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    • 2. 发明申请
    • NICKEL-SILICIDE FORMATION WITH DIFFERENTIAL PT COMPOSITION
    • 具有差异PT组成的镍 - 硅化物形成
    • WO2011084339A3
    • 2011-09-09
    • PCT/US2010059607
    • 2010-12-09
    • IBMFRYE ASASIMON ANDREW
    • FRYE ASASIMON ANDREW
    • H01L21/336H01L21/24H01L29/78
    • H01L21/28518H01L29/665
    • Embodiments of the invention provide a method of forming nickel-silicide. The method may include depositing first and second metal layers (105, 106) over at least one of a gate, a source, and a drain region of a field-effect-transistor (FET) (100) through a physical vapor deposition (PVD) process, wherein the first metal layer (105) is deposited using a first nickel target material containing platinum (Pt), and the second metal layer (106) is deposited on top of the first metal layer using a second nickel target material containing no or less platinum than that in the first nickel target material; and annealing the first and second metal layers covering the FET to form a platinum-containing nickel- silicide layer (107) at a top surface of the gate, source, and drain regions.
    • 本发明的实施例提供一种形成硅化镍的方法。 该方法可以包括通过物理气相沉积(PVD)在场效应晶体管(FET)(100)的栅极,源极和漏极区域中的至少一个上沉积第一和第二金属层(105,106) )工艺,其中使用包含铂(Pt)的第一镍靶材料沉积第一金属层(105),并且使用不含第二金属层的第二镍靶材料将第二金属层(106)沉积在第一金属层的顶部 或更少的铂; 以及退火覆盖所述FET的所述第一和第二金属层,以在所述栅极,源极和漏极区域的顶表面处形成含铂的硅化镍层(107)。
    • 3. 发明申请
    • THERMALLY INDUCED PHASE SWITCH FOR LASER THERMAL PROCESSING
    • 用于激光热处理的热诱导相开关
    • WO02023279A1
    • 2002-03-21
    • PCT/US2001/042075
    • 2001-09-07
    • G03G5/16H01L21/265H01L21/268H01L21/24
    • H01L21/268G03G5/16
    • A method, apparatus and system for controlling the amount of heat transferred to a process region (30) of a workpiece (W) from exposure with a pulse of radiation (10), which may be in the form of a scanning beam (B), using a thermally induced phase switch layer (60). The apparatus of the invention is a film stack (6) having an absorber layer (50) deposited atop the workpiece, such as a silicon wafer. A portion of the absorber layer covers the process region. The absorber layer absorbs radiation and converts the absorbed radiation into heat. The phase switch layer is deposited above or below the absorber layer. The phase switch layer may comprise one or more thin film layers, and may include a thermal insulator layer and a phase transition layer. Because they are in close proximity, the portion of the phase switch layer covering the process region has a temperature that is close to the temperature of the process region. The phase of the phase switch layer changes from a first phase (e.g., solid) to a second phase (e.g., liquid or vapor) at a phase transition temperature (Tp). During this phase change, the phase switch layer absorbs heat but does not significantly change temperature. This limits the temperature of the absorber layer and the process region since both are close to the phase change layer.
    • 一种用于控制从辐射脉冲(10)暴露于工件(W)的处理区域(30)的热量的方法,装置和系统,其可以是扫描光束(B)的形式, ,使用热感应相位层(60)。 本发明的装置是具有沉积在工件上方的诸如硅晶片的吸收层(50)的薄膜叠层(6)。 吸收层的一部分覆盖工艺区域。 吸收层吸收辐射并将吸收的辐射转化成热。 相位开关层沉积在吸收层的上方或下方。 相位开关层可以包括一个或多个薄膜层,并且可以包括绝热层和相变层。 由于它们非常接近,覆盖处理区域的相位开关层的部分具有接近处理区域的温度的温度。 在相转变温度(Tp)下,相位开关层的相位从第一相(例如,固体)变为第二相(例如,液体或蒸气)。 在该相变期间,相开关层吸热,但不会明显改变温度。 这限制了吸收层和工艺区域的温度,因为它们都接近于相变层。
    • 4. 发明申请
    • SEMICONDUCTOR LASER
    • 半导体激光器
    • WO01037387A1
    • 2001-05-25
    • PCT/JP2000/008067
    • 2000-11-16
    • H01S5/20H01L21/24H01S5/02H01S5/042H01S5/22H01S5/343
    • H01S5/22B82Y20/00H01S5/0211H01S5/0212H01S5/0421H01S5/0425H01S5/2022H01S5/2216H01S5/34313
    • A semiconductor laser element (30) comprises an n-type GaAs substrate (32) having a band gap energy of Eg1, on which are epitaxially grown an n-type AlGaAs cladding layer (34), an active layer (36) formed as a 2-layer quantum-well structure of InGaAs and GaAs and having a band gap energy of Eg2 smaller than Eg1, a p-type AlGaAs cladding layer (38), and a p-type GaAs cap layer (40). The cap layer and the p-type cladding layer have stripe mesa structures. Passivation film (42) of SiN is formed in the areas except on the cap layer, and a p-side electrode (44) is formed on exposed part of the cap layer and the passivation film. An n-side electrode (46) consisting of a metal laminate of In/AuGe/Ni/Au is formed on the back of the substrate, and an InGaAs layer (48) lies as an absorber medium between the GaAs substrate and the n-type electrode.
    • 半导体激光器元件(30)包括具有Eg1的带隙能量的n型GaAs衬底(32),在其上外延生长n型AlGaAs覆层(34),有源层(36)形成为 具有小于Eg1的Eg2的带隙能量,p型AlGaAs覆层(38)和p型GaAs覆盖层(40)的InGaAs和GaAs的2层量子阱结构。 盖层和p型覆层具有条状台面结构。 在除了盖层之外的区域中形成SiN的钝化膜(42),并且在盖层和钝化膜的暴露部分上形成p侧电极(44)。 在衬底的背面形成由In / AuGe / Ni / Au的金属层压体构成的n侧电极(46),并且在GaAs衬底和n型衬底之间形成InGaAs层(48)作为吸收介质, 型电极。