会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 4. 发明申请
    • CHEMICAL DIE SINGULATION TECHNIQUE
    • 化学成型技术
    • WO2007001854A3
    • 2007-12-06
    • PCT/US2006023120
    • 2006-06-13
    • FREESCALE SEMICONDUCTOR INCCONDIE BRIAN WDOUGHERTY DAVID JSHAH MAHESH K
    • CONDIE BRIAN WDOUGHERTY DAVID JSHAH MAHESH K
    • H01L21/00
    • H01L21/78
    • A method is provided for manufacturing a semiconductor device from a substrate (200) having an active surface (204) and a non-active surface (206). The method comprises depositing a backing material (104) onto the non-active surface of the substrate (206) in a pattern (500), the pattern (500) having at least a first die section (210), a second die section (212) adjacent the first die section (210), and a strip (216) connecting the first die section (210) and the second die section (212), removing material from portions of the non-active surface of the substrate (206) on which the backing material (104) is not deposited to thereby partially separate the substrate (200) into a first die (236) and a second die (238) connected to one another by the strip (254) of the deposited backing material, and breaking the strip connector (254) to separate the first die (236) from the second die (238).
    • 提供了一种从具有有源表面(204)和非有效表面(206)的衬底(200)制造半导体器件的方法。 该方法包括以图案(500)将背衬材料(104)沉积到基底(206)的非活性表面上,图案(500)具有至少第一模具部分(210),第二模具部分 212),以及连接第一模具部分(210)和第二模具部分(212)的条带(216),从衬底(206)的非活性表面的部分去除材料, 其上不沉积背衬材料(104),从而通过沉积的背衬材料的带(254)将衬底(200)部分地分离成第一模具(236)和第二模具(238),所述第一模具(238)彼此连接, 以及断开带状连接器(254)以将第一管芯(236)与第二管芯(238)分离。