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    • 3. 发明申请
    • SOLUTION AND METHOD FOR CURRENTLESS DEPOSITION OF GOLD COATING
    • 解决方案和方法的金层分离CURRENT地段
    • WO9918254A3
    • 1999-08-26
    • PCT/DE9803013
    • 1998-10-06
    • FRAUNHOFER GES FORSCHUNGSCHEEL WOLFGANGHANNEMANN MONIKASCHMIDT RALFMUELLER JUTTAMEYER HEINRICHREHAK WOLFGANG
    • SCHEEL WOLFGANGHANNEMANN MONIKASCHMIDT RALFMUELLER JUTTAMEYER HEINRICHREHAK WOLFGANG
    • C23C18/44H05K3/24
    • C23C18/44H05K3/244
    • Various methods exist for currentless deposition of gold coating on metal surfaces. In one method, the coating can be deposited on a base metal by means of cementing charge exchange. In other methods, the depositing solutions can additionally contain a reducing agent such that a gold coating can also be deposited on a precious metal e.g. gold. Known solutions, however, have a disadvantage in that the depositing rate is very slow when the pH value of the solution is between 6 and 7 and when the temperature is adjusted below 50 DEG C. However, such coating conditions are not suitable for processing, for example, alkali-soluble resistant conducting plates. To this end, a depositing bath is provided. According to the invention, said bath contains: a) at least one gold (I) compound, b) at least one reducing agent for the gold (I) compounds, and c) at least one solvent. d1) The gold (I) compound contains a complexity of gold (I) ions with a compound comprised of the amino acids group and the salts thereof, said compound having a formation constant of at least 10 for the complexation of gold (I) ions. d2) The solution additionally contains at least one compound comprised of the amino acids group or the salts thereof, said compound having a formation constant of at least 10 for the complexation of gold (I) ions.
    • 在金属表面上的金膜的无电沉积,各种方法是已知的。 首先,层可以通过在基体金属胶结电荷交换进行沉积。 其次,电镀液可另外包含还原剂,以便它可以在贵金属如金,金层来形成。 已知的解决方案,然而,具有非常低的沉积速率的缺点在于,当该溶液至低于6至7的值和温度的pH低于50℃调节至 然而,用于处理这样的涂层的条件下,例如,设置有碱可溶性抗蚀剂的印刷电路板是不适合的。 为了解决这个问题,一个沉积浴是合适的)至少包含a)至少一个金(I)化合物,b)至少一种还原剂为金(I)的化合物和溶剂C,其特征在于,D1),为金(I) 化合物,金(I)中的至少一种配合物与选自具有金(I)的络合配位恒定的氨基酸的至少10 <10>离子和这些酸的盐的化合物的离子包括,或其中D2 )另外至少一种选自下组的氨基酸(具有络合常数化合物用于含有金溶液I)的至少10 <10>离子或氨基酸的盐的络合。