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1. 发明申请

WO2009032389A1 METHOD OF PACKAGING AN INTEGRATED CIRCUIT DIE 审中-公开
标题翻译：封装集成电路的方法
公开(公告)号：WO2009032389A1
公开(公告)日：2009-03-12
申请号：PCT/US2008/068076
申请日：2008-06-25
申请人： FREESCALE SEMICONDUCTOR INC. , LYTLE, William H. , FAY, Owen R. , XU, Jianwen
发明人： LYTLE, William H. , FAY, Owen R. , XU, Jianwen
IPC分类号： H01L21/60 , H01L23/34 , H01L23/52
CPC分类号： H01L21/568 , H01L23/3114 , H01L24/19 , H01L24/82 , H01L24/96 , H01L24/97 , H01L2224/04105 , H01L2224/12105 , H01L2224/16 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/181 , H01L2924/00
摘要： A structure (40) for holding an integrated circuit die (38) during packaging includes a support substrate (42), a release film (44) attached to the substrate (42), and a swelling agent (60). A method (34) of packaging the die (38) includes placing the die (38) on the substrate (42) with its active surface (52) and bond pads (54) in contact with the film (44). The agent (60) is applied over an adhesive coating (50) of the film (44). The agent (60) causes the adhesive (50) to swell into contact with the bond pads (54) and/or to form fillets (64) of adhesive (50) about the die (38). The die (38) is encapsulated in a molding material (72) and released from the substrate (42) as a panel (74) of dies (38). Swelling of the adhesive (50) about the bond pads (54) prevents the molding material (72) from bleeding onto the bond pads (54).
摘要翻译：用于在封装期间保持集成电路管芯（38）的结构（40）包括支撑基板（42），附着在基板（42）上的脱模膜（44）和膨胀剂（60）。封装模具（38）的方法（34）包括将模具（38）放置在基板（42）上，其活性表面（52）和与薄膜（44）接触的粘结垫（54）。将试剂（60）施加在薄膜（44）的粘合剂涂层（50）上。试剂（60）使得粘合剂（50）与粘合垫（54）膨胀和/或形成围绕模具（38）的粘合剂（50）的圆角（64）。模具（38）被封装在模制材料（72）中并且作为模具（38）的面板（74）从基板（42）释放。粘合剂（50）围绕接合焊盘（54）的膨胀防止模制材料（72）渗透到接合焊盘（54）上。

2. 发明申请

WO2009111109A1 PACKAGING AN INTEGRATED CIRCUIT DIE USING COMPRESSION MOLDING 审中-公开
标题翻译：使用压缩成型包装整合电路
公开(公告)号：WO2009111109A1
公开(公告)日：2009-09-11
申请号：PCT/US2009/031773
申请日：2009-01-23
申请人： FREESCALE SEMICONDUCTOR INC. , XU, Jianwen
发明人： XU, Jianwen
IPC分类号： H01L21/56 , H01L21/68 , H01L21/60 , H01L21/603
CPC分类号： H01L24/82 , H01L21/568 , H01L21/6835 , H01L24/19 , H01L24/96 , H01L24/97 , H01L2221/68372 , H01L2224/04105 , H01L2224/05001 , H01L2224/05009 , H01L2224/05026 , H01L2224/05571 , H01L2224/12105 , H01L2224/16 , H01L2224/97 , H01L2924/00014 , H01L2924/01006 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/14 , H01L2924/181 , H01L2924/3511 , H01L2224/82 , H01L2924/00 , H01L2224/05099
摘要： A structure (46) for holding an integrated circuit (IC) die (50) during packing includes a flexible structurally reinforced silicone adhesive film (22) and a mold frame (44). The mold frame (44) adheres to an adhesive side (38) of the film (22). A method (20) of packaging the IC die (50) includes placing the IC die (50) on the adhesive film (22) with its active surface (52) and bond pads (54) in contact with an adhesive side (38) of the film (22). A molding compound (58) is dispensed over the IC die, and the IC die (50) is encapsulated using compression molding to form a compression molded encapsulant layer (70). IC die (50) is subsequently released from the film (22) as a panel (72) of IC dies (50).
摘要翻译：用于在包装期间保持集成电路（IC）模具（50）的结构（46）包括柔性结构增强的硅氧烷粘合膜（22）和模架（44）。模框（44）粘附到膜（22）的粘合剂侧（38）上。封装IC管芯（50）的方法（20）包括将IC管芯（50）放置在粘合膜（22）上，其活性表面（52）和接合焊盘（54）与粘合剂侧（38）接触，的胶片（22）。将模塑料（58）分配在IC模头上，并且使用压缩模塑来封装IC模具（50）以形成压缩模制密封剂层（70）。 IC模具（50）随着IC芯片（50）的面板（72）从膜（22）释放。

3. 发明申请

WO2013036948A1 SOLDERING RELIEF METHOD AND SEMICONDUCTOR DEVICE EMPLOYING SAME 审中-公开
标题翻译：焊接救济方法和使用其的半导体器件
公开(公告)号：WO2013036948A1
公开(公告)日：2013-03-14
申请号：PCT/US2012/054491
申请日：2012-09-10
申请人： QUALCOMM INCORPORATED , SCHWARZ, Mark, Wendell , XU, Jianwen
发明人： SCHWARZ, Mark, Wendell , XU, Jianwen
IPC分类号： H01L21/48 , H01L23/498 , H05K3/34
CPC分类号： H01L24/11 , H01L21/4853 , H01L21/56 , H01L23/49811 , H01L2924/12042 , H01L2924/15311 , H01L2924/181 , H05K3/3436 , Y02P70/613 , H01L2924/00
摘要： A semiconductor device includes a substrate having a first side and a second side, the second side having a mounting location for at least one semiconductor element, and the first side having a plurality of locations electrically connected to locations on the second side. A plurality of electrically conductive interconnects are provided at the locations, each having a first end attached at the location and a second end spaced from the substrate, and an encapsulant partially encapsulates the plurality of interconnects and has a surface lying in a first plane. The second ends are located on the side of the first plane opposite from the substrate first side, an annular space in the encapsulant surrounds each of the plurality of electrically conductive interconnects, and the annular space has a bottom located between the first plane and the substrate first side. Also a method for making such a semiconductor device.
摘要翻译：半导体器件包括具有第一侧和第二侧的衬底，第二侧具有用于至少一个半导体元件的安装位置，并且第一侧具有电连接到第二侧上的位置的多个位置。在位置处设置多个导电互连件，每个导电互连件具有附接在该位置处的第一端和与衬底间隔开的第二端，并且密封剂部分地封装多个互连件，并且具有位于第一平面中的表面。第二端位于与衬底第一侧相对的第一平面的侧面上，密封剂中的环形空间围绕多个导电互连件中的每一个，并且环形空间具有位于第一平面和衬底之间的底部第一面。也是制造这种半导体器件的方法。

4. 发明申请

WO2011120002A1 THERMAL-RESPONSIVE POLYMER NETWORKS, COMPOSITIONS, AND METHODS AND APPLICATIONS RELATED THERETO 审中-公开
标题翻译：热响应聚合物网络，组合物及其相关方法和应用
公开(公告)号：WO2011120002A1
公开(公告)日：2011-09-29
申请号：PCT/US2011/030071
申请日：2011-03-25
申请人： UNIVERSITY OF MASSACHUSETTS , SONG, Jie , XU, Jianwen
发明人： SONG, Jie , XU, Jianwen
IPC分类号： A61B17/56 , C08G63/91 , A61F2/00
CPC分类号： C08G63/912 , A61F2002/30242 , A61F2002/444 , A61F2230/0071 , C08G63/08 , C08G83/002 , C08G2280/00
摘要： The invention relates to materials comprising polymer network containing organic-based core structures, preferably the materials have thermal-responsive properties. In some embodiments, the invention relates to an organic core functionalized with polymers. In another embodiment, organic core-polymer conjugates comprise polylactone segments. The organic core-polymer conjugates may be crosslinked together to form a material, and these materials may be functionalized with bioactive compounds so that the materials have desirable biocompatibility or bioactivity when used in medical devices. In further embodiments, the invention relates to composite materials that contain a polymer matrix and aggregates, and in some embodiments, methods of making, and methods of using these materials. Preferably, the material is resistant to fracture. In further embodiments, the materials are used in surgical procedures of bone replacement.
摘要翻译：本发明涉及包含含有机基核心结构的聚合物网络的材料，优选该材料具有热响应特性。在一些实施方案中，本发明涉及用聚合物官能化的有机核。在另一个实施方案中，有机核 - 聚合物缀合物包含聚内酯片段。有机核 - 聚合物共轭物可以一起交联以形成材料，并且这些材料可以用生物活性化合物官能化，使得当用于医疗装置时，这些材料具有期望的生物相容性或生物活性。在另外的实施方案中，本发明涉及包含聚合物基质和聚集体的复合材料，并且在一些实施方案中涉及制备方法和使用这些材料的方法。优选地，该材料耐断裂。在另外的实施方案中，所述材料用于骨置换的外科手术中。

5. 发明申请

WO2012116250A1 MONOMERS AND POLYMERS FOR FUNCTIONAL POLYCARBONATES AND POLY (ESTER-CARBONATES) AND PEG-CO-POLYCARBONATE HYDROGELS 审中-公开
标题翻译：功能性聚碳酸酯和聚（酯 - 碳酸酯）和PEG-聚碳酸酯氢化物的单体和聚合物
公开(公告)号：WO2012116250A1
公开(公告)日：2012-08-30
申请号：PCT/US2012/026427
申请日：2012-02-24
申请人： UNIVERSITY OF MASSACHUSETTS MEDICAL SCHOOL , SONG, Jie , XU, Jianwen
发明人： SONG, Jie , XU, Jianwen
IPC分类号： C07D319/12 , C08G63/08 , C08G63/64 , C08L67/04 , A61L27/52 , A61L27/38 , A61L33/06 , A61K47/34
CPC分类号： C07D405/14 , A61L27/18 , A61L27/52 , C07C247/04 , C07C247/10 , C07D319/06 , C07D405/06 , C08G64/0208 , C08G64/0241 , C08G64/0291 , C08G64/18 , C08G64/183 , C08L69/00
摘要： The invention generally relates to functional polymers and hydrogels. More particularly, the invention provides versatile monomers and polymers with well-defined functionalities, e.g ., polycarbonates and poly(ester-carbonates), compositions thereof, and methods for making and using the same. The invention also provides cytocompatible poly(ethylene glycol)-co-polycarobonate hydrogels ( e.g. , crosslinked by copper-free, strain- promoted "click" chemistry).
摘要翻译：本发明一般涉及功能聚合物和水凝胶。更具体地说，本发明提供通用单体和具有良好界定的官能团的聚合物，例如聚碳酸酯和聚（酯 - 碳酸酯），其组合物，以及制备和使用它们的方法。本发明还提供了细胞相容的聚（乙二醇） - 共 - 碳酸酯水凝胶（例如，通过无铜，应变促进的“点击”化学交联）。

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