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1. 发明申请

WO2017050808A1 MICRO-FABRICATION OF THREE DIMENSIONAL PYROLYSED CARBON MICROELECTRODES 审中-公开
标题翻译：三维微晶碳微电极的微观制造
公开(公告)号：WO2017050808A1
公开(公告)日：2017-03-30
申请号：PCT/EP2016/072388
申请日：2016-09-21
申请人： DANMARKS TEKNISKE UNIVERSITET
发明人： HEMANTH, Suhith , KELLER, Stephan Sylvest , CAVIGLIA, Claudia , AMATO, Letizia
IPC分类号： G03F7/00 , G03F7/20 , G03F7/213 , G03F7/38
CPC分类号： G03F7/2022 , G03F7/0035 , G03F7/0037 , G03F7/213 , G03F7/38
摘要： The present invention relates in one aspect to a method of producing a three-dimensional microscale patterned resist template for a pyrolysed carbon microelectrode structure by means of UV-lithography. Coating a planar substrate with an epoxy-based negative photoresist, such as an SU-8 photoresist; soft baking the photoresist layer; performing a full depth exposure with UV light through a first mask; performing a partial depth exposure with UV light through a second mask; wherein the full depth exposure and the partial depth exposure are aligned to ensure that the first and second latent images are connected to each other; post-exposure baking the photoresist layer; and developing the microscale patterned resist template as a free-standing structure of cross-linked resist with lateral hanging structures that are supported by vertical support structures at a free height above the substrate. The method is characterized by a soft baking temperature below 70 °C. Repetitive coating and partial depth exposure allows for the fabrication of multiple level laterally interconnected structures. Carbonization of the resist template provides truly three-dimensional carbon microelectrode structures.
摘要翻译：本发明在一个方面涉及通过UV光刻法制造用于热解的碳微电极结构的三维微米图案化抗蚀剂模板的方法。用诸如SU-8光致抗蚀剂的环氧基负性光致抗蚀剂涂覆平面基板; 软烘烤光刻胶层; 通过第一掩模用紫外光进行全深度曝光; 通过第二掩模用UV光进行局部深度曝光; 其中所述全深度曝光和所述部分深度曝光被对准以确保所述第一和第二潜像彼此连接; 后曝光烘烤光刻胶层; 并且将微米图案化的抗蚀剂模板显影为具有横向悬挂结构的交联抗蚀剂的独立结构，其在衬底上方的自由高度由垂直支撑结构支撑。该方法的特点是软烘烤温度低于70℃。重复涂布和部分深度曝光允许制造多层横向互连结构。抗蚀剂模板的碳化提供真正的三维碳微电极结构。

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