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    • 2. 发明申请
    • HIGH VOLTAGE FIELD EFFECT DEVICE AND METHOD
    • 高电压场效应器件及方法
    • WO2006121564A3
    • 2007-05-03
    • PCT/US2006013737
    • 2006-04-07
    • FREESCALE SEMICONDUCTOR INCDE FRESART EDOUARD DDE SOUZA RICHARD JLIN XINMORRISON JENNIFER HPARRIS PATRICE MZITOUNI MOANISS
    • DE FRESART EDOUARD DDE SOUZA RICHARD JLIN XINMORRISON JENNIFER HPARRIS PATRICE MZITOUNI MOANISS
    • H01L29/76H01L21/336H01L21/8234H01L29/94H01L31/062H01L31/113H01L31/119
    • H01L29/7835H01L29/0847H01L29/7833H01L2924/0002H01L2924/00
    • Methods and apparatus are provided for a MOSFET (50, 99, 199) exhibiting increased source-drain breakdown voltage (BVdss). Source (S) (70) and drain (D) (76) are spaced apart by a channel (90) underlying a gate (84) and one or more carrier drift spaces (92, 92') serially located between the channel (90) and the source (70, 70') or drain (76, 76'). A buried region (96, 96') of the same conductivity type as the drift space (92, 92') and the source (70, 70') or drain (76, 76') is provided below the drift space (92, 92'), separated therefrom in depth by a narrow gap (94, 94') and ohmically coupled to the source (70, 70') or drain (76, 76'). Current flow (110) through the drift space produces a potential difference (Vt) across this gap (94, 94'). As the S-D voltage (Vo) and current (109, Io) increase, this difference (Vt) induces high field conduction between the drift space (92, 92') and the buried region (96, 96') and diverts part (112, It) of the S-D current (109, Io) through the buried region (96, 96') and away from the near surface portions of the drift space (92, 92') where breakdown generally occurs. Thus, BVdss is increased
    • 为具有增加的源 - 漏击穿电压(BVdss)的MOSFET(50,99,199)提供了方法和装置。 源极(S)(70)和漏极(D)(76)通过栅极(84)下面的沟道(90)和串联地位于沟道(90)之间的一个或多个载流子漂移空间(92,92')间隔开 )和源极(70,70')或漏极(76,76')。 与漂移空间(92,92')和源极(70,70')或漏极(76,76')相同的导电类型的掩埋区域(96,96')设置在漂移空间(92,92')的下方, 92'),通过狭窄的间隙(94,94')深度地分离,并且与欧姆耦合到源极(70,70')或漏极(76,76')。 通过漂移空间的电流(110)在该间隙(94,94')上产生电位差(Vt)。 随着SD电压(Vo)和电流(109,Io)的增加,该差值(Vt)引起漂移空间(92,92')和掩埋区域(96,96')之间的高场导通,并且转移部分 ,It)通过掩埋区域(96,96')并远离漂移空间(92,92')的通常发生击穿的漂移空间(92,92')的近表面部分的SD电流(109,Io)。 因此,BVdss增加