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1. 发明申请

WO2008100646A2 SINGLE AND MULTI-SPECTRAL ILLUMINATION SYSTEM AND METHOD 审中-公开
标题翻译：单和多光谱照明系统和方法
公开(公告)号：WO2008100646A2
公开(公告)日：2008-08-21
申请号：PCT/US2008/050068
申请日：2008-01-03
申请人： ILLINOIS TOOL WORKS INC. , PRINCE, David, P.
发明人： PRINCE, David, P.
CPC分类号： H05K3/1216 , G01N21/8806 , G01N21/95684 , G01N2021/8825 , G01N2021/95646 , H05K1/0268 , H05K2203/163 , Y10T29/5193
摘要： A stencil printer apparatus for depositing a solder paste onto the surface of the electronic substrate, comprising a frame, a stencil coupled to the frame, the stencil having a plurality of apertures, a dispenser coupled to the frame, the stencil and the dispenser being configured to deposit the solder paste onto the electronic substrate, an imaging system constructed and arranged to capture an image of the electronic substrate, and a controller coupled to the imaging system and configured to control movement of the imaging system to capture the image. The imaging system comprises a camera element configured to capture the image of at least the portion of the surface of the electronic substrate, and a first illumination element comprising a long-wavelength light source configured to illuminate at least the portion of the surface of the electronic substrate by generating long-wavelength light. Other embodiments and methods are disclosed.
摘要翻译：一种用于将焊膏沉积到电子基板的表面上的模版印刷装置，包括框架，耦合到框架的模板，具有多个孔的模板，耦合到框架的分配器，模板和分配器被配置将所述焊膏沉积到所述电子基板上，所述成像系统被构造和布置成捕获所述电子基板的图像;以及控制器，耦合到所述成像系统并被配置为控制所述成像系统的拍摄以捕获图像。成像系统包括被配置为捕获电子基板的表面的至少一部分的图像的相机元件，以及第一照明元件，其包括长波长光源，该长波长光源被配置为照亮电子基板的表面的至少一部分底物通过产生长波长的光。公开了其他实施例和方法。

2. 发明申请

WO2005107355A2 IMAGING AND INSPECTION SYSTEM FOR A DISPENSER AND METHOD FOR SAME 审中-公开
标题翻译：用于分配器的成像和检查系统及其方法
公开(公告)号：WO2005107355A2
公开(公告)日：2005-11-10
申请号：PCT/US2005/013763
申请日：2005-04-22
申请人： SPEEDLINE TECHNOLOGIES, INC. , PRENTICE, Thomas, C. , PRINCE, David, P.
发明人： PRENTICE, Thomas, C. , PRINCE, David, P.
IPC分类号： H05K13/08
CPC分类号： H05K13/0469 , H05K13/08
摘要： Aspects of the invention are directed to systems and methods for dispensing materials onto a substrate. In one aspect, a dispensing system includes a dispenser having a dispensing outlet positionable over a top surface of the substrate, the dispenser having a substantially vertical dispensing axis along which material from the dispenser is dispensed, and a vision system, coupled to the dispenser, the vision system being positionable to obtain images of the top surface of the substrate along an optical axis, wherein the vision system is constructed and arranged such that the optical axis intersects the dispensing axis.
摘要翻译：本发明的方面涉及用于将材料分配到基底上的系统和方法。在一个方面，分配系统包括分配器，分配器可定位在衬底的顶表面上，分配器具有基本上垂直的分配轴线，分配器从其分配材料，以及耦合到分配器的视觉系统，所述视觉系统可定位成沿着光轴获得所述基底的顶表面的图像，其中所述视觉系统被构造和布置成使得所述光轴与所述分配轴相交。

3. 发明申请

WO2005083402A1 SYSTEMS AND METHODS FOR DETECTING DEFECTS IN PRINTED SOLDER PASTE 审中-公开
标题翻译：用于检测印刷的焊膏中的缺陷的系统和方法
公开(公告)号：WO2005083402A1
公开(公告)日：2005-09-09
申请号：PCT/US2005/004823
申请日：2005-02-15
申请人： SPEEDLINE TECHNOLOGIES, INC. , PRINCE, David, P.
发明人： PRINCE, David, P.
IPC分类号： G01N21/956
CPC分类号： G01N21/95607 , B23K3/08 , B23K2201/40 , G06T7/0006 , G06T2207/30152 , H05K1/0269 , H05K3/1216 , H05K3/1233 , H05K3/26 , H05K3/3484 , H05K2203/0126 , H05K2203/163
摘要： A method of inspecting a stencil having apertures through which a substance is deposited onto an electronic substrate includes depositing the substance through the stencil and onto the substrate, capturing a first image of the stencil after the deposit of the substance and detecting variations in texture of the substance in the first image, capturing a second image of the electronic substrate having the substance on its surface and detecting variations in texture of the substance in the second image, defining a region of interest in the first image and in the second image to determine whether at least one feature exists in the region of interest, measuring a first span of the at least one feature in the region of interest in the second image, and correlating the first span of the at least one feature and the second span of the at least one feature to determine whether a threshold span of the at least one feature has been reached.
摘要翻译：检查具有孔的模板的方法，物质沉积在电子基板上，包括通过模板沉积物质并沉积到基底上，在沉积物质之后捕获模板的第一图像并检测物质的变化在第一图像中捕获物质，捕获在其表面上具有物质的电子基板的第二图像，并检测第二图像中的物质的质地变化，限定第一图像和第二图像中的感兴趣区域，以确定是否在感兴趣区域中存在至少一个特征，测量第二图像中感兴趣区域中的至少一个特征的第一跨度，并且将至少一个特征的第一跨度与至少一个特征的第二跨度相关联确定是否已达到至少一个特征的阈值跨度的一个特征。

4. 发明申请

WO2007092325A3 OPTIMAL IMAGING SYSTEM AND METHOD FOR A STENCIL PRINTER 审中-公开
公开(公告)号：WO2007092325A3
公开(公告)日：2007-08-16
申请号：PCT/US2007/002925
申请日：2007-02-01
申请人： SPEEDLINE TECHNOLOGIES, INC. , PRINCE, David, P.
发明人： PRINCE, David, P.
IPC分类号： H05K3/12 , B41F15/08 , G01N21/84
摘要： A stencil printer for depositing solder paste onto an electronic substrate includes a frame and a stencil coupled to the frame. A dispenser is coupled to the frame, with the dispenser and the stencil being configured to deposit solder paste onto the plurality of pads of the electronic substrate. An imaging system is configured to capture images of regions of interest of at least one of the electronic substrate and the stencil. The stencil printer further includes a controller coupled to the imaging system, with the controller being configured to control movement of the imaging system to capture images of regions of interest (86) of at least one of the electronic substrate and the stencil extending generally along a first axis (84) before moving the imaging system in another direction. A method for dispensing material on a substrate is further disclosed.

5. 发明申请

WO2005059823A2 SYSTEMS AND METHODS FOR DETECTING DEFECTS IN PRINTED SOLDER PASTE 审中-公开
标题翻译：用于检测印刷的焊膏中的缺陷的系统和方法
公开(公告)号：WO2005059823A2
公开(公告)日：2005-06-30
申请号：PCT/US2004/041462
申请日：2004-12-10
申请人： SPEEDLINE TECHNOLOGIES, INC. , PRINCE, David, P.
发明人： PRINCE, David, P.
IPC分类号： G06T
CPC分类号： G06T7/0004 , B23K1/0016 , B23K3/08 , B23K31/12 , B23K2201/40 , B23K2201/42 , G01N21/95607 , G01N21/95684 , G01N2021/95646 , G01N2021/95669 , G06T7/44 , G06T2207/30152 , H05K1/0269 , H05K3/1216 , H05K3/3484 , H05K2203/0126
摘要： A method of analyzing an image of a substance deposited onto a substrate, the image comprising a plurality of pixels, includes defning a region of interest in the image, associating the region of interest with first and second perpendicular axis, wherein a set of pixels in the image lie along the first axis, converting the pixels in the region of interest to a single dimensional array aligned with the first axis and projecting along the second axis, and applying at least one threshold to the single dimensional array, the threshold based at least in part on a predetermined limit.
摘要翻译：一种分析沉积在衬底上的物质的图像的方法，所述图像包括多个像素，包括定义所述图像中的感兴趣区域，将感兴趣区域与第一和第二垂直轴相关联，其中，一组像素图像沿着第一轴线位于第一轴上，将感兴趣区域中的像素转换为与第一轴对齐并且沿着第二轴线突出的单维阵列，并且将至少一个阈值应用于单维阵列，该阈值至少基于部分地在预定的限制上。

6. 发明申请

WO2007089917A1 OFF-AXIS ILLUMINATION ASSEMBLY AND METHOD 审中-公开
标题翻译：离轴照明组件和方法
公开(公告)号：WO2007089917A1
公开(公告)日：2007-08-09
申请号：PCT/US2007/002815
申请日：2007-02-01
申请人： SPEEDLINE TECHNOLOGIES, INC. , PRINCE, David, P.
发明人： PRINCE, David, P.
IPC分类号： G01N21/956 , H05K3/12
CPC分类号： G01N21/95684 , B41P2215/00 , B41P2215/11 , G01N2021/8825 , H05K1/0269 , H05K3/1233 , H05K2203/163
摘要： A stencil printer is provided for depositing solder paste onto a surface of an electronic substrate. The stencil printer includes a frame and a stencil coupled to the frame. The stencil has a plurality of apertures formed therein. The stencil printer further includes a dispenser coupled to the frame. The stencil and the dispenser are adapted to deposit solder paste onto the electronic substrate. The stencil printer further includes an imaging system constructed and arranged to capture an image of the electronic substrate. The imaging system includes a camera assembly, an on-axis illumination assembly adapted to generate light substantially along a first axis generally perpendicular to the surface of the electronic substrate, and an off- axis illumination assembly adapted to generate rays of light substantially along a second axis extending at an angle with respect to the first axis. A controller is coupled to the imaging system to control movement of the imaging system to capture an image.
摘要翻译：提供了一种用于将焊膏沉积到电子基板的表面上的模版印刷机。模板印刷机包括框架和联接到框架的模板。模板具有形成在其中的多个孔。模板印刷机还包括耦合到框架的分配器。模板和分配器适于将焊膏沉积到电子基板上。模板印刷机还包括构造和布置成捕获电子基板的图像的成像系统。成像系统包括照相机组件，适于基本上沿着大致垂直于电子基板的表面的第一轴产生光的轴上照明组件，以及适于基本上沿着第二部分产生光线的离轴照明组件轴线相对于第一轴线成一定角度延伸。控制器耦合到成像系统以控制成像系统的移动以捕获图像。

7. 发明申请

WO2007056268A1 IMAGING SYSTEM AND METHOD FOR A STENCIL PRINTER 审中-公开
标题翻译：图像打印机的成像系统和方法
公开(公告)号：WO2007056268A1
公开(公告)日：2007-05-18
申请号：PCT/US2006/043166
申请日：2006-11-06
申请人： SPEEDLINE TECHNOLOGIES, INC. , PRINCE, David, P.
发明人： PRINCE, David, P.
IPC分类号： H05K3/12
CPC分类号： B23K3/0638 , B23K2201/40 , G01N21/95684 , G01N2021/95646 , H05K1/0269 , H05K3/1216
摘要： A stencil printer for depositing solder paste onto a plurality of pads of an electronic substrate includes a frame and a stencil coupled to the frame. The stencil has a plurality of apertures formed therein. The stencil printer further includes a support assembly coupled to the frame, the support assembly supporting the electronic substrate in a printing position. An imaging system is adapted to capture images of multiple areas of one of the electronic substrate and the stencil. A controller, coupled to the imaging system, is adapted to control movement of the imaging system to capture an image of an area while maintaining a minimum velocity above zero when capturing the image of the area. Methods for dispensing solder paste on a substrate and for inspecting the substrate are further disclosed.
摘要翻译：用于将焊膏沉积到电子基板的多个焊盘上的模版印刷机包括框架和耦合到框架的模版。模板具有形成在其中的多个孔。模板印刷机还包括联接到框架的支撑组件，支撑组件在打印位置支撑电子基板。成像系统适于捕获电子基板和模板之一的多个区域的图像。耦合到成像系统的控制器适于控制成像系统的移动以捕获区域的图像，同时在捕获区域的图像的同时保持高于零的最小速度。进一步公开了在基板上分配焊膏并检查基板的方法。

8. 发明申请

WO2005122658A1 SOLDER PASTE LATERAL FLOW AND REDISTRIBUTION SYSTEM AND METHODS OF SAME 审中-公开
标题翻译：焊膏边缘流动和再分配系统及其方法
公开(公告)号：WO2005122658A1
公开(公告)日：2005-12-22
申请号：PCT/US2005/018844
申请日：2005-05-27
申请人： SPEEDLINE TECHNOLOGIES, INC. , PHAM-VAN-DIEP, Gerald, C. , PRINCE, David, P.
发明人： PHAM-VAN-DIEP, Gerald, C. , PRINCE, David, P.
IPC分类号： H05K3/12
CPC分类号： H05K3/1233 , B41F15/0818 , B41F15/44 , H05K2203/0139
摘要： An apparatus and methods for depositing material on a surface of an electronic substrate are provided and include a squeegee device or system for distributing material to be deposited on the electronic substrate. The squeegee device or system can include a first wiping blade (62) and a second wiping blade (63) spaced from and parallel to the first wiping blade. The first wiping blade and the second wiping blade are disposed at an angle (64) relative to a vertical axis (66,68), the vertical axis being perpendicular to a surface of an electronic substrate, such that when the first and the second wiping blades (62, 63) contact a surface (23) of a stencil (20) to deposit or print the material onto the electronic substrate, the first and the second wiping blades contact the stencil surface at a rake angle relative to a direction in which the squeegee device traverses the stencil surface.
摘要翻译：提供了一种用于在电子基板的表面上沉积材料的装置和方法，并且包括用于分配待沉积在电子基板上的材料的刮板装置或系统。刮板装置或系统可以包括与第一擦拭刮板间隔开并平行的第一擦拭刮板（62）和第二擦拭刮板（63）。第一擦拭刀片和第二擦拭刀片相对于垂直轴线（66,68）以一定角度（64）设置，垂直轴垂直于电子基片的表面，使得当第一次和第二次擦拭叶片（62,63）接触模板（20）的表面（23）以将材料沉积或印刷到电子基板上，第一和第二擦拭叶片以相对于其中的方向的前角以前角接触模板表面刮板装置穿过模板表面。

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