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1. 发明申请

WO2005007933A1 ELECTROCHEMICAL PROCESSING CELL 审中-公开
标题翻译：电化学处理细胞
公开(公告)号：WO2005007933A1
公开(公告)日：2005-01-27
申请号：PCT/US2004/022183
申请日：2004-07-08
申请人： APPLIED MATERIALS, INC. , YANG, Michael X , LUBOMIRSKY, Dmitry , DORDI, Yezdi N. , SINGH, Saravjeet , TULSHIBAGWALE, Sheshraj L. , KOVARSKY, Nicolay Y.
发明人： YANG, Michael X , LUBOMIRSKY, Dmitry , DORDI, Yezdi N. , SINGH, Saravjeet , TULSHIBAGWALE, Sheshraj L. , KOVARSKY, Nicolay Y.
IPC分类号： C25B9/08
CPC分类号： C25D3/38 , C25D7/123 , C25D17/001 , C25D17/002
摘要： Embodiments of the invention provide an electrochemical plating cell (100). The plating cell includes a fluid basin (101), (102) having an anolyte solution compartment and a catholyte solution compartment, an ionic membrane (112) positioned between the anolyte solution compartment and the catholyte solution compartment, and an anode positioned in the anolyte solution compartment, wherein the ionic membrane comprises a poly tetrafluoroethylene based ionomer.
摘要翻译：本发明的实施例提供一种电化学电镀单元（100）。电镀槽包括具有阳极电解液室和阴极电解液溶液室的流体池（101），（102），位于阳极电解液室和阴极电解液溶液室之间的离子膜（112）和位于阳极电解液中的阳极溶液隔室，其中所述离子膜包含基于聚四氟乙烯的离聚物。

2. 发明申请

WO2011049811A3 POINT-OF-USE SILYLAMINE GENERATION 审中-公开
标题翻译：使用要点使用硅烷生成
公开(公告)号：WO2011049811A3
公开(公告)日：2011-07-14
申请号：PCT/US2010052643
申请日：2010-10-14
申请人： APPLIED MATERIALS INC , KOVARSKY NICOLAY Y , LUBOMIRSKY DMITRY
发明人： KOVARSKY NICOLAY Y , LUBOMIRSKY DMITRY
IPC分类号： C23C16/22 , C23C16/30 , C23C16/44 , H01L21/205
CPC分类号： H01L21/02274 , C01B21/087 , C23C16/4488 , H01L21/0217 , H01L21/02222
摘要： The production and delivery of a reaction precursor containing one or more silylamines near a point of use is described. Silylamines may include trisilylamine (TSA) but also disilylamine (DSA) and monosilylamine (MSA). Mixtures involving two or more silylamines can change composition (e.g. proportion of DSA to TSA) over time. Producing silylamines near a point-of-use limits changing composition, reduces handling of unstable gases and reduces cost of silylamine-consuming processes.
摘要翻译：描述了在使用点附近含有一种或多种甲硅烷基胺的反应前体的生产和递送。甲硅烷基胺可以包括三甲硅烷胺（TSA），也可以包括二甲苯胺（DSA）和单甲胺（MSA）。涉及两种或多种甲硅烷基胺的混合物可随时间改变组成（例如DSA与TSA的比例）。在使用点附近生产甲硅烷基胺限制了组合变化，减少了不稳定气体的处理，并降低了甲胺胺消耗过程的成本。

3. 发明申请

WO2008070528A3 PRECISION PRINTING ELECTROPLATING THROUGH PLATING MASK ON A SOLAR CELL SUBSTRATE 审中-公开
标题翻译：精密印刷通过太阳能电池基板上的电镀掩模进行电镀
公开(公告)号：WO2008070528A3
公开(公告)日：2008-07-24
申请号：PCT/US2007085963
申请日：2007-11-29
申请人： APPLIED MATERIALS INC , LOPATIN SERGEY , DUKOVIC JOHN O , EAGLESHAM DAVID , KOVARSKY NICOLAY Y , BACHRACH ROBERT , BUSCH JOHN , GAY CHARLES
发明人： LOPATIN SERGEY , DUKOVIC JOHN O , EAGLESHAM DAVID , KOVARSKY NICOLAY Y , BACHRACH ROBERT , BUSCH JOHN , GAY CHARLES
IPC分类号： C25D5/18
CPC分类号： H01L31/022425 , H01L31/02008 , Y02E10/50
摘要： Embodiments of the invention contemplate the formation of a low cost solar cell using a novel electroplating apparatus and method to form a metal contact structure having metal lines formed using an electrochemical plating process. The apparatus and methods described herein remove the need to perform the often costly processing steps of performing a mask preparation and formation steps, such as screen printing, lithographic steps and inkjet printing steps, to form a contact structure. The resistance of interconnects formed in a solar cell device greatly affects the efficiency of the solar cell. It is thus desirable to form a solar cell device that has a low resistance connection that is reliable and cost effective. Therefore, one or more embodiments of the invention described herein are adapted to form a low cost and reliable interconnecting layer using an electrochemical plating process containing a common metal, such as copper.
摘要翻译：本发明的实施例考虑使用新型电镀设备和方法形成低成本太阳能电池，以形成具有使用电化学电镀工艺形成的金属线的金属接触结构。本文描述的装置和方法消除了进行掩模准备和形成步骤（例如丝网印刷，平版印刷步骤和喷墨印刷步骤）经常昂贵的处理步骤以形成接触结构的需要。在太阳能电池装置中形成的互连电阻极大地影响太阳能电池的效率。因此，希望形成具有可靠和成本有效的低电阻连接的太阳能电池装置。因此，本文所述的本发明的一个或多个实施例适用于使用包含普通金属（例如铜）的电化学电镀工艺形成低成本且可靠的互连层。

4. 发明申请

WO2005028717A1 INSOLUBLE ANODE WITH AN AUXILIARY ELECTRODE 审中-公开
标题翻译：具有辅助电极的不溶性阳极
公开(公告)号：WO2005028717A1
公开(公告)日：2005-03-31
申请号：PCT/US2004/030445
申请日：2004-09-17
申请人： APPLIED MATERIALS, INC. , KOVARSKY, Nicolay, Y. , LUBOMIRSKY, Dmitry , RABINOVICH, Yevgeniy (Eugene)
发明人： KOVARSKY, Nicolay, Y. , LUBOMIRSKY, Dmitry , RABINOVICH, Yevgeniy (Eugene)
IPC分类号： C25D3/38
CPC分类号： C25D17/12 , B01D61/44 , B01D71/36 , C25D7/123 , C25D17/001 , C25D17/10 , C25D21/12
摘要： A method and apparatus for plating a metal onto a substrate. The apparatus includes a fluid basin configured to contain a plating solution, an anode fluid volume positioned in a lower portion of the fluid basin, a cathode fluid volume positioned in an upper portion of the fluid basin, an ionic membrane positioned to separate the anode fluid volume from the cathode fluid volume, a plating electrode centrally positioned in the anode fluid volume, and a deplating electrode positioned adjacent the plating electrode in the anode fluid volume.
摘要翻译：一种用于将金属电镀到基底上的方法和装置。该装置包括流体池，其构造成容纳电镀溶液，位于流体槽的下部的阳极流体体积，位于流体池的上部的阴极流体体积，定位成将阳极流体分离的离子膜来自阴极流体体积的体积，位于阳极流体体积中间的电镀电极，以及位于阳极流体体积内的电镀电极附近的脱镀电极。

5. 发明申请

WO2011049811A2 POINT-OF-USE SILYLAMINE GENERATION 审中-公开
标题翻译：使用点SILALAMINE GENERATION
公开(公告)号：WO2011049811A2
公开(公告)日：2011-04-28
申请号：PCT/US2010/052643
申请日：2010-10-14
申请人： APPLIED MATERIALS, INC. , KOVARSKY, Nicolay Y. , LUBOMIRSKY, Dmitry
发明人： KOVARSKY, Nicolay Y. , LUBOMIRSKY, Dmitry
IPC分类号： C23C16/22 , C23C16/30 , H01L21/205 , C23C16/44
CPC分类号： H01L21/02274 , C01B21/087 , C23C16/4488 , H01L21/0217 , H01L21/02222
摘要： The production and delivery of a reaction precursor containing one or more silylamines near a point of use is described. Silylamines may include trisilylamine (TSA) but also disilylamine (DSA) and monosilylamine (MSA). Mixtures involving two or more silylamines can change composition (e.g. proportion of DSA to TSA) over time. Producing silylamines near a point-of-use limits changing composition, reduces handling of unstable gases and reduces cost of silylamine-consuming processes.
摘要翻译：描述了在使用点附近生产和输送含有一种或多种甲硅烷胺的反应前体。甲硅烷胺可以包括三甲硅烷胺（TSA），但也可以包含二硅胺（DSA）和单硅烷胺（MSA）。涉及两种或更多种甲硅烷胺的混合物可随时间改变组成（例如DSA与TSA的比例）。在使用点附近生产甲硅烷胺限制了组成的变化，减少了对不稳定气体的处理并降低了甲硅烷胺消耗过程的成本。

6. 发明申请

WO2008070568A3 APPARATUS AND METHOD FOR ELECTROPLATING ON A SOLAR CELL SUBSTRATE 审中-公开
标题翻译：用于电镀在太阳能电池基板上的装置和方法
公开(公告)号：WO2008070568A3
公开(公告)日：2008-09-12
申请号：PCT/US2007086145
申请日：2007-11-30
申请人： APPLIED MATERIALS INC , LOPATIN SERGEY , KOVARSKY NICOLAY Y , EAGLESHAM DAVID , DUKOVIC JOHN O , GAY CHARLES
发明人： LOPATIN SERGEY , KOVARSKY NICOLAY Y , EAGLESHAM DAVID , DUKOVIC JOHN O , GAY CHARLES
IPC分类号： C25D5/18
CPC分类号： H01L31/022425 , C23C28/021 , C23C28/023 , C23C28/025 , C23C28/028 , C23C28/321 , C23C28/322 , C23C28/3225 , C23C28/34 , C23C28/36 , C25D5/022 , C25D5/08 , C25D5/50 , C25D17/00 , C25D17/001 , C25D17/02 , C25D17/06 , Y02E10/50
摘要： Embodiments of the invention contemplate the formation of a low cost solar cell using a novel method and apparatus to form a metal contact structure having selectively formed metal lines using an electrochemical plating process. The apparatus and methods described herein remove the need to perform one or more high temperature screen printing processes to form conductive features on the surface of a solar cell substrate. The resistance of interconnects formed in a solar cell device greatly affects the efficiency of the solar cell. It is thus desirable to form a solar cell device that has a low resistance connection that is reliable and cost effective. Therefore, one or more embodiments of the invention described herein are adapted to form a low cost and reliable interconnecting layer using an electrochemical plating process containing a common metal, such as copper.
摘要翻译：本发明的实施例考虑使用新颖的方法和装置形成低成本太阳能电池，以形成具有使用电化学电镀工艺的具有选择性地形成的金属线的金属接触结构。本文所述的装置和方法消除了执行一个或多个高温丝网印刷工艺以在太阳能电池基板的表面上形成导电特征的需要。在太阳能电池器件中形成的互连的电阻极大地影响太阳能电池的效率。因此，希望形成具有可靠和成本有效的低电阻连接的太阳能电池装置。因此，本文描述的本发明的一个或多个实施例适用于使用包含普通金属（例如铜）的电化学电镀工艺形成低成本且可靠的互连层。

7. 发明申请

WO2008070528A2 PRECISION PRINTING ELECTROPLATING THROUGH PLATING MASK ON A SOLAR CELL SUBSTRATE 审中-公开
标题翻译：精密印刷通过太阳能电池基板上的电镀掩模进行电镀
公开(公告)号：WO2008070528A2
公开(公告)日：2008-06-12
申请号：PCT/US2007/085963
申请日：2007-11-29
申请人： APPLIED MATERIALS, INC. , LOPATIN, Sergey , DUKOVIC, John O. , EAGLESHAM, David , KOVARSKY, Nicolay Y. , BACHRACH, Robert , BUSCH, John , GAY, Charles
发明人： LOPATIN, Sergey , DUKOVIC, John O. , EAGLESHAM, David , KOVARSKY, Nicolay Y. , BACHRACH, Robert , BUSCH, John , GAY, Charles
IPC分类号： B05C13/02 , H01L21/469
CPC分类号： H01L31/022425 , H01L31/02008 , Y02E10/50
摘要： Embodiments of the invention contemplate the formation of a low cost solar cell using a novel electroplating apparatus and method to form a metal contact structure having metal lines formed using an electrochemical plating process. The apparatus and methods described herein remove the need to perform the often costly processing steps of performing a mask preparation and formation steps, such as screen printing, lithographic steps and inkjet printing steps, to form a contact structure. The resistance of interconnects formed in a solar cell device greatly affects the efficiency of the solar cell. It is thus desirable to form a solar cell device that has a low resistance connection that is reliable and cost effective. Therefore, one or more embodiments of the invention described herein are adapted to form a low cost and reliable interconnecting layer using an electrochemical plating process containing a common metal, such as copper. Embodiments of the invention may provide an apparatus and method of forming a solar cell device that utilizes a reusable masking device during one or more electrochemical deposition steps.
摘要翻译：本发明的实施例考虑使用新型电镀设备和方法形成低成本太阳能电池，以形成具有使用电化学电镀工艺形成的金属线的金属接触结构。本文描述的装置和方法不需要执行经常昂贵的处理步骤来执行掩模准备和形成步骤，例如丝网印刷，光刻步骤和喷墨印刷步骤，以形成接触结构。在太阳能电池器件中形成的互连的电阻极大地影响太阳能电池的效率。因此，希望形成具有可靠和成本有效的低电阻连接的太阳能电池装置。因此，本文描述的本发明的一个或多个实施例适用于使用包含普通金属（例如铜）的电化学电镀工艺形成低成本且可靠的互连层。本发明的实施例可以提供一种形成在一个或多个电化学沉积步骤期间利用可重复使用的掩模装置的太阳能电池装置的装置和方法。

8. 发明申请

WO2008070290A1 PULSE PLATING OF A LOW STRESS FILM ON A SOLAR CELL SUBSTRATE 审中-公开
标题翻译：在太阳能电池基板上的低应力膜的脉冲电镀
公开(公告)号：WO2008070290A1
公开(公告)日：2008-06-12
申请号：PCT/US2007/081530
申请日：2007-10-16
申请人： APPLIED MATERIALS, INC. , LOPATIN, Sergey , GAY, Charles , EAGLESHAM, David , DUKOVIC, John O. , KOVARSKY, Nicolay Y.
发明人： LOPATIN, Sergey , GAY, Charles , EAGLESHAM, David , DUKOVIC, John O. , KOVARSKY, Nicolay Y.
IPC分类号： H01L31/00
CPC分类号： H01L31/022425 , H01L31/02245 , Y02E10/50
摘要： Embodiments of the invention contemplate the formation of a low cost solar cell metal contact structure that has improved electrical and mechanical properties through the use of an electrochemical plating process. The resistance of interconnects formed in a solar cell device greatly affects the efficiency of the solar cell. It is thus desirable to form a solar cell device that has a low resistance connections that is reliable and cost effective. One or more embodiments of the invention described herein are adapted to form a low cost and reliable interconnecting layer using an electrochemical plating process containing common metal, such as copper. However, generally the electroplated portions of the interconnecting layer may contain a substantially pure metal or a metal alloy layer. Methods are discussed herein that are used to form a solar cell containing conductive metal interconnect layer(s) that have a low intrinsic stress.
摘要翻译：本发明的实施例考虑到通过使用电化学电镀工艺形成具有改善的电气和机械性能的低成本太阳能电池金属接触结构。在太阳能电池器件中形成的互连的电阻极大地影响太阳能电池的效率。因此，希望形成具有可靠和成本有效的低电阻连接的太阳能电池装置。使用本文所述的本发明的一个或多个实施例适用于使用包含普通金属（例如铜）的电化学电镀工艺形成低成本且可靠的互连层。然而，通常互连层的电镀部分可以包含基本上纯的金属或金属合金层。本文讨论了用于形成含有具有低固有应力的导电金属互连层的太阳能电池的方法。

9. 发明申请

WO2008070568A2 APPARATUS AND METHOD FOR ELECTROPLATING ON A SOLAR CELL SUBSTRATE 审中-公开
标题翻译：用于在太阳能电池基板上电镀的装置和方法
公开(公告)号：WO2008070568A2
公开(公告)日：2008-06-12
申请号：PCT/US2007/086145
申请日：2007-11-30
申请人： APPLIED MATERIALS, INC. , LOPATIN, Sergey , KOVARSKY, Nicolay Y. , EAGLESHAM, David , DUKOVIC, John O. , GAY, Charles
发明人： LOPATIN, Sergey , KOVARSKY, Nicolay Y. , EAGLESHAM, David , DUKOVIC, John O. , GAY, Charles
IPC分类号： C25D5/10 , C25D5/12 , H01L31/00
CPC分类号： H01L31/022425 , C23C28/021 , C23C28/023 , C23C28/025 , C23C28/028 , C23C28/321 , C23C28/322 , C23C28/3225 , C23C28/34 , C23C28/36 , C25D5/022 , C25D5/08 , C25D5/50 , C25D17/00 , C25D17/001 , C25D17/02 , C25D17/06 , Y02E10/50
摘要： Embodiments of the invention contemplate the formation of a low cost solar cell using a novel method and apparatus to form a metal contact structure having selectively formed metal lines using an electrochemical plating process. The apparatus and methods described herein remove the need to perform one or more high temperature screen printing processes to form conductive features on the surface of a solar cell substrate. The resistance of interconnects formed in a solar cell device greatly affects the efficiency of the solar cell. It is thus desirable to form a solar cell device that has a low resistance connection that is reliable and cost effective. Therefore, one or more embodiments of the invention described herein are adapted to form a low cost and reliable interconnecting layer using an electrochemical plating process containing a common metal, such as copper.
摘要翻译：本发明的实施例考虑使用新颖的方法和设备形成使用电化学电镀工艺形成具有选择性形成的金属线的金属接触结构的低成本太阳能电池。本文描述的设备和方法消除了执行一个或多个高温丝网印刷工艺以在太阳能电池基板的表面上形成导电特征的需要。在太阳能电池器件中形成的互连的电阻极大地影响了太阳能电池的效率。因此期望形成具有可靠且成本有效的低电阻连接的太阳能电池装置。因此，这里描述的本发明的一个或多个实施例适于使用包含诸如铜的常见金属的电化学电镀工艺形成低成本且可靠的互连层。

10. 发明申请

WO2006102182A3 PROCESS FOR ELECTROLESS COPPER DEPOSITION 审中-公开
公开(公告)号：WO2006102182A3
公开(公告)日：2006-09-28
申请号：PCT/US2006/009920
申请日：2006-03-20
申请人： APPLIED MATERIALS, INC. , LUBOMIRSKY, Dmitry , WEIDMAN, Timothy W. , SHANMUGASUNDRAM, Arulkumar , KOVARSKY, Nicolay Y. , WIJEKOON, Kapila , CHU, Schubert S. , WU, Frederick C. , SHAH, Kavita
发明人： LUBOMIRSKY, Dmitry , WEIDMAN, Timothy W. , SHANMUGASUNDRAM, Arulkumar , KOVARSKY, Nicolay Y. , WIJEKOON, Kapila , CHU, Schubert S. , WU, Frederick C. , SHAH, Kavita
IPC分类号： H01L21/44 , H01L29/45
摘要： Embodiments of the invention provide methods for forming conductive materials within contact features on a substrate by depositing a seed layer within a feature and subsequently filling the feature with a copper-containing material during an electroless deposition process. In one example, a copper electroless deposition solution contains levelers to form convexed or concaved copper surfaces. In another example, a seed layer is selectively deposited on the bottom surface of the aperture while leaving the sidewalls substantially free of the seed material during a collimated PVD process. In another example, the seed layer is conformably deposited by a PVD process and subsequently, a portion of the seed layer and the underlayer are plasma etched to expose an underlying contact surface. In another example, a ruthenium seed layer is formed on an exposed contact surface by an ALD process utilizing the chemical precursor ruthenium tetroxide.

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