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1. 发明申请

WO2011129959A2 MOLDING WINDOWS IN THIN PADS 审中-公开
标题翻译：薄壁上的模制窗
公开(公告)号：WO2011129959A2
公开(公告)日：2011-10-20
申请号：PCT/US2011/029468
申请日：2011-03-22
申请人： APPLIED MATERIALS, INC. , SWEDEK, Boguslaw A. , BENNETT, Doyle E. , BENVEGNU, Dominic J.
发明人： SWEDEK, Boguslaw A. , BENNETT, Doyle E. , BENVEGNU, Dominic J.
IPC分类号： H01L21/304 , H01L21/66
CPC分类号： B24B37/205
摘要： A polishing pad includes a polishing layer having a polishing surface, an adhesive layer on a side of the polishing layer opposite the polishing layer, and a solid light-transmitting window extending through and molded to the polishing layer. The solid light-transmitting window has an upper portion with a first lateral dimension and a lower portion with a second lateral dimension that is smaller than the first lateral dimension. A top surface of the solid light-transmitting window coplanar with the polishing surface and a bottom surface of the solid light-transmitting window coplanar with a lower surface of the adhesive layer.
摘要翻译：抛光垫包括具有抛光表面的抛光层，与抛光层相对的抛光层一侧的粘合剂层，以及延伸穿过模制到抛光层的固体透光窗。固体透光窗具有具有第一横向尺寸的上部和具有小于第一横向尺寸的第二横向尺寸的下部。固体透光窗的顶表面与抛光表面共面并且固体透光窗的底表面与粘合剂层的下表面共面。

2. 发明申请

WO2010126901A3 METHOD OF MAKING AND APPARATUS HAVING WINDOWLESS POLISHING PAD AND PROTECTED FIBER 审中-公开
公开(公告)号：WO2010126901A3
公开(公告)日：2010-11-04
申请号：PCT/US2010/032607
申请日：2010-04-27
申请人： APPLIED MATERIALS, INC. , ZHANG, Jimin , DUBOUST, Alain , BENNETT, Doyle E.
发明人： ZHANG, Jimin , DUBOUST, Alain , BENNETT, Doyle E.
IPC分类号： H01L21/304 , H01L21/66
摘要： A polishing system includes a polishing pad with an aperture that extends through all layers of the polishing pad and a light transmissive film positioned on top of a light-generating or light-guiding element of an optical monitoring system.

3. 发明申请

WO2021231427A1 TECHNIQUE FOR TRAINING NEURAL NETWORK FOR USE IN IN-SITU MONITORING DURING POLISHING AND POLISHING SYSTEM 审中-公开
公开(公告)号：WO2021231427A1
公开(公告)日：2021-11-18
申请号：PCT/US2021/031781
申请日：2021-05-11
申请人： APPLIED MATERIALS, INC.
发明人： XU, Kun , SHRESTHA, Kiran Lall , BENNETT, Doyle E. , GAGE, David Maxwell , CHERIAN, Benjamin , QIAN, Jun , LEE, Harry Q.
IPC分类号： B24B49/10 , B24B49/02 , B24B37/04 , B24B37/013 , B24B49/105 , G06F17/15 , G06N3/08 , H01L21/304 , H01L21/3212 , H01L22/12 , H01L22/14
摘要： A method of polishing a substrate includes polishing a conductive layer on the substrate at a polishing station, monitoring the layer with an in-situ eddy current monitoring system to generate a plurality of measured signals values for a plurality of different locations on the layer, generating thickness measurements the locations, and detecting a polishing endpoint or modifying a polishing parameter based on the thickness measurements. The conductive layer is formed of a first material having a first conductivity. Generating includes calculating initial thickness values based on the plurality of measured signals values and processing the initial thickness values through a neural network that was trained using training data acquired by measuring calibration substrates having a conductive layer formed of a second material having a second conductivity that is lower than the first conductivity to generated adjusted thickness values.

4. 发明申请

WO2020067914A1 COMPENSATION FOR SUBSTRATE DOPING IN EDGE RECONSTRUCTION FOR IN-SITU ELECTROMAGNETIC INDUCTIVE MONITORING 审中-公开
公开(公告)号：WO2020067914A1
公开(公告)日：2020-04-02
申请号：PCT/RU2018/000625
申请日：2018-09-26
申请人： APPLIED MATERIALS, INC. , IVANOV, Denis Anatolyevich
发明人： IVANOV, Denis Anatolyevich , XU, Kun , GAGE, David Maxwell , LEE, Harry Q. , IRAVANI, Hassan G. , BENNETT, Doyle E. , SHRESTHA, Kiran Lall
IPC分类号： H01L21/66 , B24B1/00 , H01L21/30 , H01L21/321
摘要： A method of compensating for a contribution of conductivity of the semiconductor wafer to a measured trace by an in-situ electromagnetic induction monitoring system includes storing or generating a modified reference trace. The modified reference trace represents measurements of a bare doped reference semiconductor wafer by an in-situ electromagnetic induction monitoring system as modified by a neutral network. The substrate is monitored with an in-situ electromagnetic induction monitoring system to generate a measured trace that depends on a thickness of the conductive layer, and at least a portion of the measured trace is applied to a neural network to generate a modified measured trace. An adjusted trace is generated, including subtracting the modified reference trace from the modified measured trace.

5. 发明申请

WO2020067914A8 COMPENSATION FOR SUBSTRATE DOPING IN EDGE RECONSTRUCTION FOR IN-SITU ELECTROMAGNETIC INDUCTIVE MONITORING 审中-公开
公开(公告)号：WO2020067914A8
公开(公告)日：2020-04-02
申请号：PCT/RU2018/000625
申请日：2018-09-26
申请人： APPLIED MATERIALS, INC.
发明人： IVANOV, Denis Anatolyevich , XU, Kun , GAGE, David Maxwell , LEE, Harry Q. , IRAVANI, Hassan G. , BENNETT, Doyle E. , SHRESTHA, Kiran Lall
IPC分类号： H01L21/66 , B24B1/00 , H01L21/30 , H01L21/321
摘要： A method of compensating for a contribution of conductivity of the semiconductor wafer to a measured trace by an in-situ electromagnetic induction monitoring system includes storing or generating a modified reference trace. The modified reference trace represents measurements of a bare doped reference semiconductor wafer by an in-situ electromagnetic induction monitoring system as modified by a neutral network. The substrate is monitored with an in-situ electromagnetic induction monitoring system to generate a measured trace that depends on a thickness of the conductive layer, and at least a portion of the measured trace is applied to a neural network to generate a modified measured trace. An adjusted trace is generated, including subtracting the modified reference trace from the modified measured trace.

6. 发明申请

WO2014081590A1 POLISHING SYSTEM WITH IN-SEQUENCE SENSOR 审中-公开
标题翻译：带顺序传感器的抛光系统
公开(公告)号：WO2014081590A1
公开(公告)日：2014-05-30
申请号：PCT/US2013/069730
申请日：2013-11-12
申请人： APPLIED MATERIALS, INC.
发明人： DAVID, Jeffrey Drue , SWEDEK, Boguslaw A. , BENNETT, Doyle E. , OSTERHELD, Thomas H. , CHERIAN, Benjamin , BENVEGNU, Dominic J. , LEE, Harry Q. , D'AMBRA, Allen L. , RANGARAJAN, Jagan
IPC分类号： H01L21/304
CPC分类号： B24B37/005 , B24B37/013 , B24B37/04 , B24B37/345
摘要： A polishing apparatus includes a plurality of stations supported on a platform, the plurality of stations including at least two polishing stations and a transfer station, each polishing station including a platen to support a polishing pad, a plurality of carrier heads suspended from and movable along a track such that each polishing station is selectively positionable at the stations, and a controller configured to control motion of the carrier heads along the track such that during polishing at each polishing station only a single carrier head is positioned in the polishing station.
摘要翻译：抛光装置包括支撑在平台上的多个工位，所述多个工位包括至少两个抛光站和转移站，每个抛光站包括用于支撑抛光垫的压板，多个托架头悬挂并可沿其移动轨道，使得每个抛光站可选择性地定位在车站处;以及控制器，被配置为控制承载头沿着轨道的运动，使得在每个抛光站的抛光期间，只有单个承载头位于抛光台中。

7. 发明申请

WO2015123000A1 ADJUSTING EDDY CURRENT MEASUREMENTS 审中-公开
标题翻译：调整EDDY当前测量
公开(公告)号：WO2015123000A1
公开(公告)日：2015-08-20
申请号：PCT/US2015/012281
申请日：2015-01-21
申请人： APPLIED MATERIALS, INC.
发明人： XU, Kun , CARLSSON, Ingemar , SWEDEK, Boguslaw A. , BENNETT, Doyle E. , SHEN, Shih-Haur , IRAVANI, Hassan G. , TU, Wen-Chiang , LIU, Tzu-Yu
IPC分类号： H01L21/304 , H01L21/66
CPC分类号： B24B49/105 , B24B37/013 , B24B49/02 , B24B49/04 , B24B49/14
摘要： Among other things, a method of controlling polishing during a polishing process is described. The method includes receiving a measurement of a thickness, thick (t), of a conductive layer of a substrate undergoing polishing from an in-situ monitoring system at a time t ; receiving a measured temperature, T (t), associated with the conductive layer at the time t ; calculating resistivity pT of the conductive layer at the measured temperature T (t); adjusting the measurement of the thickness using the calculated resistivity pT to generate an adjusted measured thickness; and detecting a polishing endpoint or an adjustment for a polishing parameter based on the adjusted measured thickness.
摘要翻译：其中，描述了在抛光过程中控制抛光的方法。该方法包括在时间t从原位监测系统接收经历抛光的基底的导电层的厚度（t）的测量; 在时间t接收与导电层相关的测量温度T（t）; 在测量温度T（t）下计算导电层的电阻率pT; 使用所计算的电阻率pT调节厚度的测量值以产生调整的测量厚度; 以及基于所调整的测量厚度检测抛光终点或抛光参数的调整。

8. 发明申请

WO2015066058A1 DETERMINATION OF GAIN FOR EDDY CURRENT SENSOR 审中-公开
标题翻译： EDDY电流传感器增益的确定
公开(公告)号：WO2015066058A1
公开(公告)日：2015-05-07
申请号：PCT/US2014/062699
申请日：2014-10-28
申请人： APPLIED MATERIALS, INC.
发明人： XU, Kun , SHEN, Shih-Haur , SWEDEK, Boguslaw A. , CARLSSON, Ingemar , BENNETT, Doyle E. , TU, Wen-Chiang , IRAVANI, Hassan G. , LIU, Tzu-Yu
IPC分类号： H01L21/304
CPC分类号： B24B49/105 , B24B37/005
摘要： In one aspect, a method of controlling polishing includes receiving a measurement of an initial thickness of a conductive film on a first substrate prior to polishing the first substrate from an in-line or stand-alone monitoring system, polishing one or more substrates in a polishing system, the one or more substrates including the first substrate, during polishing of the one or more substrates, monitoring the one or more substrates with an eddy current monitoring system to generate a first signal, determining a starting value of the first signal for a start of polishing of the first substrate, determining a gain based on the starting value and the measurement of the initial thickness, for at least a portion of the first signal collected during polishing of at least one substrate of the one or more substrates, and calculating a second signal based on the first signal and the gain.
摘要翻译：一方面，一种控制抛光的方法包括：在从第一基板或独立监控系统抛光第一基板之前，在第一基板上接收导电膜的初始厚度的测量，在一个或多个基板中抛光一个或多个基板抛光系统，所述一个或多个衬底包括第一衬底，在一个或多个衬底的抛光期间，用涡流监测系统监测一个或多个衬底以产生第一信号，确定第一信号的起始值开始抛光第一衬底，对于在一个或多个衬底的至少一个衬底的抛光期间收集的第一信号的至少一部分，基于起始值和初始厚度的测量来确定增益，并且计算基于第一信号和增益的第二信号。

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