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1. 发明申请

WO2009114108A2 INTEGRATED METHOD AND SYSTEM FOR MANUFACTURING MONOLITHIC PANELS OF CRYSTALLINE SOLAR CELLS 审中-公开
标题翻译：用于制造晶体太阳能电池单层面的集成方法和系统
公开(公告)号：WO2009114108A2
公开(公告)日：2009-09-17
申请号：PCT/US2009/001457
申请日：2009-03-06
申请人： CRYSTAL SOLAR, INC. , RAVI, Tirunelveli, S. , KUMAR, Ananda, H. , ASTHANA, Ashish
发明人： RAVI, Tirunelveli, S. , KUMAR, Ananda, H. , ASTHANA, Ashish
IPC分类号： H01L31/042 , H01L21/68
CPC分类号： H01L31/1876 , H01L21/68728 , H01L31/048 , H01L31/068 , H01L31/1804 , H01L31/1892 , Y02E10/50 , Y02E10/547 , Y02P70/521
摘要： A method for fabricating a photovoltaic (PV) cell panel wherein all PV cells are formed simultaneously on a two-dimensional array of monocrystalline silicon mother wafers (3002) affixed to a susceptor (3025). Porous silicon separation layers (3010) are anodized in the surfaces of the mother wafers. The porous film is then smoothed to form a suitable surface for epitaxial film growth. An epitaxial reactor is used to grow n- and p-type films forming the PV cell structures (3016). Contacts to the n- and p-layers are deposited, followed by gluing of a glass layer (3012) to the PV cell array. The porous silicon film is then separated by exfoliation in a peeling motion across all the cells attached together above, followed by attaching a strengthening layer on the PV cell array. The array of mother wafers may be reused multiple times, thereby reducing materials costs for the completed solar panels.
摘要翻译：一种制造光伏（PV）电池板的方法，其中所有PV电池同时形成在固定在基座（3025）上的单晶硅母晶片（3002）的二维阵列上。在母晶片的表面中阳极氧化多孔硅分离层（3010）。然后使多孔膜平滑以形成用于外延膜生长的合适表面。使用外延反应器来生长形成PV电池结构的n型和p型膜（3016）。与n层和p层的接触被沉积，然后将玻璃层（3012）粘合到PV电池阵列上。然后通过剥离运动将多孔硅膜分离穿过所有附着在上面的细胞，然后在PV电池阵列上附加强化层。母晶片的阵列可以重复使用多次，从而减少完成的太阳能电池板的材料成本。

2. 发明申请

WO2012021750A1 MWT ARCHITECTURE FOR THIN SI SOLAR CELLS 审中-公开
标题翻译：微型太阳能电池的MWT结构
公开(公告)号：WO2012021750A1
公开(公告)日：2012-02-16
申请号：PCT/US2011/047486
申请日：2011-08-11
申请人： CRYSTAL SOLAR, INC. , ASTHANA, Ashish , RAVI, Tirunelveli, S. , RAVI, Kramadhati, V. , NAG, Somnath
发明人： ASTHANA, Ashish , RAVI, Tirunelveli, S. , RAVI, Kramadhati, V. , NAG, Somnath
IPC分类号： H01L31/00
CPC分类号： H01L31/02245 , H01L31/02168 , H01L31/03921 , H01L31/068 , H01L31/1804 , H01L31/1892 , Y02E10/547 , Y02P70/521
摘要： Methods of fabricating metal wrap through solar cells and modules for thin silicon solar cells, including epitaxial silicon solar cells, are described. These metal wrap through solar cells have a planar back contact geometry for the base and emitter contacts. Fabrication of a metal wrap through solar cell may comprise: providing a photovoltaic device attached at the emitter side of the device to a solar glass by an encapsulant, the device including busbars on the device emitter; forming vias through the device base and emitter, the vias terminating in the busbars; depositing a conformal dielectric film over the surface of the vias and the back surface of the base; removing portions of the conformal dielectric film from the ends of the vias for exposing the busbars and from field areas of the base; and forming separate electrical contacts to the busbars and the field areas on the back surface of the solar cell. The solar cells may comprise epitaxially deposited silicon and may include an epitaxially deposited back surface field.
摘要翻译：描述了通过太阳能电池制造金属封套的方法和用于薄硅太阳能电池的模块，包括外延硅太阳能电池。这些金属包裹太阳能电池具有用于基极和发射极触点的平面后接触几何形状。通过太阳能电池的金属卷绕的制造可以包括：通过密封剂将设备的发射极侧附接到太阳能玻璃的光伏器件提供，该器件包括在器件发射器上的汇流条; 通过设备基座和发射器形成通孔，终端在母线中的通孔; 在所述通孔的表面和所述基底的后表面上沉积保形电介质膜; 从所述通孔的端部去除所述共形绝缘膜的部分，以暴露所述母线和所述基座的场区域; 并且形成与母线和太阳能电池背面上的场区分开的电接触。太阳能电池可以包括外延沉积的硅并且可以包括外延沉积的背表面场。

3. 发明申请

WO2013020111A1 PHOTOVOLTAIC MODULE FABRICATION WITH THIN SINGLE CRYSTAL EPITAXIAL SILICON DEVICES 审中-公开
标题翻译：具有薄单晶外延硅设备的光电模块制造
公开(公告)号：WO2013020111A1
公开(公告)日：2013-02-07
申请号：PCT/US2012/049648
申请日：2012-08-03
申请人： CRYSTAL SOLAR, INC. , RAVI, Kramadhati, V. , RAVI, Tirunelveli, S. , ASTHANA, Ashish , NAG, Somnath
发明人： RAVI, Kramadhati, V. , RAVI, Tirunelveli, S. , ASTHANA, Ashish , NAG, Somnath
IPC分类号： H01L31/042
CPC分类号： H01L31/0504 , H01L31/02363 , H01L31/048 , H01L31/068 , H01L31/1896 , Y02E10/547
摘要： Photovoltaic modules including a plurality of solar cells bonded to a module back sheet are described herein, wherein each solar cell includes a superstrate bonded to a front side of a photovoltaic device to facilitate handling of very thin photovoltaic devices during fabrication of the module. Modules may also include module front sheets and the solar cells may include bottom sheets. The modules may be made of flexible materials, and may be foldable. Fabrication processes include tabbing photovoltaic devices prior to attaching the individual superstrates.
摘要翻译：这里描述了包括结合到模块背板的多个太阳能电池的光伏模块，其中每个太阳能电池包括结合到光伏器件的前侧的顶板，以便于在模块制造期间处理非常薄的光伏器件。模块还可以包括模块前片，并且太阳能电池可以包括底片。模块可以由柔性材料制成，并且可以是可折叠的。制造工艺包括在连接各个覆盖物之前贴上光伏器件。

4. 发明申请

WO2012129184A1 INSITU EPITAXIAL DEPOSITION OF FRONT AND BACK JUNCTIONS IN SINGLE CRYSTAL SILICON SOLAR CELLS 审中-公开
标题翻译：单晶硅太阳能电池中正面和反面结的外延沉积
公开(公告)号：WO2012129184A1
公开(公告)日：2012-09-27
申请号：PCT/US2012/029708
申请日：2012-03-19
申请人： CRYSTAL SOLAR, INC. , RAVI, Tirunelveli, S. , ASTHANA, Ashish
发明人： RAVI, Tirunelveli, S. , ASTHANA, Ashish
IPC分类号： H01L31/00
CPC分类号： H01L31/022433 , H01L21/02381 , H01L21/0245 , H01L21/02513 , H01L21/02532 , H01L21/02579 , H01L21/02664 , H01L31/022441 , H01L31/02366 , H01L31/0684 , H01L31/1804 , Y02E10/547 , Y02P70/521
摘要： Fabrication of a single crystal silicon solar cell with an insitu epitaxially deposited very highly doped p-type silicon back surface field obviates the need for the conventional aluminum screen printing step, thus enabling a thinner silicon solar cell because of no aluminum induced bow in the cell. Furthermore, fabrication of a single crystal silicon solar cell with insitu epitaxial p-n junction formation and very highly doped n-type silicon front surface field completely avoids the conventional dopant diffusion step and one screen printing step, thus enabling a cheaper manufacturing process.
摘要翻译：具有外延沉积非常高掺杂的p型硅背表面场的单晶硅太阳能电池的制造消除了对传统的铝丝网印刷步骤的需要，因此由于在电池中没有铝诱导的弓形，因此能够实现更薄的硅太阳能电池。此外，具有内插外延p-n结形成和非常高掺杂的n型硅前表面场的单晶硅太阳能电池的制造完全避免了常规掺杂剂扩散步骤和一个丝网印刷步骤，从而实现了更便宜的制造工艺。

5. 发明申请

WO2010030962A3 STRUCTURES AND METHODS FOR WAFER PACKAGES, AND PROBES 审中-公开
公开(公告)号：WO2010030962A3
公开(公告)日：2010-03-18
申请号：PCT/US2009/056761
申请日：2009-09-12
申请人： KUMAR, Ananda, H.
发明人： KUMAR, Ananda, H. , ASTHANA, Ashish , QUADRI, Farooq
IPC分类号： H01L21/60 , H01L23/48 , H01L21/66
摘要： This document describes the fabrication and use of multilayer ceramic substrates, having one or more levels of internal thick film metal conductor patterns, wherein any or all of the metal vias intersecting one or both of the major surface planes of the substrates, extend out of the surface to be used for making flexible, temporary or permanent interconnections, to terminals of an electronic component. Such structures are useful for wafer probing, and for packaging, of semiconductor devices. In some embodiments, such structures are shown to be useful for simultaneously testing multiple devices on a semiconductor wafer, or for assembling multiple substrates on to a wafer, to accomplish both testing and packaging of the dies on the wafer. In yet another embodiment of the invention, single or multilevel ceramic interconnect structures with thick film metal conductors, are fabricated right on the product wafer to facilitate economical testing and packaging of the dies on the wafer.

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