于10m /秒的高速相对于材料移动，并且以大于500W的高功率移动，以在材料的表面上刻划图形。还提供了用于在材料上划线图形的系统。本发明的方法和系统在建筑材料的划线中特别有用。

5. 发明申请

WO02100620B1 DEVICE AND METHOD FOR SCRIBING FRAGILE SUBSTANCE 审中-公开
标题翻译：用于筛选易碎物质的装置和方法
公开(公告)号：WO02100620B1
公开(公告)日：2003-03-06
申请号：PCT/JP0205815
申请日：2002-06-11
申请人： MITSUBOSHI DIAMOND IND CO LTD , WAKAYAMA HARUO
发明人： WAKAYAMA HARUO
IPC分类号： B23K26/40 , B23K26/42 , C03B33/08 , C03B33/10 , B28D5/00 , B23K26/00 , C03B33/037 , C03B33/09
CPC分类号： C03B33/091 , B23K26/703 , C03B33/102
摘要： A method for scribing a fragile substrate, comprising the steps of heating a glass substrate (50) by continuously radiating a laser spot on the surface of the glass substrate (50) along an area in which a scribe line is formed at a temperature lower than the softening point of the glass substrate and, at the same time, continuously cooling the area near the laser spot by the cooling water injected from a cooling nozzle (37), whereby blind crack can be formed along the predicted scribe line. An imaging mechanism (40) images a blind crack forming area in proximity to an area on the surface of the glass substrate in which the cooling water is injected, and checks that the blind crack is formed based on the imaged image data.
摘要翻译：一种划伤易碎基材的方法，包括以下步骤：通过在玻璃基板（50）的表面上沿着形成划线的区域连续地将玻璃基板（50）的表面连续地照射在玻璃基板（50）的温度玻璃基板的软化点，并且同时通过从冷却喷嘴（37）喷射的冷却水连续地冷却激光光斑附近的区域，由此可以沿着预测划线形成盲目裂纹。成像机构（40）在靠近注入冷却水的玻璃基板的表面上的区域附近形成盲裂纹形成区域，并基于成像的图像数据检查形成的盲裂纹。

6. 发明申请

WO2016089799A1 GLASS CUTTING SYSTEMS AND METHODS USING NON-DIFFRACTING LASER BEAMS 审中-公开
标题翻译：玻璃切割系统和使用非衍射激光束的方法
公开(公告)号：WO2016089799A1
公开(公告)日：2016-06-09
申请号：PCT/US2015/063063
申请日：2015-12-01
申请人： CORNING INCORPORATED
发明人： WEST, James Andrew
IPC分类号： C03B33/02 , B23K26/067 , B23K26/064 , B23K26/0622 , B23K103/00
CPC分类号： C03B33/102 , B23K26/0622 , B23K26/064 , B23K26/0648 , B23K26/0676 , B23K26/38 , B23K26/382 , B23K26/402 , B23K2203/50 , B23K2203/54 , C03B33/0222 , Y02P40/57
摘要： Embodiments are directed to systems for laser cutting at least one glass article comprising a pulsed laser assembly and a glass support assembly configured to support the glass article during laser cutting within the pulsed laser assembly, wherein the pulsed laser assembly comprise at least one non-diffracting beam (NDB) forming optical element configured to convert an input beam into a quasi-NDB beam; and at least one beam transforming element configured to convert the quasi-NDB beam into multiple quasi-NDB sub-beams spaced apart a distance of about 1 µm to about 500 µm; wherein the pulsed laser assembly is oriented to deliver one or more pulses of multiple quasi-NDB sub-beams onto a surface of the glass article, wherein each pulse of multiple quasi-NDB sub-beams is operable to cut a plurality of perforations in the glass article.
摘要翻译：实施例涉及用于激光切割至少一个玻璃制品的系统，所述玻璃制品包括脉冲激光组件和玻璃支撑组件，玻璃支撑组件被配置为在脉冲激光组件内的激光切割期间支撑玻璃制品，其中脉冲激光组件包括至少一种非衍射光束（NDB）形成光学元件，被配置为将输入光束转换成准NDB光束; 以及至少一个光束变换元件，其被配置为将准NDB光束转换成间隔大约1μm至大约500μm的多个准NDB子光束; 其中所述脉冲激光器组件被定向成将多个准NDB子光束的一个或多个脉冲传送到所述玻璃制品的表面上，其中多个准NDB子光束的每个脉冲可操作地切割所述玻璃制品中的多个穿孔玻璃制品。

7. 发明申请

WO2015108991A3 LASER-BASED MODIFICATION OF TRANSPARENT MATERIALS 审中-公开
标题翻译：基于激光的透明材料改性
公开(公告)号：WO2015108991A3
公开(公告)日：2015-10-15
申请号：PCT/US2015011420
申请日：2015-01-14
申请人： IMRA AMERICA INC
发明人： OTA MICHIHARU , ARAI ALAN Y , LIU ZHENLIN
IPC分类号： B23K26/36 , B23K26/06 , B23K26/08 , B23K26/38 , B23K26/40
CPC分类号： B23K26/0624 , B23K26/0604 , B23K26/082 , B23K26/36 , B23K26/364 , B23K26/38 , B23K26/382 , B23K26/40 , B23K26/402 , B23K2203/50 , B23K2203/54 , C03B33/102
摘要： In certain embodiments a method and system for laser-based material processing of a material is disclosed. In at least one preferred implementation temporally overlapping pulse series are generated with separate pulsed laser sources, for example nanosecond (NS) and ultrashort pulse (USP) sources (NS-USP). Pulses are delivered to the material as a series of spatially and temporally overlapping pulse pairs. The material can, but need not, be a transparent material. In some applications of transparent material processing, it was found the combination of pulses both substantially more material modification and high machining quality than obtainable with either individual pulse series taken alone. Other micromachining methods and arrangement are disclosed for formation of fine features on or within a substrate. Such methods and arrangements may generally be applied with a NS-USP combination, or with other sources.
摘要翻译：在某些实施例中，公开了用于材料的基于激光的材料处理的方法和系统。在至少一个优选实施方式中，利用分离的脉冲激光源，例如纳秒（NS）和超短脉冲（USP）源（NS-USP）产生时间重叠的脉冲序列。脉冲作为一系列空间和时间重叠的脉冲对被传送到材料。材料可以但不必是透明材料。在透明材料加工的一些应用中，发现脉冲组合可以实现更多的材料修改和高的加工质量，而不是单独采用单个脉冲序列可获得的。公开了其他微加工方法和装置，用于在衬底上或衬底内形成精细特征。这些方法和装置通常可以与NS-USP组合或与其他来源一起应用。

8. 发明申请

WO2015094994A2 PROCESSING 3D SHAPED TRANSPARENT BRITTLE SUBSTRATE 审中-公开
标题翻译：加工三维透明脆性基板
公开(公告)号：WO2015094994A2
公开(公告)日：2015-06-25
申请号：PCT/US2014070234
申请日：2014-12-15
申请人： CORNING INC
发明人： MARJANOVIC SASHA , NIEBER ALBERT ROTH , PIECH GARRETT ANDREW , TSUDA SERGIO , WAGNER ROBERT STEPHEN
IPC分类号： C03B33/02
CPC分类号： C03B33/091 , B23K26/0057 , B23K26/0087 , B23K26/0622 , B23K26/0624 , B23K26/0884 , B23K26/402 , B23K26/53 , B23K2203/172 , B23K2203/50 , B23K2203/54 , B65G2249/04 , C03B23/02 , C03B23/023 , C03B23/025 , C03B33/0222 , C03B33/023 , C03B33/033 , C03B33/04 , C03B33/082 , C03B33/102 , Y02P40/57 , Y10T428/15 , Y10T428/24777
摘要： Methods are provided for laser processing arbitrary shapes of molded 3D thin transparent brittle parts from substrates with particular interest in substrates formed from strengthened or non-strengthened Corning Gorilla® glass (all codes). The developed laser methods can be tailored for manual separation of the parts from the panel or full laser separation by thermal stressing the desired profile. Methods can be used to form 3D surfaces with small radii of curvature. The method involves the utilization of an ultra-short pulse laser that may be optionally followed by a CO2 laser for fully automated separation.
摘要翻译：提供了激光加工任意形状的模制3D薄透明脆性部件的方法，这些部件与基材特别有趣，这些基材由增强或未增强的CorningGorilla®玻璃（所有代码）形成。已开发的激光方法可针对人体从面板上分离部件或通过热应力所需的轮廓进行全面激光分离而量身定制。可以使用方法来形成具有小曲率半径的3D表面。该方法涉及使用超短脉冲激光器，可以选择使用CO2激光器进行全自动分离。

9. 发明申请

WO2017123963A1 DUAL-AIRY-BEAM SYSTEMS AND METHODS FOR PROCESSING GLASS SUBSTRATES 审中-公开
标题翻译：双气流束系统和加工玻璃基材的方法
公开(公告)号：WO2017123963A1
公开(公告)日：2017-07-20
申请号：PCT/US2017/013463
申请日：2017-01-13
申请人： CORNING INCORPORATED
发明人： CHEN, Minghan , LI, Ming-Jun , LIU, Anping , PENG, Gaozhu
IPC分类号： C03B33/02 , B23K26/067 , B23K26/38 , B23K26/06 , B23K103/00
CPC分类号： C03B33/093 , B23K26/0081 , B23K26/0619 , B23K26/0673 , B23K26/38 , B23K26/402 , B23K2203/54 , C03B33/0222 , C03B33/102
摘要： Systems and methods utilizing two Airy beams to process a non-rounded edge of a glass substrate or to cleave a glass substrate are disclosed. The method includes generating first and second Airy beams and causing them to cross at a crossing to define a curved intensity profile in the vicinity of the crossing point where the first and second Airy beams have respective local radii of curvature RA and RB. The method also includes scanning the curved intensity profile either along the non-rounded outer edge or through the glass along a scan path to form on the glass substrate a rounded outer edge having a radius of curvature RE that is smaller than the first and second local radii of curvature RA and RB. The radius of curvature RE can be adjusted by changing a beam angle between the first and second Airy beams.
摘要翻译：公开了利用两个艾里梁来处理玻璃基板的非圆形边缘或切割玻璃基板的系统和方法。该方法包括产生第一和第二艾里光束并使其在交叉处交叉以在交叉点附近限定弯曲强度分布，其中第一和第二艾里光束具有各自的局部曲率半径RA和RB。该方法还包括沿着非圆形外边缘或沿着扫描路径穿过玻璃扫描弯曲强度分布，以在玻璃基板上形成具有小于第一和第二局部曲率半径RE的曲率半径的圆形外边缘曲率半径RA和RB。可以通过改变第一和第二艾里光束之间的光束角来调整曲率半径RE。

10. 发明申请

WO2014123080A1 レーザ加工装置、レーザ加工方法审中-公开
标题翻译：激光加工设备和激光加工方法
公开(公告)号：WO2014123080A1
公开(公告)日：2014-08-14
申请号：PCT/JP2014/052420
申请日：2014-02-03
申请人：株式会社ブイ・テクノロジー
发明人：水村　通伸 , 滝本　政美 , 松山　将太
IPC分类号： B23K26/382 , B23K26/046 , B23K26/06 , B23K26/08 , B23K26/082 , C03B33/09 , B28D5/00
CPC分类号： C03B33/102 , B23K26/0734 , B23K26/0823 , C03B33/0222 , C03B33/04 , C03C23/0025 , G02B7/02 , G02B19/0009 , G02B26/10 , G02B27/0927 , G02B27/0933 , G02B27/0955
摘要：レーザ光をリング状に集光してその集光位置を基板の厚さ範囲内に照射し、集光位置を基板の厚さ方向及び基板の平面方向にシフトさせる過程で、リング状の集光位置の中心が円運動するように集光位置をシフトさせることにより、装置コストの低減を図り、加工処理時間の短縮化を可能にする。
摘要翻译：在本发明中，将激光束聚焦成环状，并在基板厚度范围内照射到光束聚焦位置; 并且在光束聚焦位置沿基板厚度方向和基板平面方向偏移的过程中，光束聚焦位置移动，使得环形光束聚焦位置的中心以圆形方式。从而可以降低装置的成本和处理时间。

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