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1. 发明申请

WO2016100662A1 LIGHT EMITTING DIODE ARRAY ON A BACKPLANE AND METHOD OF MAKING THEREOF 审中-公开
标题翻译：背板上的发光二极管阵列及其制作方法
公开(公告)号：WO2016100662A1
公开(公告)日：2016-06-23
申请号：PCT/US2015/066372
申请日：2015-12-17
申请人： GLO AB , GARDNER, Nathan F. , KISH, JR., Fredrick A. , MODRIC, Miljenko , POKHRIYAL, Anusha , THOMPSON, Daniel Bryce , DANESH, Fariba , GALLAGHER, Timothy , FARRENS, Sharon N.
发明人： GARDNER, Nathan F. , KISH, JR., Fredrick A. , MODRIC, Miljenko , POKHRIYAL, Anusha , THOMPSON, Daniel Bryce , DANESH, Fariba , GALLAGHER, Timothy , FARRENS, Sharon N.
IPC分类号： H01L33/48 , H01L33/62
CPC分类号： H01L25/0753 , H01L24/97 , H01L25/50 , H01L27/156 , H01L33/0095 , H01L33/62 , H01L2224/131 , H01L2224/13109 , H01L2224/13111 , H01L2224/81 , H01L2224/81001 , H01L2224/95
摘要： A backplane optionally having stepped horizontal surfaces and optionally embedding metal interconnect structures is provided. First conductive bonding structures are formed on first stepped horizontal surfaces. First light emitting devices on a first transfer substrate are disposed on the first conductive bonding structures, and a first subset of the first light emitting devices is bonded to the first conductive bonding structures. Laser irradiation can be employed to selectively disconnect the first subset of the first light emitting devices from the first transfer substrate while a second subset of the first light emitting devices remains attached to the first transfer substrate. Additional devices on each additional transfer substrate can be bonded to additional conductive bonding structures on the backplane employing the same method provided that the additional devices are not present in positions that would overlap with pre-existing first light emitting devices or devices on the backplane at a bonding position.
摘要翻译：提供了可选地具有阶梯式水平表面和任选地嵌入金属互连结构的背板。第一导电接合结构形成在第一台阶水平表面上。第一转印衬底上的第一发光器件设置在第一导电接合结构上，并且第一发光器件的第一子集结合到第一导电接合结构。可以使用激光照射来选择性地将第一发光器件的第一子集与第一转移衬底分离，而第一发光器件的第二子集保持附着到第一转移衬底。每个附加传输基板上的附加设备可以使用相同的方法与背板上的附加导电接合结构接合，只要附加设备不存在于与先前存在的第一发光设备或背板上的设备重叠的位置处粘接位置。

2. 发明申请

WO2016100657A3 METHOD OF MAKING A LIGHT EMITTING DIODE ARRAY ON A BACKPLANE 审中-公开
公开(公告)号：WO2016100657A3
公开(公告)日：2016-06-23
申请号：PCT/US2015/066362
申请日：2015-12-17
申请人： GLO AB , GARDNER, Nathan F. , KISH, Fredrick A., JR. , MODRIC, Miljenko , POKHRIYAL, Anusha , THOMPSON, Daniel , DANESH, Fariba , GALLAGHER, Timothy
发明人： GARDNER, Nathan F. , KISH, Fredrick A., JR. , MODRIC, Miljenko , POKHRIYAL, Anusha , THOMPSON, Daniel , DANESH, Fariba , GALLAGHER, Timothy
IPC分类号： H05B37/00 , H05B33/14 , H01L33/00
摘要： A backplane optionally having stepped horizontal surfaces and optionally embedding metal interconnect structures is provided. First conductive bonding structures are formed on first stepped horizontal surfaces. First light emitting devices on a first transfer substrate are disposed on the first conductive bonding structures, and a first subset of the first light emitting devices is bonded to the first conductive bonding structures. Laser irradiation can be employed to selectively disconnect the first subset of the first light emitting devices from the first transfer substrate while a second subset of the first light emitting devices remains attached to the first transfer substrate. Additional devices on each additional transfer substrate can be bonded to additional conductive bonding structures on the backplane employing the same method provided that the additional devices are not present in positions that would overlap with pre-existing first light emitting devices or devices on the backplane at a bonding position.

3. 发明申请

WO2017142877A1 METHOD OF SELECTIVELY TRANSFERRING LED DIE TO A BACKPLANE USING HEIGHT CONTROLLED BONDING STRUCTURES 审中-公开
标题翻译：利用高度受控结合结构选择性地将LED模片转移到背板的方法
公开(公告)号：WO2017142877A1
公开(公告)日：2017-08-24
申请号：PCT/US2017/017830
申请日：2017-02-14
申请人： GLO AB , POKHRIYAL, Anusha , FARRENS, Sharon N. , GALLAGHER, Timothy
发明人： POKHRIYAL, Anusha , FARRENS, Sharon N. , GALLAGHER, Timothy
IPC分类号： H01L33/00 , H01L21/677 , H01L33/62
CPC分类号： H01L25/50 , H01L21/67144 , H01L21/6835 , H01L24/81 , H01L24/83 , H01L25/0753 , H01L25/167 , H01L33/005 , H01L33/62 , H01L2221/68322 , H01L2221/68327 , H01L2221/68354 , H01L2221/68368 , H01L2221/68381 , H01L2224/81224 , H01L2224/81815 , H01L2224/83224 , H01L2224/83815 , H01L2933/0066
摘要： Selective transfer of dies including semiconductor devices to a target substrate can be performed employing local laser irradiation. Coining of at least one set of solder material portions can be employed to provide a planar surface-to-surface contact and to facilitate bonding of adjoining pairs of bond structures. Laser irradiation on the solder material portions can be employed to sequentially bond selected pairs of mated bonding structures, while preventing bonding of devices not to be transferred to the target substrate. Additional laser irradiation can be employed to selectively detach bonded devices, while not detaching devices that are not bonded to the target substrate. The transferred devices can be pressed against the target substrate during a second reflow process so that the top surfaces of the transferred devices can be coplanar. Wetting layers of different sizes can be employed to provide a trapezoidal vertical cross-sectional profile for reflowed solder material portions.
摘要翻译：可以使用局部激光照射来执行包括半导体器件的裸片到目标衬底的选择性传输。可采用至少一组焊料材料部分的压印来提供平面的表面对表面接触并促进邻接的成对键合结构的键合。在焊料材料部分上的激光照射可以用于依次键合选定的成对的配合键合结构，同时防止不转移到目标衬底的器件的键合。可以使用额外的激光照射来选择性地分离键合器件，同时不分离未键合到目标衬底的器件。被转移的器件可以在第二次回流过程中被压向目标基板，使得被转移的器件的顶表面可以共面。可以采用不同尺寸的润湿层来为回流的焊接材料部分提供梯形的垂直横截面轮廓。

4. 发明申请

WO2017205132A1 SELECTIVE DIE REPAIR ON A LIGHT EMITTING DEVICE ASSEMBLY 审中-公开
标题翻译：发光装置组件上的选择性模修理
公开(公告)号：WO2017205132A1
公开(公告)日：2017-11-30
申请号：PCT/US2017/033032
申请日：2017-05-17
申请人： DANESH, Fariba , PATTERSON, Frank , GALLAGHER, Timothy , FARRENS, Sharon N.
发明人： DANESH, Fariba , PATTERSON, Frank , GALLAGHER, Timothy , FARRENS, Sharon N.
IPC分类号： H01L27/15 , G09G3/00 , H01L27/32 , H01L51/50 , H01L25/075
摘要： A method of repairing a light emitting device assembly includes providing a light emitting device assembly including a backplane and light emitting devices, where a predominant subset of pixels in the light emitting device assembly includes an empty site for accommodating a repair light emitting device, generating a test map that identifies non-functional light emitting devices in the light emitting device assembly, providing an assembly of a repair head and repair light emitting devices, wherein the repair light emitting devices are located only on locations that are mirror images of empty sites within defective pixels that include non-functional light emitting devices, and transferring the repair light emitting devices from the repair head to the backplane in the empty site in the defective pixels.
摘要翻译：修复发光器件组件的方法包括提供包括背板和发光器件的发光器件组件，其中发光器件组件中的像素的主要子集包括用于容纳修复发光装置，产生识别发光装置组件中的非功能性发光装置的测试图，提供修理头和修理发光装置的组件，其中修理发光装置仅位于是包括不起作用的发光器件的缺陷像素内的空位的镜像，并且将修复发光器件从修复头传输到缺陷像素中的空位中的背板。

5. 发明申请

WO2019199547A1 LED BACKPLANE HAVING PLANAR BONDING SURFACES AND METHOD OF MAKING THEREOF 审中-公开
公开(公告)号：WO2019199547A1
公开(公告)日：2019-10-17
申请号：PCT/US2019/025622
申请日：2019-04-03
申请人： GLO AB
发明人： DANESH, Fariba , GALLAGHER, Timothy , POKHRIYAL, Anusha , LAU, Tsun
IPC分类号： H01L25/075 , H01L33/48 , H01L33/36 , H01L33/62 , H01L33/00
摘要： A backplane can have a non-planar top surface. Insulating material portions including planar top surface regions located within a same horizontal plane are formed over the backplane. A two-dimensional array of metal plate clusters is formed over the insulating material portions. Each of the metal plate clusters includes a plurality of metal plates. Each metal plate includes a horizontal metal plate portion overlying a planar top surface region and a connection metal portion connected to a respective metal interconnect structure in the backplane. A two-dimensional array of light emitting device clusters is bonded to the backplane through respective bonding structures. Each light emitting device cluster includes a plurality of light emitting devices overlying a respective metal plate cluster.

6. 发明申请

WO2013131082A1 CONFIGURABLE, HIGHLY-INTEGRATED SATELLITE RECEIVER 审中-公开
标题翻译：可配置，高度集成的卫星接收器
公开(公告)号：WO2013131082A1
公开(公告)日：2013-09-06
申请号：PCT/US2013/028860
申请日：2013-03-04
申请人： MAXLINEAR, INC. , REDDY, Madhukar , CHANG, Glenn , GALLAGHER, Timothy , SWAROOP, Shantha Murthy Prem , LING, Curtis , PULLELA, Raja
发明人： REDDY, Madhukar , CHANG, Glenn , GALLAGHER, Timothy , SWAROOP, Shantha Murthy Prem , LING, Curtis , PULLELA, Raja
IPC分类号： H04B1/16
CPC分类号： H04H40/90 , H04N21/6143
摘要： A direct broadcast satellite (DBS) reception assembly may comprise an integrated circuit that is configurable between or among a plurality of configurations based on content requested by client devices served by the DBS reception assembly. In a first configuration, multiple satellite frequency bands may be digitized by the integrated circuit as a single wideband signal. In a second configuration, the satellite frequency bands may be digitized by the integrated circuit as a plurality of separate narrowband signals. The integrated circuit may comprise a plurality of receive paths, each of the receive chains comprising a respective one of a plurality of low noise amplifiers and a plurality of analog-to-digital converters.
摘要翻译：直接广播卫星（DBS）接收组件可以包括可以基于由DBS接收组件服务的客户端设备请求的内容在多个配置之间或之间配置的集成电路。在第一配置中，多个卫星频带可以被集成电路数字化为单个宽带信号。在第二配置中，卫星频带可以由集成电路数字化为多个单独的窄带信号。集成电路可以包括多个接收路径，每个接收链包括多个低噪声放大器和多个模数转换器中的相应一个。

7. 发明申请

WO2021119060A1 PARTIAL LASER LIFTOFF PROCESS DURING DIE TRANSFER AND STRUCTURES FORMED BY THE SAME 审中-公开
公开(公告)号：WO2021119060A1
公开(公告)日：2021-06-17
申请号：PCT/US2020/063895
申请日：2020-12-09
申请人： GLO AB
发明人： POKHRIYAL, Anusha , GALLAGHER, Timothy
IPC分类号： H01L33/00 , H01L23/00 , H01L33/48 , H01L25/075
摘要： A transfer method includes providing a first light emitting diode on a first substrate, performing a partial laser liftoff of the first light emitting diode from the first substrate, laser bonding the first light emitting diode to the backplane after performing the partial laser liftoff, and separating the first substrate from the first light emitting diode after the laser bonding.

8. 发明申请

WO2013103671A1 METHOD AND SYSTEM FOR BROADBAND ANALOG TO DIGITAL CONVERTER TECHNOLOGY 审中-公开
标题翻译：用于数字转换器技术的宽带模拟方法与系统
公开(公告)号：WO2013103671A1
公开(公告)日：2013-07-11
申请号：PCT/US2013/020080
申请日：2013-01-03
申请人： MAXLINEAR, INC. , RACHID, Mansour , GALLAGHER, Timothy , LING, Curtis
发明人： RACHID, Mansour , GALLAGHER, Timothy , LING, Curtis
IPC分类号： H03M1/10
CPC分类号： H03M1/1038 , H03M1/12
摘要： Nonlinearity correction in a device that performs analog-to-digital conversion on received analog signals, may be calibrated by generating correction-parameters estimation which when applied to the total spectral content reduces distortion resulting from said nonlinearity in originally-unoccupied spectral regions. Digital signals generated based on sampling of the received analog signals may then be corrected, to remove nonlinearity related distortion, based on the estimated correction-parameters. The nonlinearity calibration may be performed during reception and handling of said analog signals. The correction-parameters may be generated based on signals located in particular spectral regions, such as the originally-unoccupied spectral regions. These signals may be injected within the device, into the particular spectral regions, and the signal may have known characteristics to enable estimating the required correction.
摘要翻译：在对接收到的模拟信号执行模数转换的装置中的非线性校正可以通过产生校正参数估计进行校准，校正参数估计当应用于总光谱内容时减少由原始未被占用的光谱区域中的所述非线性引起的失真。然后可以基于所估计的校正参数来校正基于接收到的模拟信号的采样产生的数字信号以去除非线性相关的失真。可以在接收和处理所述模拟信号期间执行非线性校准。校正参数可以基于位于特定光谱区域（例如原始未被占用的光谱区域）的信号产生。这些信号可以在设备内注入到特定的光谱区域中，并且该信号可以具有已知的特性以使得能够估计所需的校正。

9. 发明申请

WO2012158222A1 METHOD AND APPARATUS FOR MEMORY FAULT TOLERANCE 审中-公开
标题翻译：用于记忆容忍度的方法和装置
公开(公告)号：WO2012158222A1
公开(公告)日：2012-11-22
申请号：PCT/US2012/023975
申请日：2012-02-06
申请人： MAXLINEAR, INC. , LING, Curtis , SMOLYAKOV, Vadim , GALLAGHER, Timothy , GULAK, Glenn
发明人： LING, Curtis , SMOLYAKOV, Vadim , GALLAGHER, Timothy , GULAK, Glenn
IPC分类号： G11C8/00
CPC分类号： G11C29/00 , G06F11/1048 , G11C7/1006 , G11C29/04 , G11C29/76 , G11C29/785 , G11C2029/0409 , G11C2029/4402
摘要： A plurality of data lines and a plurality of bit lines may be used to write to and/or read from an array of memory cells. A switching element may select among different mappings between the plurality of data lines and the plurality of bit lines. The array may, for example, consist of N memory cells, the plurality of bit lines may consist of N bit lines, and the plurality of data lines may consist of N data lines, where N is an integer greater than 1. For a write operation in which a data block is to be written to the array, a configuration of the switching element may be controlled based, at least in part, on how sensitive the data block is to a faulty memory cell among the array of memory cells.
摘要翻译：可以使用多条数据线和多条位线来写入和/或从存储器单元阵列读取。开关元件可以在多条数据线与多条位线之间的不同映射中进行选择。阵列可以例如由N个存储器单元组成，多个位线可以由N个位线组成，并且多个数据线可以由N个数据线组成，其中N是大于1的整数。对于写入至少部分地基于数据块对存储器单元阵列中的故障存储器单元的敏感度来控制开关元件的配置，其中将数据块写入阵列的操作。

10. 发明申请

WO2014008319A1 METHOD AND SYSTEM FOR IMPROVEMENT CROSS POLARIZATION REJECTION AND TOLERATING COUPLING BETWEEN SATELLITE SIGNALS 审中-公开
标题翻译：用于改善卫星信号之间的极化极化抑制和抑制耦合的方法和系统
公开(公告)号：WO2014008319A1
公开(公告)日：2014-01-09
申请号：PCT/US2013/049172
申请日：2013-07-02
申请人： MAXLINEAR, INC. , PULLELA, Raja , CHANG, Glenn , GALLAGHER, Timothy
发明人： PULLELA, Raja , CHANG, Glenn , GALLAGHER, Timothy
IPC分类号： H03D1/04
CPC分类号： H04L1/0091 , H04H40/90
摘要： Methods and systems for improved cross polarization rejection and tolerating of coupling between satellite signals may comprise receiving radio frequency (RF) signals on a chip, where the RF signals comprising a desired signal and at least one crosstalk signal. The received RF signals may be down-converted to baseband frequencies, and the down-converted signals are converted to digital signals. Crosstalk may be determined by estimating complex coupling coefficients between the received RF signals utilizing a de-correlation algorithm across a frequency bandwidth comprising the desired and crosstalk signals. The down-converted signals may be low-pass filtered and summed with an output signal from a cancellation filter. The complex coupling coefficients may be determined utilizing the de-correlation algorithm on the summed signals, and may be used to configure the cancellation filter. Crosstalk may be canceled in a receiver path from a cancellation filter receiving low-pass filtered down-converted signals from another path.
摘要翻译：用于改进交叉极化抑制和卫星信号之间耦合的容忍的方法和系统可以包括在芯片上接收射频（RF）信号，其中RF信号包括期望的信号和至少一个串扰信号。所接收的RF信号可以被下变频到基带频率，并且下变频信号被转换成数字信号。可以通过利用包括期望和串扰信号的频率带宽上的去相关算法来估计接收的RF信号之间的复耦合系数来确定串扰。下变频信号可以被低通滤波，并与来自消除滤波器的输出信号相加。复数耦合系数可以利用求和信号上的去相关算法来确定，并且可以用于配置消除滤波器。从接收来自另一路径的低通滤波的下变频信号的消除滤波器的接收机路径中可能会消除串扰。

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