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1. 发明申请

WO9918254A3 SOLUTION AND METHOD FOR CURRENTLESS DEPOSITION OF GOLD COATING 审中-公开
标题翻译：解决方案和方法的金层分离CURRENT地段
公开(公告)号：WO9918254A3
公开(公告)日：1999-08-26
申请号：PCT/DE9803013
申请日：1998-10-06
申请人： FRAUNHOFER GES FORSCHUNG , SCHEEL WOLFGANG , HANNEMANN MONIKA , SCHMIDT RALF , MUELLER JUTTA , MEYER HEINRICH , REHAK WOLFGANG
发明人： SCHEEL WOLFGANG , HANNEMANN MONIKA , SCHMIDT RALF , MUELLER JUTTA , MEYER HEINRICH , REHAK WOLFGANG
IPC分类号： C23C18/44 , H05K3/24
CPC分类号： C23C18/44 , H05K3/244
摘要： Various methods exist for currentless deposition of gold coating on metal surfaces. In one method, the coating can be deposited on a base metal by means of cementing charge exchange. In other methods, the depositing solutions can additionally contain a reducing agent such that a gold coating can also be deposited on a precious metal e.g. gold. Known solutions, however, have a disadvantage in that the depositing rate is very slow when the pH value of the solution is between 6 and 7 and when the temperature is adjusted below 50 DEG C. However, such coating conditions are not suitable for processing, for example, alkali-soluble resistant conducting plates. To this end, a depositing bath is provided. According to the invention, said bath contains: a) at least one gold (I) compound, b) at least one reducing agent for the gold (I) compounds, and c) at least one solvent. d1) The gold (I) compound contains a complexity of gold (I) ions with a compound comprised of the amino acids group and the salts thereof, said compound having a formation constant of at least 10 for the complexation of gold (I) ions. d2) The solution additionally contains at least one compound comprised of the amino acids group or the salts thereof, said compound having a formation constant of at least 10 for the complexation of gold (I) ions.
摘要翻译：在金属表面上的金膜的无电沉积，各种方法是已知的。首先，层可以通过在基体金属胶结电荷交换进行沉积。其次，电镀液可另外包含还原剂，以便它可以在贵金属如金，金层来形成。已知的解决方案，然而，具有非常低的沉积速率的缺点在于，当该溶液至低于6至7的值和温度的pH低于50℃调节至然而，用于处理这样的涂层的条件下，例如，设置有碱可溶性抗蚀剂的印刷电路板是不适合的。为了解决这个问题，一个沉积浴是合适的）至少包含a）至少一个金（I）化合物，b）至少一种还原剂为金（I）的化合物和溶剂C，其特征在于，D1），为金（I）化合物，金（I）中的至少一种配合物与选自具有金（I）的络合配位恒定的氨基酸的至少10 <10>离子和这些酸的盐的化合物的离子包括，或其中D2 ）另外至少一种选自下组的氨基酸（具有络合常数化合物用于含有金溶液I）的至少10 <10>离子或氨基酸的盐的络合。

2. 发明申请

WO2007048641A3 REACTOR SYSTEM COMPRISING A MICROSTRUCTURED REACTOR AND A CONTACTLESS HEATING APPARATUS, AND METHOD FOR CARRYING OUT A CHEMICAL REACTION 审中-公开
标题翻译：结合实现化学反应的微结构反应器和非接触式加热和方法反应器系统
公开(公告)号：WO2007048641A3
公开(公告)日：2007-06-21
申请号：PCT/EP2006010436
申请日：2006-10-25
申请人： MEYER HEINRICH , TSCHINDER THOMAS
发明人： MEYER HEINRICH , TSCHINDER THOMAS
IPC分类号： B01J19/00
CPC分类号： B01J19/0093 , B01J2219/00783 , B01J2219/00788 , B01J2219/00822 , B01J2219/00824 , B01J2219/00826 , B01J2219/00831 , B01J2219/00835 , B01J2219/00858 , B01J2219/0086 , B01J2219/00873 , B01J2219/00889 , B01J2219/00891 , B01J2219/00925 , B01J2219/0093 , B01J2219/00941 , B01J2219/00995 , C01C3/0225
摘要： The aim of the invention is to be able to carry out especially endothermic high-temperature chemical syntheses, particularly HCN synthesis, in a microstructured reactor with the aid of the easiest possible measures such that the desired reaction products are obtained at the greatest possible yield and at a constant quality. Said aim is achieved by means of a microstructured reactor system in which the reaction zone is heated using a contactless heating apparatus, such as an induction heater or a radiant heating system. The reactor can be embodied as a plate reactor, a shell-and-tube reactor, or a rotationally symmetrical reactor.
摘要翻译：要使用尽可能措施主要吸热化学高温的合成，特别是HCN合成，结构简单的，所述希望的反应产物以尽可能高的收率并得到一致的质量，提出了一种微结构化的反应器系统中的微结构反应器从而执行其中所述反应区是由一个非接触式加热，来诸如感应加热器或辐射加热器加热。所述反应器可以是板反应器，管式反应器或旋转对称的反应器中。

3. 发明申请

WO0166830A2 METHOD FOR APPLYING A METAL LAYER TO A LIGHT METAL SURFACE 审中-公开
标题翻译：方法用于将金属层上合金表面
公开(公告)号：WO0166830A2
公开(公告)日：2001-09-13
申请号：PCT/DE0100944
申请日：2001-03-07
申请人： ATOTECH DEUTSCHLAND GMBH , MEYER HEINRICH , WUENCHE MATHIAS
发明人： MEYER HEINRICH , WUENCHE MATHIAS
IPC分类号： C25D5/30 , C22C38/00 , C25D3/20 , C25D3/56 , C25D7/10 , C25D21/12 , C25D21/14
CPC分类号： C22C38/002 , C25D3/20 , C25D3/562
摘要： The invention relates to a method for applying a metal layer to surfaces of light metals. Iron of an aqueous deposition bath that contains Fe(II)-compounds is electrolytically deposited on the surfaces by means of dimensionally stable anodes which are insoluble in said deposition bath. The method is particularly suitable for coating cylinder bearing surfaces of internal combustion engines and of rotationally symmetrical components, especially valves, nozzles and other components of high-pressure injection systems for motors of motor vehicles, with layers that are provided with a very high resistance to wear and tear. The invention also relates to nanocrystalline iron/phosphor layers which can preferably be formed by depositing iron in the presence of compounds which contain orthophosphite and/or hypophosphite. Said layers are provided with good corrosion resistance in addition to the good resistance to wear and tear.
摘要翻译：所以建议施加金属层，以轻金属的表面的方法，其中含有含水沉积浴中的铁（II）化合物的铁被下Vervendung尺寸稳定的，不溶性阳极在表面上沉积浴电解。该方法特别适用于具有非常高的耐磨性的层，特别是阀门，喷嘴和用于汽车发动机的高压喷射系统的其他部分涂覆内燃机和旋转对称部件的圆筒面。此外，本发明涉及纳米晶体铁/含磷化合物层可以优选通过铁的沉积在亚磷酸和/或次磷酸盐的存在下形成的。除了良好的耐磨性，这些层还具有良好的耐腐蚀性。

4. 发明申请

WO9711209A3 PROCESS AND DEVICE FOR TREATING HOLES OR RECESSES IN WORKPIECES WITH LIQUID TREATMENT AGENTS 审中-公开
标题翻译：用液体处理剂处理工具或工件的工艺和装置
公开(公告)号：WO9711209A3
公开(公告)日：1997-07-31
申请号：PCT/DE9601716
申请日：1996-09-06
申请人： ATOTECH DEUTSCHLAND GMBH , DURST FRANZ , BRENN GUENTER , SCHAEFER MICHAEL , MEYER HEINRICH , STREUP HERIBERT
发明人： DURST FRANZ , BRENN GUENTER , SCHAEFER MICHAEL , MEYER HEINRICH , STREUP HERIBERT
IPC分类号： B05D3/10 , B08B3/02 , B08B3/08 , C25D5/08 , C25D7/00 , H05K3/00 , H05K3/26 , C25D
CPC分类号： C25D5/08 , B08B3/02 , B08B3/022 , H05K3/0088
摘要： Treating, for example cleaning, holes or recesses in workpieces is problematic when the holes or recesses are less than 0.5 mm wide, and in particular when they do not extend through the workpiece (blind holes). Known processes do not allow gas bubbles that adhere to the side walls of such holes to be removed nor liquids inside the holes to be effectively exchanged. The disclosed process allows the liquid inside the hole to be effectively exchanged by the liquid outside the holes. For that purpose, the liquid treatment medium is injected into the holes as a jet with a smaller diameter than the holes. Also disclosed is a device for carrying out this process with a nozzle with one or more outlets of less than 0.5 mm diameter, a liquid supply unit for pumping liquid treatment medium through the nozzle outlets, and a filtering unit in communication with the outlets and the supply unit for removing particles from the treatment medium.

5. 发明申请

WO2007006461A8 METHOD FOR BONDING WORK PIECES AND MICRO-STRUCTURED COMPONENT 审中-公开
标题翻译：用于结合工件和微结构部件的方法
公开(公告)号：WO2007006461A8
公开(公告)日：2007-05-31
申请号：PCT/EP2006006534
申请日：2006-06-28
申请人： ATOTECH DEUTSCHLAND GMBH , MEYER HEINRICH , KURTZ OLAF , HERBER RALPH , MADRY CHRISTIAN , ETZKORN JOHANNES , VAGO THOMAS
发明人： MEYER HEINRICH , KURTZ OLAF , HERBER RALPH , MADRY CHRISTIAN , ETZKORN JOHANNES , VAGO THOMAS
IPC分类号： B23K20/02
CPC分类号： B23K20/023 , F28F2260/00 , F28F2260/02 , F28F2275/04
摘要： For forming very strong bond joints suited for manufacturing micro-structured components consisting of a plurality of individual layers, a bonding method is proposed by which a bonding arrangement of the work pieces is formed that comprises at least one metallic bonding layer interposed therein between and by which the bonding arrangement is heated to a bonding temperature below the melting temperature of the at least one bonding layer. In accordance with the invention, the at least one bonding layer is deposited using a chemical or electrolytic method.
摘要翻译：为了形成适合于制造由多个单独层组成的微结构部件的非常牢固的接合接头，提出了一种接合方法，通过该接合方法形成工件的接合装置，其包括至少一个介于其间的金属接合层，将所述接合装置加热到低于所述至少一个结合层的熔融温度的接合温度。根据本发明，使用化学或电解方法沉积至少一个结合层。

6. 发明申请

WO2007009418A3 HYDRAULIC MOTOR BEARING 审中-公开
标题翻译：液压马达轴承
公开(公告)号：WO2007009418A3
公开(公告)日：2007-04-05
申请号：PCT/DE2006001147
申请日：2006-07-03
申请人： ZAHNRADFABRIK FRIEDRICHSHAFEN , MEYER HEINRICH , BINNER PETER , STIRA MARC
发明人： MEYER HEINRICH , BINNER PETER , STIRA MARC
IPC分类号： F16F13/26 , F16F13/10
CPC分类号： F16F13/268 , F16F13/103
摘要： The invention relates to a hydraulic motor bearing, in particular for motor vehicles, comprising a working chamber (4) which is filled with a liquid and which is surrounded by a rubber-elastic periphery wall (3), a compensation chamber (7) which is connected to the working chamber (4) by means of a overflow channel (6) in the separating plate (7) between the working chamber (4) and the compensation chamber (7), and an additional compensation chamber (10) which is connected to the working chamber (4) by means of a bypass channel (9). The additional compensation chamber (10) is formed from an elastic body (11) which is surrounded on the external side thereof by a solid wall (12). An intermediate chamber (13) is arranged between the body (11) and the wall (12). Said intermediate chamber can be filled with a compressible medium, preferably air, and said medium can be removed. The inventive switch device is formed from at least one return valve (14) and at least one switch valve (15), whereby the return valve (14) is arranged in a ventilation channel as a connection path between the intermediate chamber (13) and the external side of the solid wall (12) in such a manner that only the medium, which is located in the intermediate chamber (13), can flow to the external side of the wall (12) and the switch valve (15) is arranged on the ventilation channel (17) as an additional connection path of the intermediate chamber (13) between the external side of the motor bearing. Said ventilation channel (17) can be open or closed.
摘要翻译：这是一个液压发动机轴承，特别是用于机动车辆具有由液体填充的工作腔室所包围的橡胶弹性的外周壁中的一个（3）（4），补偿室（7）通过溢流通道（6）的隔板（7）的工作腔（4）和补偿室之间（7），其通过旁通通道（9）与弹性波纹管的工作腔（4），其特征在于，所述另外的均衡室（10）连接被连接在工作腔（4）和另一均衡室（10）（11）形成，这是在其外侧包围由固定壁（12），并且其中所述风箱（11）之间和壁（12）的空间（13）设置，其通过与可压缩介质的开关装置中，优选空气，可以被填充和从介质中排出根据本发明的开关装置从至少一个止回阀（14）和至少一个开关阀（15）geb 是ildet，其中，所述止回阀（14），其连接在一通风通道（13）的中间空间被布置成与所述固定壁（12），使得仅位于中间空间（13）至所述壁的所述外侧的介质的流动的外侧（12 ）是可能的，并且其中所述开关阀（15）的通气通道（17）的中间空间的进一步的连接路径（13）被设置到发动机轴承的外侧，并可以关闭或打开通风通道（17）。

7. 发明申请

WO2004032231A3 MICRO-STRUCTURE COOLING DEVICE AND USE THEREOF 审中-公开
标题翻译：微结构冷却装置及其用途
公开(公告)号：WO2004032231A3
公开(公告)日：2004-05-06
申请号：PCT/EP0310800
申请日：2003-09-29
申请人： ATOTECH DEUTSCHLAND GMBH , MEYER HEINRICH , CRAEMER KONRAD , KURTZ OLAF , HERBER RALPH , PRECHTL PETER , THEISEN SVEN , HOEHN MARKUS
发明人： MEYER HEINRICH , CRAEMER KONRAD , KURTZ OLAF , HERBER RALPH , PRECHTL PETER , THEISEN SVEN , HOEHN MARKUS
IPC分类号： F25D9/00 , F28F3/12 , H01L23/473 , H05K7/20
CPC分类号： F28F3/12 , F28F9/0253 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： The invention relates to a micro-structure cooling device (3) for an object (4) to be cooled, whereby the cooling device (3) includes a stack of at least two metal foils (1) and one base plate (5) that can be brought via a thermal contact surface (6) into thermal contact with the object (4), the metal foils (1) and the base plate (5) are joined to one another in a material fit, present in the metal foils (1) are channels (2) for cooling medium, and the channels (2) have a width in the range of from 100 to 2,000 µm, a depth in the range of from 25 to 1,000 µm and a mean interval in the range of from 50 to 1,000 µm, the residual foil thickness resulting from the channels (2) in the metal foils (1) are in the range of from 50 to 300 µm, and the base plate (5) has a thickness in the range of from 200 to 2,000 µm.
摘要翻译：本发明涉及用于待冷却物体（4）的微结构冷却装置（3），其中冷却装置（3）包括至少两个金属箔（1）和一个基板（5）的堆叠，可经由热接触表面（6）与物体（4）热接触，金属箔（1）和底板（5）以材料配合相互连接，存在于金属箔中 1）为用于冷却介质的通道（2），通道（2）的宽度为100-2000μm，深度为25-1000μm，平均间隔为 50至1,000μm，由金属箔（1）中的通道（2）产生的残余箔厚度在50至300μm的范围内，并且基板（5）的厚度在从200 到2,000μm。

8. 发明申请

WO9954525A3 METHOD FOR PRODUCING METALLIZED SUBSTRATE MATERIALS 审中-公开
标题翻译：生产金属化基材的方法
公开(公告)号：WO9954525A3
公开(公告)日：1999-12-16
申请号：PCT/DE9901159
申请日：1999-04-15
申请人： ATOTECH DEUTSCHLAND GMBH , MEYER HEINRICH , SCHULZ RALF , HEINZ ROLAND , KLUSMANN ECKART
发明人： MEYER HEINRICH , SCHULZ RALF , HEINZ ROLAND , KLUSMANN ECKART
IPC分类号： C23C16/02 , C23C16/06 , C23C16/18 , C23C28/02 , H05K1/03 , H05K3/14 , H05K3/38 , H05K3/02 , H05K3/10
CPC分类号： H05K3/388 , C23C16/0245 , C23C16/06 , H05K1/034 , H05K3/146
摘要： Known methods exist for producing the required substrate materials for electric circuit carriers, whereby metal coatings are applied to a dielectric substrate using a glow-discharge method and other metal coatings are applied using an electroplating method. These methods are, however, not suitable for the production of substrate materials that can be used for high frequency applications in the giga hertz range. The invention builds upon the previously cited methods and solves the problem linked thereto by using fluoropolymers and by coating these materials with nickel in a glow-discharge method, whereby very flat surfaces of the substrate can also be given an adhesive coating. The metallized materials can be covered with other metal coatings from electroless or electrolytic separation baths.
摘要翻译：对于生产电路载体所需的衬底材料的生产，已知有这样的方法，其中利用辉光放电方法将金属层施加到电介质衬底，然后利用电镀工艺将金属层施加到其他金属层。然而，这些方法不适合于生产适用于千兆赫高频应用的衬底材料。本发明基于前述方法并解决了使用含氟聚合物和通过用镍的辉光放电方法涂覆这些材料所呈现的问题，因为该基材的非常光滑的表面可被涂覆粘附。金属化材料可以涂覆进一步的无电镀或电解沉积浴的金属层。

9. 发明申请

WO9840538A3 METHOD FOR ELECTROLYTIC DEPOSITION OF A SMOOTH SURFACE METAL ON A SUBSTRATE USING GRAPHITE DISPERSION 审中-公开
标题翻译：使用石墨分散的基板上的平滑表面金属的电沉积方法
公开(公告)号：WO9840538A3
公开(公告)日：1998-12-17
申请号：PCT/DE9800667
申请日：1998-03-02
申请人： BESENHARD JUERGEN OTTO , MEYER HEINRICH , SAMY HANNA , HAGG CHRISTOPH
发明人： BESENHARD JUERGEN OTTO , MEYER HEINRICH , SAMY HANNA , HAGG CHRISTOPH
IPC分类号： C25D5/38 , C25D5/56 , H01M4/04 , H01M4/64 , H01M4/66 , H01M4/68 , H01M4/72 , H01M4/82 , C25D
CPC分类号： H01M4/72 , C25D5/38 , C25D5/56 , H01M4/04 , H01M4/64 , H01M4/663 , H01M4/667 , H01M4/668 , H01M4/68 , H01M4/82
摘要： It is difficult to obtain regular metallization during metallization of the total surface of electrically non-conductive substrates covered by a carbon coating. The problem thus arising is that during electrolysis the metal coating can only be developed slowly on the surface of the substrate starting from the electrical contact surfaces. The problem is solved by a method according to which the substrate is initially covered with an electrically conductive base coating and then brought into contact with a dispersion containing graphite particles, surface-active materials used to disperse said particles and a liquid dispersing agent, whereby a fast metallizing graphite layer is formed on the substrate with the graphite dispersion during treatment lasting 30 seconds or less. A metal coating is electrolytically deposited on the graphite layer after said treatment.

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