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    • 1. 发明申请
    • SINGLE AND MULTI-SPECTRAL ILLUMINATION SYSTEM AND METHOD
    • 单和多光谱照明系统和方法
    • WO2008100646A2
    • 2008-08-21
    • PCT/US2008/050068
    • 2008-01-03
    • ILLINOIS TOOL WORKS INC.PRINCE, David, P.
    • PRINCE, David, P.
    • H05K3/1216G01N21/8806G01N21/95684G01N2021/8825G01N2021/95646H05K1/0268H05K2203/163Y10T29/5193
    • A stencil printer apparatus for depositing a solder paste onto the surface of the electronic substrate, comprising a frame, a stencil coupled to the frame, the stencil having a plurality of apertures, a dispenser coupled to the frame, the stencil and the dispenser being configured to deposit the solder paste onto the electronic substrate, an imaging system constructed and arranged to capture an image of the electronic substrate, and a controller coupled to the imaging system and configured to control movement of the imaging system to capture the image. The imaging system comprises a camera element configured to capture the image of at least the portion of the surface of the electronic substrate, and a first illumination element comprising a long-wavelength light source configured to illuminate at least the portion of the surface of the electronic substrate by generating long-wavelength light. Other embodiments and methods are disclosed.
    • 一种用于将焊膏沉积到电子基板的表面上的模版印刷装置,包括框架,耦合到框架的模板,具有多个孔的模板,耦合到框架的分配器,模板和分配器被配置 将所述焊膏沉积到所述电子基板上,所述成像系统被构造和布置成捕获所述电子基板的图像;以及控制器,耦合到所述成像系统并被配置为控制所述成像系统的拍摄以捕获图像。 成像系统包括被配置为捕获电子基板的表面的至少一部分的图像的相机元件,以及第一照明元件,其包括长波长光源,该长波长光源被配置为照亮电子基板的表面的至少一部分 底物通过产生长波长的光。 公开了其他实施例和方法。
    • 3. 发明申请
    • SYSTEMS AND METHODS FOR DETECTING DEFECTS IN PRINTED SOLDER PASTE
    • 用于检测印刷的焊膏中的缺陷的系统和方法
    • WO2005083402A1
    • 2005-09-09
    • PCT/US2005/004823
    • 2005-02-15
    • SPEEDLINE TECHNOLOGIES, INC.PRINCE, David, P.
    • PRINCE, David, P.
    • G01N21/956
    • G01N21/95607B23K3/08B23K2201/40G06T7/0006G06T2207/30152H05K1/0269H05K3/1216H05K3/1233H05K3/26H05K3/3484H05K2203/0126H05K2203/163
    • A method of inspecting a stencil having apertures through which a substance is deposited onto an electronic substrate includes depositing the substance through the stencil and onto the substrate, capturing a first image of the stencil after the deposit of the substance and detecting variations in texture of the substance in the first image, capturing a second image of the electronic substrate having the substance on its surface and detecting variations in texture of the substance in the second image, defining a region of interest in the first image and in the second image to determine whether at least one feature exists in the region of interest, measuring a first span of the at least one feature in the region of interest in the second image, and correlating the first span of the at least one feature and the second span of the at least one feature to determine whether a threshold span of the at least one feature has been reached.
    • 检查具有孔的模板的方法,物质沉积在电子基板上,包括通过模板沉积物质并沉积到基底上,在沉积物质之后捕获模板的第一图像并检测物质的变化 在第一图像中捕获物质,捕获在其表面上具有物质的电子基板的第二图像,并检测第二图像中的物质的质地变化,限定第一图像和第二图像中的感兴趣区域,以确定是否 在感兴趣区域中存在至少一个特征,测量第二图像中感兴趣区域中的至少一个特征的第一跨度,并且将至少一个特征的第一跨度与至少一个特征的第二跨度相关联 确定是否已达到至少一个特征的阈值跨度的一个特征。
    • 4. 发明申请
    • OPTIMAL IMAGING SYSTEM AND METHOD FOR A STENCIL PRINTER
    • 最佳成像系统和方法打印机
    • WO2007092325A2
    • 2007-08-16
    • PCT/US2007002925
    • 2007-02-01
    • SPEEDLINE TECHNOLOGIES INCPRINCE DAVID P
    • PRINCE DAVID P
    • H05K3/1216B23K3/0638B23K2201/40B41P2215/11G01N2021/95646H05K1/0269H05K3/0008H05K3/3484H05K2203/163
    • A stencil printer for depositing solder paste onto an electronic substrate includes a frame and a stencil coupled to the frame. A dispenser is coupled to the frame, with the dispenser and the stencil being configured to deposit solder paste onto the plurality of pads of the electronic substrate. An imaging system is configured to capture images of regions of interest of at least one of the electronic substrate and the stencil. The stencil printer further includes a controller coupled to the imaging system, with the controller being configured to control movement of the imaging system to capture images of regions of interest of at least one of the electronic substrate and the stencil extending generally along a first axis before moving the imaging system in another direction. A method for dispensing material on a substrate is further disclosed.
    • 用于将焊膏沉积到电子基板上的模版印刷机包括框架和耦合到框架的模版。 分配器联接到框架,分配器和模板被配置为将焊膏沉积到电子基板的多个焊盘上。 成像系统被配置为捕获电子基板和模板中的至少一个的感兴趣区域的图像。 模板打印机还包括耦合到成像系统的控制器,其中控制器被配置为控制成像系统的移动,以捕获通常沿着第一轴延伸的电子基板和模板中的至少一个的感兴趣区域的图像 将成像系统移动到另一个方向。 进一步公开了一种在衬底上分配材料的方法。
    • 5. 发明申请
    • SINGLE AND MULTI-SPECTRAL ILLUMINATION SYSTEM AND METHOD
    • 单和多光谱照明系统和方法
    • WO2008100646A3
    • 2009-01-08
    • PCT/US2008050068
    • 2008-01-03
    • ILLINOIS TOOL WORKSPRINCE DAVID P
    • PRINCE DAVID P
    • H05K13/04H05K13/08
    • H05K3/1216G01N21/8806G01N21/95684G01N2021/8825G01N2021/95646H05K1/0268H05K2203/163Y10T29/5193
    • A stencil printer apparatus for depositing a solder paste onto the surface of the electronic substrate, comprising a frame, a stencil coupled to the frame, the stencil having a plurality of apertures, a dispenser coupled to the frame, the stencil and the dispenser being configured to deposit the solder paste onto the electronic substrate, an imaging system (121) constructed and arranged to capture an image of the electronic substrate, and a controller coupled to the imaging- system and configured to control movement of the imaging system to capture the image. The imaging system (121) comprises a camera element (201, 203) configured to capture the image of at least the portion of the surface of the electronic substrate (111), and a first illumination element (209) comprising a long-wavelength light source configured to illuminate at least the portion of the surface of the electronic substrate by generating long-wavelength light. Other embodiments and methods are disclosed.
    • 一种用于将焊膏沉积到电子基板的表面上的模版印刷装置,包括框架,耦合到框架的模板,具有多个孔的模板,耦合到框架的分配器,模板和分配器被配置 将焊膏沉积到电子基板上,构造和布置成捕获电子基板的图像的成像系统(121)和耦合到成像系统并被配置为控制成像系统的拍摄以捕获图像的控制器 。 成像系统(121)包括被配置为捕获电子基板(111)的至少部分表面的图像的照相机元件(201,203)和包括长波长光的第一照明元件(209) 源被配置为通过产生长波长的光来照亮电子基板的表面的至少一部分。 公开了其他实施例和方法。