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1. 发明申请

WO2011084896A3 METHOD AND APPARATUS FOR PROCESSING SUBSTRATE EDGES 审中-公开
公开(公告)号：WO2011084896A3
公开(公告)日：2011-07-14
申请号：PCT/US2011/000036
申请日：2011-01-10
申请人： UVTECH SYSTEMS, INC. , HARTE, Kenneth J. , MILLMAN, Jr., Ronald P. , CHAPLICK, Victoria M. , ELLIOTT, David J. , DEGENKOLB, Eugene O. , TARDIF, Murray Leo
发明人： HARTE, Kenneth J. , MILLMAN, Jr., Ronald P. , CHAPLICK, Victoria M. , ELLIOTT, David J. , DEGENKOLB, Eugene O. , TARDIF, Murray Leo
IPC分类号： B08B6/00
摘要： A method and apparatus for processing substrate edges is disclosed that overcomes the limitations of conventional edge processing methods and systems used in semiconductor manufacturing. The edge processing method and apparatus of this invention includes a laser and optical system to direct a beam of radiation onto a rotating substrate supported by a chuck, in atmosphere. The optical system accurately and precisely directs the beam to remove or transform organic or inorganic films, film stacks, residues, or particles from the top edge, top bevel, apex, bottom bevel, and bottom edge of the substrate. An optional gas injector system directs gas onto the substrate edge to aid in the reaction. Process by-products are removed via an exhaust tube enveloping the reaction site. This invention permits precise control of an edge exclusion zone, resulting in an increase in the number of usable die on a wafer. Wafer edge processing with this invention replaces existing solvent and/or abrasive methods and thus will improve die yield.

2. 发明申请

WO2012075249A1 FIBER-OPTIC BEAM DELIVERY SYSTEM FOR WAFER EDGE PROCESSING 审中-公开
标题翻译：用于波浪边缘处理的光纤光束传送系统
公开(公告)号：WO2012075249A1
公开(公告)日：2012-06-07
申请号：PCT/US2011/062832
申请日：2011-12-01
申请人： UVTECH SYSTEMS, INC. , MILLMAN, Ronald, P. , HARTE, Kenneth, J. , CHAPLICK, Victoria, M. , ELLIOTT, David, J.
发明人： MILLMAN, Ronald, P. , HARTE, Kenneth, J. , CHAPLICK, Victoria, M. , ELLIOTT, David, J.
IPC分类号： B23K26/00
CPC分类号： B23K37/0426 , B23K26/0619 , B23K26/0622 , B23K26/0676 , B23K26/0823 , B23K26/103 , B23K26/142 , B23K26/16 , B23K26/361 , B23K26/40 , B23K37/047 , B23K2201/40 , B23K2203/50
摘要： A method and apparatus for processing substrate edges is disclosed that overcomes the limitations of conventional edge processing methods and systems used in semiconductor manufacturing. The edge processing method and apparatus of this invention includes a laser and fiber-optic system to direct laser radiation onto a rotating substrate supported by a chuck. A laser beam is transmitted into a bundle of optical fibers, and the fibers accurately and precisely direct the beam to remove or transform organic or inorganic films, film stacks, residues, or particles, in atmosphere, from the top edge, top bevel, apex, bottom bevel, and bottom edge of the substrate in a single process step. Reaction by-products are removed by means of an exhaust tube enveloping the reaction site. This invention permits precise control of an edge exclusion width, resulting in an increase in the number of usable die on a wafer. Wafer edge processing with this invention replaces existing methods that use large volumes of purified water and hazardous chemicals including solvents, acids, alkalis, and proprietary strippers.
摘要翻译：公开了一种用于处理衬底边缘的方法和装置，其克服了半导体制造中使用的常规边缘处理方法和系统的限制。本发明的边缘处理方法和装置包括激光和光纤系统，用于将激光辐射引导到由卡盘支撑的旋转基底上。激光束被传送到一束光纤中，并且光纤精确地和精确地引导光束从大气中去除或转换有机或无机膜，膜堆，残余物或颗粒，从顶部边缘，顶部斜面，顶点，底部斜面和底部边缘，在单个工艺步骤中。通过包围反应部位的排气管除去反应副产物。本发明允许对边缘排除宽度的精确控制，导致晶片上可用的管芯数量的增加。本发明的晶圆边缘处理取代了现有的使用大量净化水和危险化学品（包括溶剂，酸，碱和专有剥离剂）的方法。

3. 发明申请

WO2007019287A2 PHOTOREACTIVE REMOVAL OF ION IMPLANTED RESIST 审中-公开
标题翻译：离子印刷电阻的光电去除
公开(公告)号：WO2007019287A2
公开(公告)日：2007-02-15
申请号：PCT/US2006/030395
申请日：2006-08-04
申请人： UVTECH SYSTEMS, INC. , ELLIOTT, David, J. , MILLMAN, Ronald, P., Jr. , CHAPLICK, Victoria, M. , TARDIF, Murray , AIELLO, Krista , HARTE, Kenneth, J.
发明人： ELLIOTT, David, J. , MILLMAN, Ronald, P., Jr. , CHAPLICK, Victoria, M. , TARDIF, Murray , AIELLO, Krista , HARTE, Kenneth, J.
CPC分类号： G03F7/427
摘要： A method for removing ion implanted photoresist from a surface of a substrate is provided. The method may include introducing a gas to a reaction chamber containing the substrate; illuminating the ion implanted photoresist with radiation from a laser in the presence of the gas; and scanning the radiation across the surface in the presence of the gas to photoreactively remove the ion implanted photoresist from the surface.
摘要翻译：提供了从基板的表面去除离子注入光致抗蚀剂的方法。该方法可以包括将气体引入到包含基板的反应室中; 在存在气体的情况下用来自激光器的辐射照射离子注入的光致抗蚀剂; 并在存在气体的情况下扫描表面上的辐射，以从表面反射去除离子注入的光致抗蚀剂。

4. 发明申请

WO2008097462A1 PLENUM REACTOR SYSTEM 审中-公开
标题翻译：全能反应器系统
公开(公告)号：WO2008097462A1
公开(公告)日：2008-08-14
申请号：PCT/US2008/001329
申请日：2008-01-31
申请人： UVTECH SYSTEMS, INC.
发明人： MILLMAN, Ronald, P. , ELLIOTT, David, J. , TARDIF, Murray
IPC分类号： B23K26/00
CPC分类号： B23K26/12 , B08B7/0042 , B23K26/123 , B23K26/127 , B23K26/142
摘要： Techniques for generating reactions on surfaces that can operate at room temperature and pressure with visible laser light as a radiation source and environmentally sound gases for processing. The apparatus is highly compact, simple, reliable and low cost to operate and maintain, and can dry clean and condition surfaces without causing damage or leaving a residue. Gas is injected at one end of a plenum, directed through the plenum in the presence of the laser radiation, and exhausted at the other end. The plenum creates a highly confined space for directional laminar movement of gas, laser light and by-products, permitting a high degree of uniformity and reaction efficiency. Minimal internal surface area and volume of the reactor prevents by-products from forming, eliminating costly cleaning and downtime.
摘要翻译：用于在室温和压力下可操作的表面上产生反应的技术，其中可见激光作为辐射源和用于处理的无害环境气体。该设备具有高度紧凑，简单，可靠和低成本的操作和维护，并可干燥清洁和调节表面，而不会造成损坏或留下残留物。气体在气室的一端被注入，在激光辐射的存在下被引导通过气室，并在另一端被排出。增压室为气体，激光和副产物的定向层流运动创造了一个高度密闭的空间，允许高度的均匀性和反应效率。反应器最小内表面积和体积可防止副产物形成，消除昂贵的清洁和停机时间。

5. 发明申请

WO2007101112A1 METHOD AND APPARATUS FOR DELIVERY OF PULSED LASER RADIATION 审中-公开
标题翻译：用于传送脉冲激光辐射的方法和装置
公开(公告)号：WO2007101112A1
公开(公告)日：2007-09-07
申请号：PCT/US2007/062732
申请日：2007-02-23
申请人： UVTECH SYSTEMS, INC. , CHAPLICK, Victoria M. , HARTE, Kenneth J. , MILLMAN, JR., Ronald P. , ELLIOTT, David J.
发明人： CHAPLICK, Victoria M. , HARTE, Kenneth J. , MILLMAN, JR., Ronald P. , ELLIOTT, David J.
IPC分类号： B08B7/00 , B23K26/08
CPC分类号： B08B7/0042 , B23K26/0622 , B23K26/064 , B23K26/0643 , B23K26/0648 , B23K26/0665 , B23K26/082 , B23K26/12 , B23K26/123 , B23K26/127 , H01L21/268
摘要： A method and apparatus delivers pulsed laser energy to a damage-sensitive surface. The pulse scanning method and apparatus allow for the deposition of a total dose of laser radiation that could not be attained by any conventional means without damaging the substrate being exposed. Using a solid- state diode pumped YAG laser (110) and an enclosure (150) with a gas ambient, laser pulses are scanned across a substrate (170) according to one of several programmed approaches. Pulses are deposited that are non-adjacent in time, or non-adjacent in space, or both; conventional methods have the pulses adjacent in both time and space. Using the various approaches of the invention, the degree of spatial and temporal adjacency can be precisely controlled to permit significant laser radiation doses without causing any substrate damage. The present invention novel method and apparatus can be carried out by integrating a computer (120), laser (110) and scan head (300) with a small chamber (150) into which gas can flow to permit a variety of surface reactions on damage-sensitive substrates.
摘要翻译：一种方法和装置将脉冲激光能量传递给损伤敏感表面。脉冲扫描方法和装置允许沉积总的剂量的激光辐射，这是通过任何常规方法无法获得的，而不损害被暴露的基底。使用具有气体环境的固态二极管泵浦YAG激光器（110）和外壳（150），根据几种编程方法之一，激光脉冲跨越衬底（170）扫描。脉冲在时间上不相邻或在空间不相邻或两者沉积; 常规方法在时间和空间都具有相邻的脉冲。使用本发明的各种方法，可以精确地控制空间和时间邻接的程度以允许显着的激光辐射剂量而不引起任何基底损伤。本发明的新颖方法和装置可以通过将计算机（120），激光（110）和扫描头（300）与小室（150）集成，气体可以流动的方式和装置进行，以允许各种表面反应损坏敏感基材。

6. 发明申请

WO1996006694A1 SURFACE MODIFICATION PROCESSING OF FLAT PANEL DEVICE SUBSTRATES 审中-公开
标题翻译：平板设备基板的表面改性处理
公开(公告)号：WO1996006694A1
公开(公告)日：1996-03-07
申请号：PCT/US1995011002
申请日：1995-08-29
申请人： UVTECH SYSTEMS, INC.
发明人： UVTECH SYSTEMS, INC. , ELLIOTT, David, J. , HOLLMAN, Richard, F. , YANS, Francis, M. , SINGER, Daniel, K.
IPC分类号： B08B03/08
CPC分类号： H01L21/02046 , B08B7/0042 , B08B7/0057 , B23K26/066 , B23K26/0732 , B23K26/0738 , B23K26/12 , B23K26/123 , B23K26/126 , B23K26/14 , B23K26/142 , B23K26/1462 , G02F1/1333 , G03F7/42 , H01L21/02049 , H01L21/4864 , H05K3/26 , H05K3/288 , H05K2203/087 , H05K2203/107 , H05K2203/1105
摘要： A method for performing surface processing of flat panel display substrates at various points during manufacturing. Such processing is required, for example, to remove photoresist after a photolithography step. Cleaning of glass substrates at the beginning of the manufacturing sequence is also required. Some layers of the device, for example color filters and polyimide alignment layers, may be patterned by this method by the use of a mask (54) in the surface processing. A high intensity pulsed beam of radiation (18) is swept across the surface to be processed (21), while a reactive gas (24) is flowed across the surface where the beam strikes it. In a cleaning or material removal process, the beam of radiation (18) causes the material to react with the gas, resulting in gaseous products (26) which are drawn away from the surface. In a curing process, for polyimide or spin-on dielectric, for example, the beam of radiation (60) causes the polymer to cross-link, while the flowing gas (64) assists in the reaction and removal of species which are released in the cross linking process. Processing of a substrate (74) can be accomplished by translating the substrate (74) under a beam (60) which is larger than the width of the substrate. Processing may be accomplished by multiple scans of the surface or by scanning with multiple beams.
摘要翻译：一种用于在制造过程中在各个点执行平板显示器基板的表面处理的方法。需要这样的处理，例如，在光刻步骤之后去除光致抗蚀剂。还需要在制造顺序开始时清洁玻璃基板。可以通过在表面处理中使用掩模（54）的这种方法来对器件的一些层，例如滤色器和聚酰亚胺取向层进行构图。高强度脉冲的辐射束（18）扫过待处理表面（21），而反应气体（24）流过横梁撞击的表面。在清洁或材料去除过程中，辐射束（18）使材料与气体反应，导致气体产物（26）从表面拉出。在固化过程中，例如，对于聚酰亚胺或旋涂电介质，辐射束（60）使聚合物交联，而流动的气体（64）有助于反应和去除被释放的物质交联过程。可以通过将衬底（74）在大于衬底的宽度的光束（60）下方平移来实现衬底（74）的处理。处理可以通过表面的多次扫描或通过用多个波束扫描来完成。

7. 发明申请

WO1996006693A1 PHOTO REACTIVE CLEANING OF CRITICAL SURFACES IN CD MANUFACTURING 审中-公开
标题翻译： CD制造中关键表面的光敏反应清洗
公开(公告)号：WO1996006693A1
公开(公告)日：1996-03-07
申请号：PCT/US1995010929
申请日：1995-08-29
申请人： UVTECH SYSTEMS, INC.
发明人： UVTECH SYSTEMS, INC. , ELLIOTT, David, J. , HOLLMAN, Richard, F. , YANS, Francis, M. , SINGER, Daniel, K.
IPC分类号： B08B03/08
CPC分类号： H01L21/02046 , B08B7/0042 , B08B7/0057 , B23K26/066 , B23K26/0732 , B23K26/0738 , B23K26/12 , B23K26/123 , B23K26/126 , B23K26/127 , B23K26/128 , B23K26/14 , B23K26/142 , B23K26/147 , G02F1/1333 , G03F7/42 , G11B7/26 , H01L21/02049 , H01L21/4864 , H05K3/26 , H05K3/288 , H05K2203/087 , H05K2203/107 , H05K2203/1105
摘要： A process for cleaning critical surfaces used in manufacturing of compact disks. Such cleaning is required, for example, to remove photoresist from a master disk after plating. Cleaning of compact disk stampers is also required periodically to remove polycarbonate residue from injection molding, and contamination from handling. A high intensity pulsed beam of radiation (34) is swept across the surface (30) to be cleaned, while a reactive gas (36) is flowed across the surface (30) where the beam (34) strikes it. The beam of radiation (34) causes the unwanted material to react with the gas, resulting in gaseous products (40) which are drawn away from the surface. Cleaning of a compact disk stamper can be accomplished by rotating the stamper under a beam which extends from its inner diameter to its outer diameter. Cleaning may be accomplished by multiple scans of the surface, or by scanning with multiple beams. This cleaning process is an improvement on conventional wet chemical methods, in part because it can remove contaminants that conventional techniques cannot.
摘要翻译：用于清洁用于制造光盘的关键表面的过程。需要这种清洁，例如，在镀覆之后从母盘去除光致抗蚀剂。定期清洁光盘刻印机，以便从注塑成型中除去聚碳酸酯残留物，并处理污染物。高强度脉冲的辐射束（34）扫过表面（30）以进行清洁，而反应气体（36）流过横梁（34）撞击它的表面（30）。辐射束（34）导致不需要的物质与气体反应，产生从表面拉出的气态产物（40）。可以通过将压模从其内径延伸到其外径的梁下旋转来实现光盘压模的清洁。清洁可以通过表面的多次扫描或通过用多个光束扫描来实现。这种清洁方法是对常规湿化学方法的改进，部分是因为它可以去除常规技术不能的污染物。

8. 发明申请

WO2006031270A1 SYSTEM AND METHODS FOR SURFACE CLEANING 审中-公开
标题翻译：用于表面清洁的系统和方法
公开(公告)号：WO2006031270A1
公开(公告)日：2006-03-23
申请号：PCT/US2005/021228
申请日：2005-06-16
申请人： UVTECH SYSTEMS, INC. , ELLIOTT, David J. , MILLMAN, JR., Ronald, P. , TARDIF, Murray , AIELLO, Krista
发明人： ELLIOTT, David J. , MILLMAN, JR., Ronald, P. , TARDIF, Murray , AIELLO, Krista
IPC分类号： H01L21/311 , G03F7/42 , B23K26/12 , B08B7/00
CPC分类号： B08B7/0042 , G03F7/427 , H01L21/31138 , H01L21/67005
摘要： A system for removing photoresist from semiconductor wafers is disclosed. The system utilizes a solid-state laser having wavelengths in the near-visible and visible portions of the electromagnetic spectrum to remove photoresist without requiring hazardous gases or wet solutions. In addition, the system does not damage the substrate being cleaned, nor leave a carbon residue requiring further processing to remove. The system uses photon energy, oxygen, water vapor and ozone to interact with contaminants on a surface, forming a gas reaction zone (GRZ). The GRZ reacts and completely removes the photoresist or other unwanted contamination.
摘要翻译：公开了一种用于从半导体晶片去除光致抗蚀剂的系统。该系统利用在电磁光谱的近可见和可见部分中具有波长的固态激光去除光致抗蚀剂而不需要有害气体或湿溶液。此外，该系统不会损坏被清洁的基板，也不会留下需要进一步处理以除去的碳残留物。该系统使用光子能量，氧气，水蒸汽和臭氧与表面上的污染物相互作用，形成气体反应区（GRZ）。 GRZ反应并完全去除光致抗蚀剂或其他不需要的污染物。

9. 发明申请

WO1996006692A1 CLEAINING OF PRINTED CIRCUIT BOARDS 审中-公开
标题翻译：打印电路板的清除
公开(公告)号：WO1996006692A1
公开(公告)日：1996-03-07
申请号：PCT/US1995010928
申请日：1995-08-29
申请人： UVTECH SYSTEMS, INC.
发明人： UVTECH SYSTEMS, INC. , ELLIOTT, David, J. , HOLLMAN, Richard, F. , YANS, Francis, M. , SINGER, Daniel, K. , WHITTEN, George, D.
IPC分类号： B08B03/08
CPC分类号： B23K26/147 , B08B7/0042 , B08B7/0057 , B23K26/0661 , B23K26/0732 , B23K26/0738 , B23K26/12 , B23K26/1224 , B23K26/123 , B23K26/126 , B23K26/127 , B23K26/14 , B23K26/142 , G02F1/1333 , G03F7/42 , G11B7/26 , H01L21/4864 , H05K3/0055 , H05K3/26 , H05K3/288 , H05K2203/087 , H05K2203/107 , H05K2203/1105
摘要： Printed circuit boards (2) are cleaned in the course of fabrication by providing a flowing gas (10), including a reactant, and delivering pulsed radiation (6) to the surface of the printed circuit board in the presence of the flowing gas (10), such that the absorbed contamination is reacted and removed.
摘要翻译：印刷电路板（2）在制造过程中通过提供包括反应物的流动气体（10）和在流动气体（10）的存在下将脉冲辐射（6）输送到印刷电路板的表面而被清洁），使得吸收的污染物被反应和除去。

10. 发明申请

WO1995007152A1 SURFACE PROCESSING 审中-公开
标题翻译：表面加工
公开(公告)号：WO1995007152A1
公开(公告)日：1995-03-16
申请号：PCT/US1994009996
申请日：1994-09-02
申请人： UVTECH SYSTEMS, INC. , ELLIOTT, David, J. , HOLLMAN, Richard, F. , YANS, Francis, M. , SINGER, Daniel, K.
发明人： UVTECH SYSTEMS, INC.
IPC分类号： B08B03/00
CPC分类号： G11B23/505 , B08B7/0042 , B08B7/0057 , B23K26/06 , B23K26/0643 , B23K26/0648 , B23K26/066 , B23K26/0732 , B23K26/0738 , B23K26/12 , B23K26/123 , B23K26/125 , B23K26/126 , B23K26/127 , B23K26/14 , B23K26/1436 , B23K26/1438 , B23K26/1476 , C23G5/00 , G02F1/1333 , G02F2001/133357 , G03F7/2043 , G03F7/42 , G11B5/3163 , G11B5/41 , G11B7/26 , G11B23/0057 , H01L21/02046 , H01L21/02049 , H01L21/02052 , H01L21/31116 , H01L21/31138 , H01L21/4864 , H01L21/67028 , H05K3/26 , H05K3/288 , H05K2203/087 , H05K2203/107 , H05K2203/1105
摘要： Foreign material (10) on a surface of a substrate (12) is processed to form a reaction product (16), by the combination of providing a directed flow of a fluid (18), including a reactant, in the vicinity of the foreign material (10), and delivering a beam of radiation (14) to aid the reactant to react with the foreign material (10) to form the reaction product (16).
摘要翻译：处理基材（12）表面上的异物（10）以形成反应产物（16），通过在外部附近提供包含反应物的流体（18）的定向流动材料（10），并且传送辐射束（14）以帮助反应物与异物（10）反应以形成反应产物（16）。

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