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1. 发明申请

WO2004077512A3 UNIVERSAL SUBSTRATE HOLDER FOR TREATING OBJECTS IN FLUIDS 审中-公开
公开(公告)号：WO2004077512A3
公开(公告)日：2004-09-10
申请号：PCT/US2004/005214
申请日：2004-02-23
申请人： BLUE29 CORPORATION , IVANOV, Igor, C. , ZHANG, Jonathan, Weiguo
发明人： IVANOV, Igor, C. , ZHANG, Jonathan, Weiguo
IPC分类号： B23B31/14
摘要： A universal substrate holder of the invention for treating wafer substrates in liquids is provided with a shaft and a rod slidingly inserted into the central opening of the shaft. The end of the shaft that protrudes into the bowl supports a base platform for the substrate, while the end of the rod that protrudes into the bowl has radial arms that rigidly support an annular plate with pins that can pass through the opening of the base platform so that they can support the substrate above the surface of the platform. The annular plate supports clamping jaws made in the form of two-arm levers with shorter arms and longer arms. The longer arms are heavier and therefore in the stationary state of the holder keep the jaws turned into an open position. When the shaft begins to rotate, the jaws are turned under the effect of centrifugal forces into positions of clamping the substrate with the shorter arms. When the rod is pulled down, the ends of the longer arms come into contact with the base platform and are turned into the clamping position. The substrate holder of the invention allows clamping and releasing of the substrate in positions of the substrate above the platform and in a position of the substrate on the base substrate, when the backside of the substrate is inaccessible to the process liquid.

2. 发明申请

WO2004027837A1 TEMPERATURE-CONTROLLED SUBSTRATE HOLDER 审中-公开
标题翻译：温度控制基板支架
公开(公告)号：WO2004027837A1
公开(公告)日：2004-04-01
申请号：PCT/US2003/026697
申请日：2003-08-26
申请人： BLUE29 CORPORATION
发明人： IVANOV, Igor, C. , ZHANG, Jonathan, Weiguo , KOLICS, Artur
IPC分类号： H01L21/00
CPC分类号： C23C18/163 , B24B37/30 , B24B49/14 , C23C18/1678 , H01L21/288 , H01L21/2885 , H01L21/67248 , H01L21/68785
摘要： A substrate holder has a disk-like body with a central recess having diameter smaller than the diameter of the substrate placed onto the upper surface of the holder. The substrate can be clamped in place by the clamps of the edge-grip mechanism or placed into a seat without the use of clamps. In both cases, the substrate forms a partial wall that confines the heating/cooling recess or chamber. The aforementioned recess is filled with a cooling or heating liquid (depending on the mode of metal deposition) selectively supplied from a liquid heating or cooling system. In order to ensure in the working chamber above the substrate a pressure slightly higher than the pressure in the cooling/heating recess, the working chamber is first filled with the working solution under the atmospheric pressure, and then the recess is filled with a heating or cooling liquid with simultaneous increase of pressure in the working chamber to a level slightly exceeding the pressure in the recess. The substrate holder of the invention provides direct heat/cool-exchange between the heating/cooling medium and the substrate and allows instantaneous change of temperature of the heating/cooling liquid.
摘要翻译：衬底保持器具有盘状体，其具有直径小于放置在保持器的上表面上的衬底的直径的中心凹部。基板可以通过边缘抓握机构的夹具夹紧就位，或者不使用夹具而放置在座中。在这两种情况下，基板形成限制加热/冷却凹部或室的局部壁。上述凹部填充有从液体加热或冷却系统选择性地供应的冷却或加热液体（取决于金属沉积的模式）。为了确保在基板上方的工作室内的压力略高于冷却/加热凹槽中的压力，工作室首先在大气压力下被工作溶液填充，然后用加热或冷却液体，同时将工作室中的压力提高到稍微超过凹部中的压力的水平。本发明的衬底保持器在加热/冷却介质和衬底之间提供直接的热/冷交换，并且允许加热/冷却液体的温度的瞬时变化。

3. 发明申请

WO2004047149A3 SPATIALLY-ARRANGED CHEMICAL PROCESSING STATION 审中-公开
公开(公告)号：WO2004047149A3
公开(公告)日：2004-06-03
申请号：PCT/US2003/036736
申请日：2003-11-18
申请人： BLUE29 CORPORATION
发明人： IVANOV, Igor, C. , TING, Chiu , ZHANG, Jonathan, Weiguo , KOLICS, Artur
IPC分类号： B05C11/00
摘要： The present invention discloses a station, e.g., for IC fabrication with a flexible configuration. It consists of an array of processing chambers, which are grouped into processing modules and arranged in a two-dimensional fashion, in vertical levels and horizontal rows, and is capable of operating independent of each other. Each processing chamber can perform electroless deposition and other related processing steps sequentially on a wafer with more than one processing fluid without having to remove it from the chamber. The system is served by a single common industrial robot, which may have a random to access to all the working chambers and cells of the storage unit for transporting wafers between the wafer cassettes and inlet/outlets ports of any of the chemical processing chambers. The station occupies a service-room floor space and a clean-room floor space. The processing modules and the main chemical management unit connected to the local chemical supply unit occupy a service-room floor space, while the robot and the wafer storage cassettes are located in a clean room. Thus, in distinction to the known cluster-tool machines, the station of the invention makes it possible to transfer part of the units from the expensive clean-room area to less-expensive service area.

4. 发明申请

WO2004024983A2 METHOD AND APPARATUS FOR ELECTROLESS DEPOSITION WITH TEMPERATURE-CONTROLLED CHUCK 审中-公开
标题翻译：用温度控制的电解沉积的方法和装置
公开(公告)号：WO2004024983A2
公开(公告)日：2004-03-25
申请号：PCT/US2003/026698
申请日：2003-08-26
申请人： BLUE29 CORPORATION
发明人： IVANOV, Igor, C. , ZHANG, Jonathan, Weiguo , KOLICS, Artur
IPC分类号： C23C18/16
CPC分类号： H01L21/67109 , C23C18/1619 , C23C18/1676 , C23C18/1678 , C23C18/168 , C23C18/1682
摘要： The method for electroless deposition of a coating material, which may be a metal, semiconductor, or dielectric, that is carried out at a relatively low temperature of the working solution compensated by an increased temperature on the substrate which is controlled by a heater built into the substrate chuck. A decrease in the temperature of the working solution prevents thermal decomposition of the solution and reduces formation of gas bubbles, normally generated at increased temperatures. Accumulation of bubbles on the surface of the substrate is further prevented due to upwardly-facing orientation of the treated surface of the substrate. The substrate holder is equipped with a substrate heater and a substrate cooler that can be used alternately for quick heating or cooling of the substrate surface.
摘要翻译：用于无电沉积涂覆材料的方法，其可以是金属，半导体或电介质，其在工作溶液的相对低的温度下进行，所述工作溶液由基板上升高的温度补偿，该温度由内置的基板卡盘。工作溶液的温度降低可防止溶液的热分解，并减少通常在升高的温度下产生的气泡的形成。由于衬底的处理表面的向上取向，进一步防止了衬底表面积聚的气泡。基板保持器配备有可以交替地用于基板表面的快速加热或冷却的基板加热器和基板冷却器。

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