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    • 2. 发明申请
    • MWT ARCHITECTURE FOR THIN SI SOLAR CELLS
    • 微型太阳能电池的MWT结构
    • WO2012021750A1
    • 2012-02-16
    • PCT/US2011/047486
    • 2011-08-11
    • CRYSTAL SOLAR, INC.ASTHANA, AshishRAVI, Tirunelveli, S.RAVI, Kramadhati, V.NAG, Somnath
    • ASTHANA, AshishRAVI, Tirunelveli, S.RAVI, Kramadhati, V.NAG, Somnath
    • H01L31/00
    • H01L31/02245H01L31/02168H01L31/03921H01L31/068H01L31/1804H01L31/1892Y02E10/547Y02P70/521
    • Methods of fabricating metal wrap through solar cells and modules for thin silicon solar cells, including epitaxial silicon solar cells, are described. These metal wrap through solar cells have a planar back contact geometry for the base and emitter contacts. Fabrication of a metal wrap through solar cell may comprise: providing a photovoltaic device attached at the emitter side of the device to a solar glass by an encapsulant, the device including busbars on the device emitter; forming vias through the device base and emitter, the vias terminating in the busbars; depositing a conformal dielectric film over the surface of the vias and the back surface of the base; removing portions of the conformal dielectric film from the ends of the vias for exposing the busbars and from field areas of the base; and forming separate electrical contacts to the busbars and the field areas on the back surface of the solar cell. The solar cells may comprise epitaxially deposited silicon and may include an epitaxially deposited back surface field.
    • 描述了通过太阳能电池制造金属封套的方法和用于薄硅太阳能电池的模块,包括外延硅太阳能电池。 这些金属包裹太阳能电池具有用于基极和发射极触点的平面后接触几何形状。 通过太阳能电池的金属卷绕的制造可以包括:通过密封剂将设备的发射极侧附接到太阳能玻璃的光伏器件提供,该器件包括在器件发射器上的汇流条; 通过设备基座和发射器形成通孔,终端在母线中的通孔; 在所述通孔的表面和所述基底的后表面上沉积保形电介质膜; 从所述通孔的端部去除所述共形绝缘膜的部分,以暴露所述母线和所述基座的场区域; 并且形成与母线和太阳能电池背面上的场区分开的电接触。 太阳能电池可以包括外延沉积的硅并且可以包括外延沉积的背表面场。
    • 10. 发明申请
    • HIGH EFFICIENCY SINGLE CRYSTAL SILICON SOLAR CELL WITH EPITAXIALLY DEPOSITED SILICON LAYERS WITH DEEP JUNCTION(S)
    • 高效单晶硅太阳能电池,具有外延沉积的具有深度接合的硅层(S)
    • WO2017007972A1
    • 2017-01-12
    • PCT/US2016/041404
    • 2016-07-07
    • CRYSTAL SOLAR, INC.
    • HAO, RuiyingRAVI, Tirunelveli, S.
    • H01L31/068C30B25/02C30B29/06C30B29/68
    • H01L31/1804H01L31/022425H01L31/0682H01L31/1892Y02E10/547
    • Embodiments of the present invention may include single crystal silicon solar cell structures with epitaxially deposited silicon device layers with deep junction(s). In some embodiments, the single crystal silicon solar cell structures may comprise a moderately doped, thick (greater than 10 microns), epitaxially deposited silicon emitter layer. In some embodiments, the single crystal silicon solar cell structures may comprise moderately doped, thick (greater than 10 microns), epitaxially deposited FSF layers. The moderate doping reduces electron-hole recombination within the FSF and emitter layers and causes smaller bandgap narrowing and reduced Auger recombination compared to prior art devices which typically have more heavily doped layers, and the thicker FSF and emitter layers than typically used in prior art devices assist in having a desirable sheet resistance for the solar cell front and back surface, as measured prior to front side and back side metallization.
    • 本发明的实施例可以包括具有具有深结的外延沉积硅器件层的单晶硅太阳能电池结构。 在一些实施例中,单晶硅太阳能电池结构可以包括适度掺杂的(大于10微米)的外延沉积的硅发射极层。 在一些实施例中,单晶硅太阳能电池结构可以包括中等掺杂,厚(大于10微米)的外延沉积的FSF层。 与现有技术中通常具有更高掺杂层的器件相比,中等掺杂减少了FSF和发射极层内的电子 - 空穴复合,并导致较小的带隙变窄和减小的俄歇复合,以及比现有技术器件中通常使用的较厚的FSF和发射极层 有助于在前侧和后侧金属化之前测量的太阳能电池正面和背面具有理想的薄层电阻。