专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

WO2008070528A3 PRECISION PRINTING ELECTROPLATING THROUGH PLATING MASK ON A SOLAR CELL SUBSTRATE 审中-公开
标题翻译：精密印刷通过太阳能电池基板上的电镀掩模进行电镀
公开(公告)号：WO2008070528A3
公开(公告)日：2008-07-24
申请号：PCT/US2007085963
申请日：2007-11-29
申请人： APPLIED MATERIALS INC , LOPATIN SERGEY , DUKOVIC JOHN O , EAGLESHAM DAVID , KOVARSKY NICOLAY Y , BACHRACH ROBERT , BUSCH JOHN , GAY CHARLES
发明人： LOPATIN SERGEY , DUKOVIC JOHN O , EAGLESHAM DAVID , KOVARSKY NICOLAY Y , BACHRACH ROBERT , BUSCH JOHN , GAY CHARLES
IPC分类号： C25D5/18
CPC分类号： H01L31/022425 , H01L31/02008 , Y02E10/50
摘要： Embodiments of the invention contemplate the formation of a low cost solar cell using a novel electroplating apparatus and method to form a metal contact structure having metal lines formed using an electrochemical plating process. The apparatus and methods described herein remove the need to perform the often costly processing steps of performing a mask preparation and formation steps, such as screen printing, lithographic steps and inkjet printing steps, to form a contact structure. The resistance of interconnects formed in a solar cell device greatly affects the efficiency of the solar cell. It is thus desirable to form a solar cell device that has a low resistance connection that is reliable and cost effective. Therefore, one or more embodiments of the invention described herein are adapted to form a low cost and reliable interconnecting layer using an electrochemical plating process containing a common metal, such as copper.
摘要翻译：本发明的实施例考虑使用新型电镀设备和方法形成低成本太阳能电池，以形成具有使用电化学电镀工艺形成的金属线的金属接触结构。本文描述的装置和方法消除了进行掩模准备和形成步骤（例如丝网印刷，平版印刷步骤和喷墨印刷步骤）经常昂贵的处理步骤以形成接触结构的需要。在太阳能电池装置中形成的互连电阻极大地影响太阳能电池的效率。因此，希望形成具有可靠和成本有效的低电阻连接的太阳能电池装置。因此，本文所述的本发明的一个或多个实施例适用于使用包含普通金属（例如铜）的电化学电镀工艺形成低成本且可靠的互连层。

2. 发明申请

WO2008070568A3 APPARATUS AND METHOD FOR ELECTROPLATING ON A SOLAR CELL SUBSTRATE 审中-公开
标题翻译：用于电镀在太阳能电池基板上的装置和方法
公开(公告)号：WO2008070568A3
公开(公告)日：2008-09-12
申请号：PCT/US2007086145
申请日：2007-11-30
申请人： APPLIED MATERIALS INC , LOPATIN SERGEY , KOVARSKY NICOLAY Y , EAGLESHAM DAVID , DUKOVIC JOHN O , GAY CHARLES
发明人： LOPATIN SERGEY , KOVARSKY NICOLAY Y , EAGLESHAM DAVID , DUKOVIC JOHN O , GAY CHARLES
IPC分类号： C25D5/18
CPC分类号： H01L31/022425 , C23C28/021 , C23C28/023 , C23C28/025 , C23C28/028 , C23C28/321 , C23C28/322 , C23C28/3225 , C23C28/34 , C23C28/36 , C25D5/022 , C25D5/08 , C25D5/50 , C25D17/00 , C25D17/001 , C25D17/02 , C25D17/06 , Y02E10/50
摘要： Embodiments of the invention contemplate the formation of a low cost solar cell using a novel method and apparatus to form a metal contact structure having selectively formed metal lines using an electrochemical plating process. The apparatus and methods described herein remove the need to perform one or more high temperature screen printing processes to form conductive features on the surface of a solar cell substrate. The resistance of interconnects formed in a solar cell device greatly affects the efficiency of the solar cell. It is thus desirable to form a solar cell device that has a low resistance connection that is reliable and cost effective. Therefore, one or more embodiments of the invention described herein are adapted to form a low cost and reliable interconnecting layer using an electrochemical plating process containing a common metal, such as copper.
摘要翻译：本发明的实施例考虑使用新颖的方法和装置形成低成本太阳能电池，以形成具有使用电化学电镀工艺的具有选择性地形成的金属线的金属接触结构。本文所述的装置和方法消除了执行一个或多个高温丝网印刷工艺以在太阳能电池基板的表面上形成导电特征的需要。在太阳能电池器件中形成的互连的电阻极大地影响太阳能电池的效率。因此，希望形成具有可靠和成本有效的低电阻连接的太阳能电池装置。因此，本文描述的本发明的一个或多个实施例适用于使用包含普通金属（例如铜）的电化学电镀工艺形成低成本且可靠的互连层。

3. 发明申请

WO2011049811A3 POINT-OF-USE SILYLAMINE GENERATION 审中-公开
标题翻译：使用要点使用硅烷生成
公开(公告)号：WO2011049811A3
公开(公告)日：2011-07-14
申请号：PCT/US2010052643
申请日：2010-10-14
申请人： APPLIED MATERIALS INC , KOVARSKY NICOLAY Y , LUBOMIRSKY DMITRY
发明人： KOVARSKY NICOLAY Y , LUBOMIRSKY DMITRY
IPC分类号： C23C16/22 , C23C16/30 , C23C16/44 , H01L21/205
CPC分类号： H01L21/02274 , C01B21/087 , C23C16/4488 , H01L21/0217 , H01L21/02222
摘要： The production and delivery of a reaction precursor containing one or more silylamines near a point of use is described. Silylamines may include trisilylamine (TSA) but also disilylamine (DSA) and monosilylamine (MSA). Mixtures involving two or more silylamines can change composition (e.g. proportion of DSA to TSA) over time. Producing silylamines near a point-of-use limits changing composition, reduces handling of unstable gases and reduces cost of silylamine-consuming processes.
摘要翻译：描述了在使用点附近含有一种或多种甲硅烷基胺的反应前体的生产和递送。甲硅烷基胺可以包括三甲硅烷胺（TSA），也可以包括二甲苯胺（DSA）和单甲胺（MSA）。涉及两种或多种甲硅烷基胺的混合物可随时间改变组成（例如DSA与TSA的比例）。在使用点附近生产甲硅烷基胺限制了组合变化，减少了不稳定气体的处理，并降低了甲胺胺消耗过程的成本。

4. 发明申请

WO2006102182A2 PROCESS FOR ELECTROLESS COPPER DEPOSITION 审中-公开
标题翻译：电沉积铜沉积工艺
公开(公告)号：WO2006102182A2
公开(公告)日：2006-09-28
申请号：PCT/US2006009920
申请日：2006-03-20
申请人： APPLIED MATERIALS INC , LUBOMIRSKY DMITRY , WEIDMAN TIMOTHY W , SHANMUGASUNDRAM ARULKUMAR , KOVARSKY NICOLAY Y , WIJEKOON KAPILA , CHU SCHUBERT S , WU FREDERICK C , SHAH KAVITA
发明人： LUBOMIRSKY DMITRY , WEIDMAN TIMOTHY W , SHANMUGASUNDRAM ARULKUMAR , KOVARSKY NICOLAY Y , WIJEKOON KAPILA , CHU SCHUBERT S , WU FREDERICK C , SHAH KAVITA
IPC分类号： B28B19/00 , C23C18/34
CPC分类号： C23C18/1608 , C23C18/165 , C23C18/1882 , C23C18/34 , H01L21/288 , H01L21/76802 , H01L21/76831 , H01L21/76843 , H01L21/76844 , H01L21/76864 , H01L21/76874 , H01L21/76877
摘要： Embodiments of the invention provide methods for forming conductive materials within contact features on a substrate by depositing a seed layer within a feature and subsequently filling the feature with a copper-containing material during an electroless deposition process. In one example, a copper electroless deposition solution contains levelers to form convexed or concaved copper surfaces. In another example, a seed layer is selectively deposited on the bottom surface of the aperture while leaving the sidewalls substantially free of the seed material during a collimated PVD process. In another example, the seed layer is conformably deposited by a PVD process and subsequently, a portion of the seed layer and the underlayer are plasma etched to expose an underlying contact surface. In another example, a ruthenium seed layer is formed on an exposed contact surface by an ALD process utilizing the chemical precursor ruthenium tetroxide.
摘要翻译：本发明的实施例提供了通过在特征内沉积种子层并随后在无电沉积工艺期间用含铜材料填充该特征来在基底上的接触特征内形成导电材料的方法。在一个实例中，铜无电解沉积溶液含有形成凸形或凹陷铜表面的矫直机。在另一个实例中，在准直的PVD工艺期间，将籽晶层选择性地沉积在孔的底表面上，同时留下基本上不含种子材料的侧壁。在另一个实例中，种子层通过PVD工艺顺应地沉积，随后种子层和底层的一部分被等离子体蚀刻以暴露下面的接触表面。在另一个实例中，通过使用化学前体四氧化钌的ALD方法在暴露的接触表面上形成钌籽晶层。

5. 发明申请

WO2004013381A2 INSOLUBLE ANODE LOOP IN COPPER ELECTRODEPOSITION CELL FOR INTERCONNECT FORMATION 审中-公开
标题翻译：用于互连形成的铜电极沉积池中的非阳极阳极环
公开(公告)号：WO2004013381A2
公开(公告)日：2004-02-12
申请号：PCT/US0324621
申请日：2003-08-06
申请人： APPLIED MATERIALS INC
发明人： KOVARSKY NICOLAY Y , LUBOMIRSKY DMITRY , CHANG ANZHONG , DORDI YEZDI N , YANG MICHAEL X
IPC分类号： C25D7/12 , C25D21/18 , C25D21/22 , H01L21/288 , C25D
CPC分类号： H01L21/2885 , C25D7/123 , C25D21/18 , C25D21/22
摘要： Embodiments of the invention generally provide a method and apparatus for plating a metal on a substrate. The electrochemical plating system generally includes a plating cell having an anolyte compartment and a catholyte compartment, the anolyte compartment having an insoluble anode and an anolyte therein. The catholyte compartment generally includes a substrate support member and a catholyte therein. In addition, the plating cell generally includes an ion-exchange membrane disposed between the anolyte compartment and the catholyte compartment and a pump in fluid communication with the anolyte compartment, the pump configured to provide an anolyte to the anolyte compartment having a linear velocity of between about 0.5 cm/sec to about 50 cm/sec. The method generally includes supplying an anolyte solution to an anolyte compartment disposed in a plating cell having an anolyte compartment and a catholyte compartment. The anolyte solution generally passes through the anolyte compartment at a linear velocity of between about 0.5 cm/sec to about 50 cm/sec. The method further includes plating a metal onto the substrate with a catholyte solution disposed in a catholyte compartment of the plating cell, the catholyte compartment and the anolyte compartment separated by an ion-exchange membrane, removing used anolyte solution from the plating cell and passing at least a portion of the used anolyte solution through a correction device including at least one of copper oxide, copper hydroxide and combinations thereof.
摘要翻译：本发明的实施例通常提供一种用于在基底上电镀金属的方法和装置。电化学电镀系统通常包括具有阳极电解液室和阴极电解液隔室的电镀槽，阳极电解液室具有不溶性阳极和阳极电解液。阴极电解液隔室通常在其中包括基板支撑构件和阴极电解液。此外，电镀槽通常包括设置在阳极电解液室和阴极电解液室之间的离子交换膜和与阳极电解液室流体连通的泵，所述泵被配置为向阳极电解液室提供线性速度介于约0.5cm / sec至约50cm / sec。该方法通常包括将阳极电解液供应到设置在具有阳极电解液室和阴极电解液室的电镀槽中的阳极电解液室。阳极电解液通常以约0.5cm / sec至约50cm / sec的线速度穿过阳极电解液室。该方法还包括用设置在电镀池的阴极电解液室中的阴极电解液，阴离子电解质隔室和由离子交换膜隔开的阳极电解液室将金属电镀到基板上，从电镀槽中除去使用的阳极电解液并通过通过包括氧化铜，氢氧化铜及其组合中的至少一种的校正装置的至少一部分所使用的阳极电解液。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式