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    • 10. 发明申请
    • SURFACE MODIFICATION PROCESSING OF FLAT PANEL DEVICE SUBSTRATES
    • 平板设备基板的表面改性处理
    • WO1996006694A1
    • 1996-03-07
    • PCT/US1995011002
    • 1995-08-29
    • UVTECH SYSTEMS, INC.
    • UVTECH SYSTEMS, INC.ELLIOTT, David, J.HOLLMAN, Richard, F.YANS, Francis, M.SINGER, Daniel, K.
    • B08B03/08
    • H01L21/02046B08B7/0042B08B7/0057B23K26/066B23K26/0732B23K26/0738B23K26/12B23K26/123B23K26/126B23K26/14B23K26/142B23K26/1462G02F1/1333G03F7/42H01L21/02049H01L21/4864H05K3/26H05K3/288H05K2203/087H05K2203/107H05K2203/1105
    • A method for performing surface processing of flat panel display substrates at various points during manufacturing. Such processing is required, for example, to remove photoresist after a photolithography step. Cleaning of glass substrates at the beginning of the manufacturing sequence is also required. Some layers of the device, for example color filters and polyimide alignment layers, may be patterned by this method by the use of a mask (54) in the surface processing. A high intensity pulsed beam of radiation (18) is swept across the surface to be processed (21), while a reactive gas (24) is flowed across the surface where the beam strikes it. In a cleaning or material removal process, the beam of radiation (18) causes the material to react with the gas, resulting in gaseous products (26) which are drawn away from the surface. In a curing process, for polyimide or spin-on dielectric, for example, the beam of radiation (60) causes the polymer to cross-link, while the flowing gas (64) assists in the reaction and removal of species which are released in the cross linking process. Processing of a substrate (74) can be accomplished by translating the substrate (74) under a beam (60) which is larger than the width of the substrate. Processing may be accomplished by multiple scans of the surface or by scanning with multiple beams.
    • 一种用于在制造过程中在各个点执行平板显示器基板的表面处理的方法。 需要这样的处理,例如,在光刻步骤之后去除光致抗蚀剂。 还需要在制造顺序开始时清洁玻璃基板。 可以通过在表面处理中使用掩模(54)的这种方法来对器件的一些层,例如滤色器和聚酰亚胺取向层进行构图。 高强度脉冲的辐射束(18)扫过待处理表面(21),而反应气体(24)流过横梁撞击的表面。 在清洁或材料去除过程中,辐射束(18)使材料与气体反应,导致气体产物(26)从表面拉出。 在固化过程中,例如,对于聚酰亚胺或旋涂电介质,辐射束(60)使聚合物交联,而流动的气体(64)有助于反应和去除被释放的物质 交联过程。 可以通过将衬底(74)在大于衬底的宽度的光束(60)下方平移来实现衬底(74)的处理。 处理可以通过表面的多次扫描或通过用多个波束扫描来完成。