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    • 2. 发明申请
    • METHOD AND APPARATUS UTILIZING A SINGLE LIFT MECHANISM FOR PROCESSING AND TRANSFER OF SUBSTRATES
    • 使用单个提升机械的方法和装置,用于处理和转移基板
    • WO2012134663A2
    • 2012-10-04
    • PCT/US2012/025960
    • 2012-02-21
    • APPLIED MATERIALS, INCOLGADO, Donald J.K.NGUYEN, Tuan Anh
    • OLGADO, Donald J.K.NGUYEN, Tuan Anh
    • H01L21/67115C23C16/4584C23C16/54H01L21/68742
    • Embodiments of the present invention relate to apparatus and methods for loading substrates into processing chambers, processing the substrates in the processing chamber, and transferring the substrates out of the processing chamber using a single lift mechanism. One embodiment of the present invention provides an apparatus processing multiple substrates. The apparatus includes a chamber body having an internal sidewall, a liner assembly disposed on the internal sidewall defining a processing volume, and a plurality of chamber support features coupled to an interior surface of the liner assembly and extending into the processing volume. The apparatus also includes an edge ring disposed in the processing volume, the edge ring comprising an annular body, a shoulder portion defining an inside diameter of the annular body, and a plurality of tabs disposed on the shoulder portion in a circular pattern having a diameter that is less than the inside diameter of the annular body.
    • 本发明的实施例涉及将基板装载到处理室中的装置和方法,处理处理室中的基板,以及使用单个升降机构将基板转移到处理室外。 本发明的一个实施例提供了一种处理多个基板的装置。 该装置包括具有内部侧壁的室主体,设置在限定处理容积的内侧壁上的衬套组件,以及耦合到衬套组件的内表面并延伸到处理体积中的多个室支撑特征。 该设备还包括设置在处理容积中的边缘环,边缘环包括环形体,限定环形体的内径的肩部和以圆形图案设置在肩部上的多个突片,其具有直径 小于环形体的内径。
    • 3. 发明申请
    • SUBSTRATE SUPPORT ASSEMBLY FOR THIN FILM DEPOSITION SYSTEMS
    • 用于薄膜沉积系统的基底支撑组件
    • WO2012125771A2
    • 2012-09-20
    • PCT/US2012/029134
    • 2012-03-14
    • APPLIED MATERIALS, INC.NGUYEN, Tuan AnhOLGADO, Donald J.K.QUACH, David H.
    • NGUYEN, Tuan AnhOLGADO, Donald J.K.QUACH, David H.
    • H01L21/683H01L21/205C23C16/458
    • C30B25/12C23C16/4583
    • Substrate support assemblies and deposition chambers employing such support assemblies to improve temperature uniformity during film depositions, such as epitaxial growths of group-V material stacks for LEDs. In one embodiment, the support assembly includes a first component having a first thermal resistance and a top surface upon which the substrate is to be disposed at a first location. The support assembly further includes a second component to be disposed over the first component to cover a second location of the susceptor while the substrate is disposed over the first location and having a second thermal resistance to insulate regions of the susceptor adjacent to the substrate by an amount approximating that of the substrate during a deposition process. In embodiments, the second component is removable from the first component and supports the substrate in absence of the first component during transfer of the substrate between multiple deposition systems.
    • 采用这种支撑组件的衬底支撑组件和沉积室在薄膜沉积期间改善温度均匀性,例如用于LED的V族材料堆叠的外延生长。 在一个实施例中,支撑组件包括具有第一热阻的第一部件和衬底将布置在第一位置处的顶表面。 所述支撑组件还包括第二部件,所述第二部件设置在所述第一部件上方以覆盖所述基座的第二位置,同时所述基板设置在所述第一位置上方并且具有第二热阻以使所述基座的邻近所述基板的区域通过 量在沉积过程中接近基板的量。 在实施例中,第二部件可从第一部件移除并且在多个沉积系统之间的衬底转移期间在没有第一部件的情况下支撑衬底。