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1. 发明申请

WO2016086410A1 HIGH PERFORMANCE THERMAL INTERFACE MATERIALS WITH LOW THERMAL IMPEDANCE 审中-公开
标题翻译：具有低耐热性能的高性能热界面材料
公开(公告)号：WO2016086410A1
公开(公告)日：2016-06-09
申请号：PCT/CN2014/093138
申请日：2014-12-05
申请人： HONEYWELL INTERNATIONAL INC. , ZHANG, Bright , SHEN, Ling , WANG, Hui , LIU, Ya Qun , WANG, Wei Jun , HUANG, Hong Min
发明人： ZHANG, Bright , SHEN, Ling , WANG, Hui , LIU, Ya Qun , WANG, Wei Jun , HUANG, Hong Min
IPC分类号： C09K5/14
CPC分类号： C09K5/066 , C09K5/063 , C09K5/14 , H01L23/3737 , H01L2224/16225 , H01L2224/73204 , H01L2224/73253
摘要： A thermal interface material includes, in one exemplary embodiment, a polymer, a phase change material, a first thermally conductive filler having a first particle size, and a second thermally conductive filler having a second particle size. The first particle size is larger than the second particle size. A formulation for forming a thermal interface material and an electronic component including a thermal interface material are also provided.
摘要翻译：在一个示例性实施例中，热界面材料包括聚合物，相变材料，具有第一粒度的第一导热填料和具有第二粒径的第二导热填料。第一粒径大于第二粒径。还提供了一种用于形成热界面材料的配方和包括热界面材料的电子部件。

2. 发明申请

WO2015120773A1 COMPRESSIBLE THERMAL INTERFACE MATERIALS 审中-公开
标题翻译：可接受的热界面材料
公开(公告)号：WO2015120773A1
公开(公告)日：2015-08-20
申请号：PCT/CN2015/072202
申请日：2015-02-04
申请人： HONEYWELL INTERNATIONAL INC. , ZENG, Liang , LIU, Ya Qun , CHANG, Jerry , ZHANG, Bright , DING, Zhe , WANG, Wei Jun , HUANG, Hong Min
发明人： ZENG, Liang , LIU, Ya Qun , CHANG, Jerry , ZHANG, Bright , DING, Zhe , WANG, Wei Jun , HUANG, Hong Min
IPC分类号： C09K5/06 , H01L23/373
CPC分类号： H01L23/3737 , C09K5/063 , H01L23/367 , H01L23/42 , H01L2924/0002 , H01L2924/00
摘要： Provided is a compressible thermal interface material including a polymer, a thermally conductive filler, and a phase change material. A formulation for forming a compressible thermal interface material and an electronic component including a compressible thermal interface material are also provided.
摘要翻译：提供了包括聚合物，导热填料和相变材料的可压缩热界面材料。还提供了用于形成可压缩热界面材料的配方和包括可压缩热界面材料的电子部件。

3. 发明申请

WO2017152353A1 PHASE CHANGE MATERIAL 审中-公开
标题翻译：相变材料
公开(公告)号：WO2017152353A1
公开(公告)日：2017-09-14
申请号：PCT/CN2016/075827
申请日：2016-03-08
申请人： HONEYWELL INTERNATIONAL INC. , ZHANG, Bright , WANG, Wei Jun , LIU, Ya Qun , HUANG, Hong Min
发明人： ZHANG, Bright , WANG, Wei Jun , LIU, Ya Qun , HUANG, Hong Min
IPC分类号： C09K5/00
摘要： A thermal interface material includes, in one exemplary embodiment, at least one polymer, at least one phase change material, at least one crosslinker, and at least one thermally conductive filler. The at least one thermally conductive includes a first plurality of particles having a particle diameter of about 1 micron or less. The at least one thermally conductive filler comprises at least 80wt.％ of the total weight of the thermal interface material. A formulation for forming a thermal interface material and an electronic component including a thermal interface material are also provided.
摘要翻译：在一个示例性实施例中，热界面材料包括至少一种聚合物，至少一种相变材料，至少一种交联剂和至少一种导热填料。所述至少一种导热材料包括具有约1微米或更小的粒径的第一多个颗粒。所述至少一种导热填料占所述热界面材料总重量的至少80重量％。还提供了用于形成热界面材料的配方和包括热界面材料的电子元件。

4. 发明申请

WO2016004565A1 THERMAL INTERFACE MATERIAL WITH ION SCAVENGER 审中-公开
标题翻译：热接口材料与离子扫描仪
公开(公告)号：WO2016004565A1
公开(公告)日：2016-01-14
申请号：PCT/CN2014/081724
申请日：2014-07-07
申请人： HONEYWELL INTERNATIONAL INC. , LIU, Ya Qun , ZENG, Liang , WANG, Hui , ZHANG, Bright , HUANG, Hong Min
发明人： LIU, Ya Qun , ZENG, Liang , WANG, Hui , ZHANG, Bright , HUANG, Hong Min
IPC分类号： C08K5/29 , C08K5/25 , C08K3/22 , B32B27/18
CPC分类号： C09K5/14 , C08K13/02 , C08K2201/001 , C08L23/0815 , C08L2201/08 , C08L2203/20 , C09K5/063 , C09K15/06 , C09K15/22 , C09K15/24 , C09K15/30 , G06F1/20 , H01L23/3675 , H01L23/3737 , H01L23/42 , H01L24/32 , H01L2224/2929 , H01L2224/29309 , H01L2224/29311 , H01L2224/29316 , H01L2224/29318 , H01L2224/29324 , H01L2224/29339 , H01L2224/29347 , H01L2224/29355 , H01L2224/29387 , H01L2224/2939 , H01L2224/29393 , H01L2224/32245 , H01L2924/0002 , H01L2924/0503 , H01L2924/05032 , H01L2924/05042 , H01L2924/0542 , H01L2924/05432 , H01L2924/0544 , H01L2924/12041 , H01L2924/1432 , H05K7/2039 , H01L2924/00
摘要： A thermal interface material includes at least one polymer,at least one thermally conductive filler; and at least one ion scavenger. In some embodiments, the ion scavenger is a complexing agent selected from the group consisting of : nitrogen containing complexing agents,phosphorus containing complexing agents, and hydroxyl carboxylic acid based complexing agents.
摘要翻译：热界面材料包括至少一种聚合物，至少一种导热填料; 和至少一种离子清除剂。在一些实施方案中，离子清除剂是选自以下的络合剂：含氮络合剂，含磷络合剂和基于羟基羧酸的络合剂。

5. 发明申请

WO2013026177A1 PHOSPHOROUS-COMPRISING DOPANTS, METHODS FOR FORMING PHOSPHOROUS-DOPED REGIONS IN SEMICONDUCTOR SUBSTRATES USING SUCH PHOSPHOROUS-COMPRISING DOPANTS, AND METHODS FOR FORMING SUCH PHOSPHOROUS-COMPRISING DOPANTS 审中-公开
标题翻译：磷光体包裹体，使用这种含磷光体聚合物形成在半导体衬底中的磷光体区域的方法，以及形成这种含磷光体的方法
公开(公告)号：WO2013026177A1
公开(公告)日：2013-02-28
申请号：PCT/CN2011/001392
申请日：2011-08-22
申请人： HONEYWELL INTERNATIONAL INC. , HUANG, Hongmin , GAO, Carol , DING, Zhe , PENG, Albert , LIU, Ya Qun , ZHANG, Bright
发明人： HUANG, Hongmin , GAO, Carol , DING, Zhe , PENG, Albert , LIU, Ya Qun , ZHANG, Bright
IPC分类号： H01L21/24 , H01L21/228
CPC分类号： H01L21/2225 , H01L21/2254
摘要： Substantially silane-free phosphorous-comprising dopants, methods for forming phosphorous-doped regions in a semiconductor material using substantially silane-free phosphorous-comprising dopants, and a method for fabricating substantially silane-free phosphorous-comprising dopants are provided. A phosphorous-comprising dopant comprises a phosphorous source comprising a phosphorous-comprising salt, a phosphorous-comprising acid, phosphorous-comprising anions, or combinations thereof, an alkaline material, cations from an alkaline material, or combinations thereof, and a liquid medium. The phosphorous-comprising dopant comprises less than 0.1wt.% silanes, oligomers and/or polymers derived from silanes, or a combination thereof.
摘要翻译：基本上不含硅烷的含磷掺杂剂，使用基本上不含硅烷的含磷掺杂剂在半导体材料中形成磷掺杂区域的方法以及基本上不含硅烷的含磷掺杂剂的制造方法。含磷掺杂剂包括磷源，其包含含磷的盐，含磷的酸，含磷的阴离子或其组合，碱性材料，来自碱性材料的阳离子或其组合，以及液体介质。含磷掺杂剂包含小于0.1重量％的硅烷，衍生自硅烷的低聚物和/或聚合物，或其组合。

6. 发明申请

WO2015038454A1 POLY FLUORINE-CONTAINING SILOXANE COATINGS 审中-公开
标题翻译：含氟聚硅氧烷涂料
公开(公告)号：WO2015038454A1
公开(公告)日：2015-03-19
申请号：PCT/US2014/054481
申请日：2014-09-08
申请人： HONEYWELL INTERNATIONAL INC.
发明人： LIU, Ya Qun , ZHANG, Bright , DUAN, Huifeng , JIANG, Wanchao , JIANG, Yunzi , DING, Zhe , CHEN, David K. , SHEN, Yanming , WANG, Wei Jun
IPC分类号： C09D183/04 , C08L83/04
CPC分类号： C09D183/08 , C08G77/24
摘要： Poly fluorine-containing siloxane coatings having improved hydrophobic and oleophobic properties and solutions for creating such coatings are provided. In some embodiments, the coating includes a polymer having a plurality of Si-O-Si linkages; and at least two fluorine-containing moieties, each attached to at least one of the Si-O-Si linkages. Each fluorine-containing moiety independently includes a linking portion attached to a silicon of one of the Si-O-Si linkages, wherein the linking portion is of a formula selected from the group consisting of: -[CH 2 ] a - where a is an integer from 1 to 10 and -[CH 2 ] b CONH[CH 2 ] c - where b and c are independently an integer from 0 to 10. Each fluorine-containing moiety also independently includes a fluorinated portion attached to the linking portion, wherein the fluorinated portion is selected from a fluorinated-alkyl group having 1-10 carbon atoms and a perfluoro-ether containing organic group.
摘要翻译：提供了具有改进的疏水性和疏油性的聚氟硅氧烷涂料和用于产生这种涂层的溶液。在一些实施方案中，涂层包括具有多个Si-O-Si键的聚合物; 和至少两个含氟部分，各自连接至至少一个Si-O-Si键。每个含氟部分独立地包括连接到Si-O-Si键之一的硅的连接部分，其中连接部分具有选自： - [CH 2] a - 的化合物，其中a是 1〜10的整数， - [CH 2] bCONH [CH 2] c - ，其中b和c独立地为0〜10的整数。各含氟部分也独立地包含与连接部分连接的氟化部分，选自具有1-10个碳原子的氟化烷基和含全氟醚的有机基团。

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