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    • 4. 发明申请
    • PHOSPHAZENE COMPOUND, PHOTOSENSITIVE RESIN COMPOSITION AND USE THEREOF
    • 磷酸酯化合物,感光树脂组合物及其用途
    • WO2005019231A8
    • 2005-10-20
    • PCT/JP2004007719
    • 2004-06-03
    • KANEKA CORPOKADA KOJIYAMANAKA TOSHIO
    • OKADA KOJIYAMANAKA TOSHIO
    • C07F9/06C07F9/6581C08G79/02G03F7/027G03F7/032G03F7/037G03F7/038C07F9/24C08K5/5399C08L79/08G03F7/004
    • C08G79/025C07F9/067C07F9/65812G03F7/027G03F7/032G03F7/037G03F7/0388
    • A phosphazene compound and photosensitive resin composition suitable for production of wiring boards, having such characteristics that no halogenated flame retardants are used; a water base development can be made; desirable pattern morphology can be realized; a balance can be struck between properties such as thermal stability, resistance to hydrolysis, processability and adherence on the one hand and photosensitivity, flame resistance and mechanical strength on the other hand; and they can meet the demand for miniaturization and weight reduction of electronic parts. There is provided a phosphazene compound that has in its molecule an unsaturated double bond resulting from reaction of phenoxyphosphazene compound having a phenolic hydroxyl and/or crosslinked phenoxyphosphazene compound obtained by crosslinking of the phenoxyphosphazene compound with epoxy compound having an unsaturated double bond and/or isocyanate compound. Furthermore, there is provided a photosensitive resin composition comprising the phenoxyphosphazene compound and at least carboxylated and/or hydroxylated soluble polyimide resin, and further comprising (meth)acrylic compound.
    • 适用于生产线路板的磷腈化合物和感光性树脂组合物,具有不使用卤化阻燃剂的特性; 可以进行水基开发; 可以实现理想的图案形态; 另一方面,热稳定性,耐水解性,加工性和粘附性等特性与光敏性,阻燃性和机械强度之间存在平衡。 它们可以满足电子零件的小型化和减重的需求。 提供了一种磷腈化合物,其在其分子中具有由具有酚氧基和/或交联的苯氧基磷腈化合物的苯氧基磷腈化合物与苯氧基磷腈化合物与具有不饱和双键的环氧化合物和/或异氰酸酯交联而得到的不饱和双键 复合。 此外,提供了包含苯氧基磷腈化合物和至少羧化和/或羟基化的可溶性聚酰亚胺树脂的光敏树脂组合物,并且还包含(甲基)丙烯酸化合物。