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    • 8. 发明申请
    • POLYIMIDE FILM WITH IMPROVED ADHESIVENESS
    • 具有改善粘性的聚酰亚胺膜
    • WO2008082152A1
    • 2008-07-10
    • PCT/KR2007/006882
    • 2007-12-27
    • SKC CO., LTD.KIM, Do KyoungKIM, Min Ju
    • KIM, Do KyoungKIM, Min Ju
    • C08J5/18
    • C08J5/18C08G73/1064C08G73/1067C08J2379/08H05K1/0346
    • A polyimide film derived from a polyamic acid resin obtained by copolymerization of an aromatic acid dianhydride component and an aromatic diamine component comprising 5 to 60 mole% of a diamine having a sulfonyl group in its main chain based on the total mole of the aromatic diamine component has a Young¡¯s modulus of 4.5 to 9.5 GPa, a tensile strength at breakage of 15 to 30 kgf/§±, a tensile elongation at breakage of 25 to 60%, and a ratio of the tensile strength at breakage to the yield strength of less than 1.35. Therefore, the polyimide film exhibits improved adhesive strength with metal, flexural endurance and punching characteristics, and thus, can be efficiently used in electronic devices.
    • 一种聚酰亚胺膜,其衍生自通过芳族二酸酐组分和芳族二胺组分共聚而得到的聚酰胺酸树脂,所述芳族二胺组分包含5-60%(摩尔)主链中具有磺酰基的二胺,基于芳族二胺组分 杨氏模量为4.5〜9.5GPa,断裂拉伸强度为15〜30kgf /§±,断裂时的拉伸伸长率为25〜60%,断裂时的拉伸强度与屈服强度的比 强度小于1.35。 因此,聚酰亚胺膜与金属的粘合强度提高,弯曲耐久性和冲孔特性,因此可以有效地用于电子装置。