专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

WO2011066548A1 LASER DOPING 审中-公开
标题翻译：激光掺杂
公开(公告)号：WO2011066548A1
公开(公告)日：2011-06-03
申请号：PCT/US2010/058355
申请日：2010-11-30
申请人： UVT TECH SYSTEMS, INC. , ELLIOTT, David, J. , HARTE, Kenneth, J. , MILLMAN, Ronald, P., Jr. , CHAPLICK, Victoria, M. , DEGENKOLB, Eugene, O.
发明人： ELLIOTT, David, J. , HARTE, Kenneth, J. , MILLMAN, Ronald, P., Jr. , CHAPLICK, Victoria, M. , DEGENKOLB, Eugene, O.
IPC分类号： E05B67/06 , E05B67/38 , B60R25/00 , E05B67/00
CPC分类号： H01L21/268 , H01L21/2254
摘要： The disclosed apparatus and method provides substrate impurity doping wherein a laser rapidly scans a substrate while simultaneously a uniform laminar flow of reactive gas is injected, the interaction of the laser radiation and the dopant results in a uniform diffusion of the dopant species in all planes (X,Y,Z) of the substrate. Laser energy density, wavelength, and pulse geometry are adjustable, in a simple system for volume manufacturing, to provide depth and dose control of the dopant. The system optics can be focused to form a high resolution laser beam to directly write the doping area pattern geometry. Alternatively the laser beam can be optically expanded to form a large diameter beam for large area diffusion of the dopant through a patterned mask.
摘要翻译：所公开的装置和方法提供衬底杂质掺杂，其中激光快速扫描衬底，同时注入反应气体的均匀层流，激光辐射和掺杂剂的相互作用导致掺杂剂物质在所有平面中的均匀扩散（ X，Y，Z）。在容量制造的简单系统中，激光能量密度，波长和脉冲几何形状是可调整的，以提供掺杂剂的深度和剂量控制。可以将系统光学器件聚焦以形成高分辨率激光束，以直接写入掺杂区域图案几何形状。或者，激光束可以被光学扩展以形成大直径光束，用于通过图案化掩模的掺杂剂的大面积扩散。

2. 发明申请

WO2007101112A1 METHOD AND APPARATUS FOR DELIVERY OF PULSED LASER RADIATION 审中-公开
标题翻译：用于传送脉冲激光辐射的方法和装置
公开(公告)号：WO2007101112A1
公开(公告)日：2007-09-07
申请号：PCT/US2007/062732
申请日：2007-02-23
申请人： UVTECH SYSTEMS, INC. , CHAPLICK, Victoria M. , HARTE, Kenneth J. , MILLMAN, JR., Ronald P. , ELLIOTT, David J.
发明人： CHAPLICK, Victoria M. , HARTE, Kenneth J. , MILLMAN, JR., Ronald P. , ELLIOTT, David J.
IPC分类号： B08B7/00 , B23K26/08
CPC分类号： B08B7/0042 , B23K26/0622 , B23K26/064 , B23K26/0643 , B23K26/0648 , B23K26/0665 , B23K26/082 , B23K26/12 , B23K26/123 , B23K26/127 , H01L21/268
摘要： A method and apparatus delivers pulsed laser energy to a damage-sensitive surface. The pulse scanning method and apparatus allow for the deposition of a total dose of laser radiation that could not be attained by any conventional means without damaging the substrate being exposed. Using a solid- state diode pumped YAG laser (110) and an enclosure (150) with a gas ambient, laser pulses are scanned across a substrate (170) according to one of several programmed approaches. Pulses are deposited that are non-adjacent in time, or non-adjacent in space, or both; conventional methods have the pulses adjacent in both time and space. Using the various approaches of the invention, the degree of spatial and temporal adjacency can be precisely controlled to permit significant laser radiation doses without causing any substrate damage. The present invention novel method and apparatus can be carried out by integrating a computer (120), laser (110) and scan head (300) with a small chamber (150) into which gas can flow to permit a variety of surface reactions on damage-sensitive substrates.
摘要翻译：一种方法和装置将脉冲激光能量传递给损伤敏感表面。脉冲扫描方法和装置允许沉积总的剂量的激光辐射，这是通过任何常规方法无法获得的，而不损害被暴露的基底。使用具有气体环境的固态二极管泵浦YAG激光器（110）和外壳（150），根据几种编程方法之一，激光脉冲跨越衬底（170）扫描。脉冲在时间上不相邻或在空间不相邻或两者沉积; 常规方法在时间和空间都具有相邻的脉冲。使用本发明的各种方法，可以精确地控制空间和时间邻接的程度以允许显着的激光辐射剂量而不引起任何基底损伤。本发明的新颖方法和装置可以通过将计算机（120），激光（110）和扫描头（300）与小室（150）集成，气体可以流动的方式和装置进行，以允许各种表面反应损坏敏感基材。

3. 发明申请

WO2011084896A3 METHOD AND APPARATUS FOR PROCESSING SUBSTRATE EDGES 审中-公开
公开(公告)号：WO2011084896A3
公开(公告)日：2011-07-14
申请号：PCT/US2011/000036
申请日：2011-01-10
申请人： UVTECH SYSTEMS, INC. , HARTE, Kenneth J. , MILLMAN, Jr., Ronald P. , CHAPLICK, Victoria M. , ELLIOTT, David J. , DEGENKOLB, Eugene O. , TARDIF, Murray Leo
发明人： HARTE, Kenneth J. , MILLMAN, Jr., Ronald P. , CHAPLICK, Victoria M. , ELLIOTT, David J. , DEGENKOLB, Eugene O. , TARDIF, Murray Leo
IPC分类号： B08B6/00
摘要： A method and apparatus for processing substrate edges is disclosed that overcomes the limitations of conventional edge processing methods and systems used in semiconductor manufacturing. The edge processing method and apparatus of this invention includes a laser and optical system to direct a beam of radiation onto a rotating substrate supported by a chuck, in atmosphere. The optical system accurately and precisely directs the beam to remove or transform organic or inorganic films, film stacks, residues, or particles from the top edge, top bevel, apex, bottom bevel, and bottom edge of the substrate. An optional gas injector system directs gas onto the substrate edge to aid in the reaction. Process by-products are removed via an exhaust tube enveloping the reaction site. This invention permits precise control of an edge exclusion zone, resulting in an increase in the number of usable die on a wafer. Wafer edge processing with this invention replaces existing solvent and/or abrasive methods and thus will improve die yield.

4. 发明申请

WO2008080099A3 LASER OPTICAL SYSTEM 审中-公开
标题翻译：激光光学系统
公开(公告)号：WO2008080099A3
公开(公告)日：2008-09-18
申请号：PCT/US2007088648
申请日：2007-12-21
申请人： UV TECH SYSTEMS INC , ELLIOTT DAVID J , HARTE KENNETH J , MILLMAN RONALD P , CHAPLICK VICTORIA M
发明人： ELLIOTT DAVID J , HARTE KENNETH J , MILLMAN RONALD P , CHAPLICK VICTORIA M
IPC分类号： B23K26/08
CPC分类号： G02B19/0014 , B23K26/082 , B23K2201/40 , B29C64/135 , G02B19/0052 , G02B19/0095 , G02B27/0955 , H01L21/268
摘要： A compact optical system (10') is provided for delivering laser radiation with high optical efficiency and uniformity. The optical system includes, in order of the propagation of light, a refractive beam expander (40) to adjust beam size and energy density, a beam flattening module (60) to increase throughput and beam uniformity, an anamorphic corrector (30) to equalize ray distribution in both axes, an attenuator assembly (21) to adjust beam intensity, galvanometer mirrors (84, 86) to scan the beam across a substrate surface- (100), and a. focusing lens (88) containing a plurality of refractive elements to deliver the beam at the substrate plane. The laser optical system shapes the laser source beam (14) to increase its effective width for greater productivity in manufacturing, and reduces peak intensity to minimize substrate damage. The laser optical system design is optimized for maximum transmission and optical efficiency for low cost operation with a small laser (12). '.
摘要翻译：提供了一种紧凑的光学系统（10'），用于传递具有高光学效率和均匀性的激光辐射。光学系统以光的传播顺序包括用于调节光束尺寸和能量密度的折射光束扩展器（40），用于增加光通量和光束均匀性的光束平坦化模块（60），变形校正器（30）以及用于调整光束强度的衰减器组件（21），检测反射镜（84,86）以跨越衬底表面扫描所述光束（100），以及a。聚焦透镜（88）包含多个折射元件以将光束传送到基板平面。激光光学系统形成激光源光束（14）以增加其有效宽度，以提高制造生产率，并降低峰值强度以最小化衬底损伤。激光光学系统设计通过小型激光器（12）进行优化，实现最低的传输和光学效率，实现低成本操作。 ”。

5. 发明申请

WO2011084896A2 METHOD AND APPARATUS FOR PROCESSING SUBSTRATE EDGES 审中-公开
标题翻译：用于处理基板边的方法和装置
公开(公告)号：WO2011084896A2
公开(公告)日：2011-07-14
申请号：PCT/US2011000036
申请日：2011-01-10
申请人： UVTECH SYSTEMS , HARTE KENNETH J , MILLMAN JR RONALD P , CHAPLICK VICTORIA M , ELLIOTT DAVID J , DEGENKOLB EUGENE O , TARDIF MURRAY LEO
发明人： HARTE KENNETH J , MILLMAN JR RONALD P , CHAPLICK VICTORIA M , ELLIOTT DAVID J , DEGENKOLB EUGENE O , TARDIF MURRAY LEO
IPC分类号： C03C15/00 , H01L21/268
CPC分类号： H01L21/268 , B23K26/0648 , B23K26/0665 , B23K26/0676 , B23K26/082 , B23K26/0823 , B23K26/123 , B23K26/142 , G03F7/2028 , H01L21/02087 , H01L21/6708
摘要： A method and apparatus for processing substrate edges is disclosed that overcomes the limitations of conventional edge processing methods and systems used in semiconductor manufacturing. The edge processing method and apparatus of this invention includes a laser and optical system to direct a beam of radiation onto a rotating substrate supported by a chuck, in atmosphere. The optical system accurately and precisely directs the beam to remove or transform organic or inorganic films, film stacks, residues, or particles from the top edge, top bevel, apex, bottom bevel, and bottom edge of the substrate. An optional gas injector system directs gas onto the substrate edge to aid in the reaction. Process by-products are removed via an exhaust tube enveloping the reaction site. This invention permits precise control of an edge exclusion zone, resulting in an increase in the number of usable die on a wafer. Wafer edge processing with this invention replaces existing solvent and/or abrasive methods and thus will improve die yield.
摘要翻译：公开了一种用于处理衬底边缘的方法和装置，其克服了半导体制造中使用的常规边缘处理方法和系统的限制。本发明的边缘处理方法和装置包括激光和光学系统，用于在大气中将辐射束引导到由卡盘支撑的旋转基底上。光学系统精确和精确地引导光束从衬底的顶部边缘，顶部斜面，顶点，底部斜面和底部边缘去除或转换有机或无机膜，膜堆，残余物或颗粒。可选的气体注入器系统将气体引导到衬底边缘以帮助反应。通过包围反应部位的排气管除去加工副产物。本发明允许边缘排除区域的精确控制，导致晶片上可用的管芯数量的增加。用本发明的晶片边缘加工替代了现有的溶剂和/或研磨方法，从而提高了模具产量。

6. 发明申请

WO2007019287A3 PHOTOREACTIVE REMOVAL OF ION IMPLANTED RESIST 审中-公开
标题翻译：离子印刷电阻的光电去除
公开(公告)号：WO2007019287A3
公开(公告)日：2008-01-10
申请号：PCT/US2006030395
申请日：2006-08-04
申请人： UVTECH SYS INC , ELLIOTT DAVID J , MILLMAN RONALD P JR , CHAPLICK VICTORIA M , TARDIF MURRAY , AIELLO KRISTA , HARTE KENNETH J
发明人： ELLIOTT DAVID J , MILLMAN RONALD P JR , CHAPLICK VICTORIA M , TARDIF MURRAY , AIELLO KRISTA , HARTE KENNETH J
IPC分类号： G03F7/42
CPC分类号： G03F7/427
摘要： A method for removing ion implanted photoresist from a surface of a substrate is provided. The method may include introducing a gas to a reaction chamber containing the substrate; illuminating the ion implanted photoresist with radiation from a laser in the presence of the gas; and scanning the radiation across the surface in the presence of the gas to photoreactively remove the ion implanted photoresist from the surface.
摘要翻译：提供了从基板的表面去除离子注入的光致抗蚀剂的方法。该方法可以包括将气体引入到包含基板的反应室中; 在存在气体的情况下用来自激光器的辐射照射离子注入的光致抗蚀剂; 并在存在气体的情况下扫描表面上的辐射，以从表面反射去除离子注入的光致抗蚀剂。

7. 发明申请

WO2012075249A1 FIBER-OPTIC BEAM DELIVERY SYSTEM FOR WAFER EDGE PROCESSING 审中-公开
标题翻译：用于波浪边缘处理的光纤光束传送系统
公开(公告)号：WO2012075249A1
公开(公告)日：2012-06-07
申请号：PCT/US2011/062832
申请日：2011-12-01
申请人： UVTECH SYSTEMS, INC. , MILLMAN, Ronald, P. , HARTE, Kenneth, J. , CHAPLICK, Victoria, M. , ELLIOTT, David, J.
发明人： MILLMAN, Ronald, P. , HARTE, Kenneth, J. , CHAPLICK, Victoria, M. , ELLIOTT, David, J.
IPC分类号： B23K26/00
CPC分类号： B23K37/0426 , B23K26/0619 , B23K26/0622 , B23K26/0676 , B23K26/0823 , B23K26/103 , B23K26/142 , B23K26/16 , B23K26/361 , B23K26/40 , B23K37/047 , B23K2201/40 , B23K2203/50
摘要： A method and apparatus for processing substrate edges is disclosed that overcomes the limitations of conventional edge processing methods and systems used in semiconductor manufacturing. The edge processing method and apparatus of this invention includes a laser and fiber-optic system to direct laser radiation onto a rotating substrate supported by a chuck. A laser beam is transmitted into a bundle of optical fibers, and the fibers accurately and precisely direct the beam to remove or transform organic or inorganic films, film stacks, residues, or particles, in atmosphere, from the top edge, top bevel, apex, bottom bevel, and bottom edge of the substrate in a single process step. Reaction by-products are removed by means of an exhaust tube enveloping the reaction site. This invention permits precise control of an edge exclusion width, resulting in an increase in the number of usable die on a wafer. Wafer edge processing with this invention replaces existing methods that use large volumes of purified water and hazardous chemicals including solvents, acids, alkalis, and proprietary strippers.
摘要翻译：公开了一种用于处理衬底边缘的方法和装置，其克服了半导体制造中使用的常规边缘处理方法和系统的限制。本发明的边缘处理方法和装置包括激光和光纤系统，用于将激光辐射引导到由卡盘支撑的旋转基底上。激光束被传送到一束光纤中，并且光纤精确地和精确地引导光束从大气中去除或转换有机或无机膜，膜堆，残余物或颗粒，从顶部边缘，顶部斜面，顶点，底部斜面和底部边缘，在单个工艺步骤中。通过包围反应部位的排气管除去反应副产物。本发明允许对边缘排除宽度的精确控制，导致晶片上可用的管芯数量的增加。本发明的晶圆边缘处理取代了现有的使用大量净化水和危险化学品（包括溶剂，酸，碱和专有剥离剂）的方法。

8. 发明申请

WO2008080099A2 LASER OPTICAL SYSTEM 审中-公开
标题翻译：激光光学系统
公开(公告)号：WO2008080099A2
公开(公告)日：2008-07-03
申请号：PCT/US2007/088648
申请日：2007-12-21
申请人： UV TECH SYSTEMS INC. , ELLIOTT, David, J. , HARTE, Kenneth, J. , MILLMAN, Ronald, P. , CHAPLICK, Victoria, M.
发明人： ELLIOTT, David, J. , HARTE, Kenneth, J. , MILLMAN, Ronald, P. , CHAPLICK, Victoria, M.
IPC分类号： B23K26/08
CPC分类号： G02B19/0014 , B23K26/082 , B23K2201/40 , B29C64/135 , G02B19/0052 , G02B19/0095 , G02B27/0955 , H01L21/268
摘要： A compact optical system is provided for delivering laser radiation with high optical efficiency and uniformity. The optical system includes, in order of the propagation of light, a refractive beam expander to adjust beam size and energy density, a beam flattening module to increase throughput and beam uniformity, an anamorphic corrector to equalize ray distribution in both axes, an attenuator assembly to adjust beam intensity, galvanometer mirrors to scan the beam across a substrate surface, and a focusing lens containing a plurality of refractive elements to deliver the beam at the substrate plane. The laser optical system shapes the laser source beam to increase its effective width for greater productivity in manufacturing, and reduces peak intensity to minimize substrate damage. The laser optical system design is optimized for maximum transmission and optical efficiency for low cost operation with a small laser.
摘要翻译：提供了一种紧凑的光学系统，用于传递具有高光学效率和均匀性的激光辐射。光学系统按照光的传播顺序包括折射光束扩展器以调节光束尺寸和能量密度，光束平坦化模块以增加光通量和光束的均匀性;变形校正器，以均衡两轴的光线分布;衰减器组件调整光束强度，电流计反射镜以跨越衬底表面扫描光束;以及聚焦透镜，其包含多个折射元件以将光束传送到衬底平面。激光光学系统对激光源光束进行整形以增加其有效宽度以提高制造生产率，并降低峰值强度以最小化基板损伤。激光光学系统设计采用小型激光器进行优化，以实现最低传输和光学效率，实现低成本操作。

9. 发明申请

WO2007019287A2 PHOTOREACTIVE REMOVAL OF ION IMPLANTED RESIST 审中-公开
标题翻译：离子印刷电阻的光电去除
公开(公告)号：WO2007019287A2
公开(公告)日：2007-02-15
申请号：PCT/US2006/030395
申请日：2006-08-04
申请人： UVTECH SYSTEMS, INC. , ELLIOTT, David, J. , MILLMAN, Ronald, P., Jr. , CHAPLICK, Victoria, M. , TARDIF, Murray , AIELLO, Krista , HARTE, Kenneth, J.
发明人： ELLIOTT, David, J. , MILLMAN, Ronald, P., Jr. , CHAPLICK, Victoria, M. , TARDIF, Murray , AIELLO, Krista , HARTE, Kenneth, J.
CPC分类号： G03F7/427
摘要： A method for removing ion implanted photoresist from a surface of a substrate is provided. The method may include introducing a gas to a reaction chamber containing the substrate; illuminating the ion implanted photoresist with radiation from a laser in the presence of the gas; and scanning the radiation across the surface in the presence of the gas to photoreactively remove the ion implanted photoresist from the surface.
摘要翻译：提供了从基板的表面去除离子注入光致抗蚀剂的方法。该方法可以包括将气体引入到包含基板的反应室中; 在存在气体的情况下用来自激光器的辐射照射离子注入的光致抗蚀剂; 并在存在气体的情况下扫描表面上的辐射，以从表面反射去除离子注入的光致抗蚀剂。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式