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1. 发明申请

WO2017023575A1 SYSTEMS & METHODS FOR METERING A DOSE VOLUME OF FLUID USED TO TREAT MICROELECTRONIC SUBSTRATES 审中-公开
标题翻译：用于测量微电子基板的液体剂量的系统和方法
公开(公告)号：WO2017023575A1
公开(公告)日：2017-02-09
申请号：PCT/US2016/043508
申请日：2016-07-22
申请人： TEL FSI, INC.
发明人： INHOFER, William P. , VAN ELSEN, Lance
IPC分类号： B08B3/04 , H01L23/473 , H01L23/467 , H01L23/498 , H05K1/02
CPC分类号： F04B23/04 , B05B11/3032 , B81C1/00539 , C08J7/00 , F04B19/006 , H01L21/30604
摘要： The disclosure relates to systems and methods for metering a dose volume of fluid that may be used to treat microelectronic substrates. The system enables precision dispensing of relatively small amounts of a liquid chemical into a chemical bath or processing chamber for microelectronic substrates. The dispensing device may include a fluid conduit with a plurality of actuation devices that may limit fluid communication between the actuation devices and store a portion of the fluid in expandable membrane. The actuation devices may push or pull the fluid within the fluid conduit when the expandable membrane expands or contracts. The configuration and operation of the actuation devices may enable the collection, isolation, and dispensing of the dose volume.
摘要翻译：本公开涉及用于计量可用于处理微电子衬底的剂量体积的流体的系统和方法。该系统能够将相对少量的液体化学品精确地分配到用于微电子衬底的化学浴或处理室中。分配装置可以包括具有多个致动装置的流体导管，其可以限制致动装置之间的流体连通并将一部分流体存储在可膨胀膜中。当可膨胀膜膨胀或收缩时，致动装置可推动或拉动流体导管内的流体。致动装置的构造和操作可以使得能够收集，分离和分配剂量体积。

2. 发明申请

WO2016093824A1 DETECTION OF LOST WAFER FROM SPINNING CHUCK 审中-公开
标题翻译：检测从旋转OF OF OF。。。。。。。
公开(公告)号：WO2016093824A1
公开(公告)日：2016-06-16
申请号：PCT/US2014/069557
申请日：2014-12-10
申请人： TEL FSI, INC.
发明人： ROSE, Alan D. , GRUENHAGEN, Michael
IPC分类号： H01L21/67 , H01L21/68 , H01L21/687
CPC分类号： H01L21/68728 , H01L21/67288
摘要： The disclosure relates to systems and methods for detecting when a microelectronic substrate is no longer properly secured or lost from a rotating chuck. A microelectronic substrate may be secured to a rotating chuck that may rotate the substrate when exposing the substrate to the chemicals during a treatment in a process chamber. The rotating chuck may include one or more detectors to detect the position of a gripping mechanism that secure the microelectronic substrate. The detectors may generate an electrical signal that correlates to the position of the microelectronic substrate. When the electrical signal(s) exceed a threshold the system may stop rotating the chuck to prevent additional damage to the process chamber.
摘要翻译：本公开涉及用于检测何时微电子基板不再适当地固定或从旋转卡盘丢失的系统和方法。微电子衬底可以被固定到旋转卡盘，其可以在处理室中的处理期间将衬底暴露于化学物质时旋转衬底。旋转卡盘可以包括一个或多个检测器，以检测固定微电子基板的夹持机构的位置。检测器可以产生与微电子衬底的位置相关的电信号。当电信号超过阈值时，系统可能会停止旋转卡盘，以防止对处理室造成额外的损坏。

3. 发明申请

WO2014116440A1 PROCESS FOR REMOVING CARBON MATERIAL FROM SUBSTRATES 审中-公开
标题翻译：从基材中除去碳材料的方法
公开(公告)号：WO2014116440A1
公开(公告)日：2014-07-31
申请号：PCT/US2014/011052
申请日：2014-01-10
申请人： TEL FSI, INC.
发明人： LAUERHAAS, Jeffrey, M.
IPC分类号： H01L21/302
CPC分类号： H01L21/30604 , H01L21/31111 , H01L21/32134 , H01L21/6708
摘要： A method of removing carbon materials, preferably amorphous carbon, from a substrate includes dispensing a liquid sulfuric acid composition including sulfuric acid and/or its desiccating species and precursors and having a water/sulfuric acid molar ratio of no greater than 5:1 onto an material coated substrate in an amount effective to substantially uniformly coat the carbon material coated substrate. The liquid sulfuric acid composition is exposed to water vapor in an amount effective to increase the temperature of the liquid sulfuric acid composition above the temperature of the liquid sulfuric acid composition prior to exposure to the water vapor. In preferred embodiments, amorphous carbon is selectively removed as compared to a silicon oxide (e.g., silicon dioxide) and/or silicon nitride.
摘要翻译：从基材除去碳材料，优选无定形碳的方法包括将包含硫酸和/或其干燥物质和前体的液硫酸组合物分配到水/硫酸摩尔比不大于5:1的一种材料涂覆的基材，其量有效地基本上均匀地涂覆涂覆碳材料的基材。在暴露于水蒸汽之前，液体硫酸组合物以有效量将液体硫酸组合物的温度高于液体硫酸组合物的温度暴露于水蒸气。在优选的实施方案中，与氧化硅（例如二氧化硅）和/或氮化硅相比，选择性地除去无定形碳。

4. 发明申请

WO2018004678A1 SYSTEMS AND METHODS FOR TREATING SUBSTRATES WITH CRYOGENIC FLUID MIXTURES 审中-公开
标题翻译：用低温流体混合物处理基质的系统和方法
公开(公告)号：WO2018004678A1
公开(公告)日：2018-01-04
申请号：PCT/US2016/040801
申请日：2016-07-01
申请人： TEL FSI, INC.
发明人： MBANASO, Chimaobi W. , BUTTERBAUGH, Jeffery W. , BECKER, David Scott
IPC分类号： H01L21/02 , H01L21/67 , G03F1/82 , G03F7/20
CPC分类号： G03F1/82 , G03F1/72 , G03F7/427 , G03F7/70925 , H01L21/67051
摘要： Disclosed herein are systems and methods for treating the surface of a microelectronic substrate, and in particular, relate to an apparatus and method for scanning the microelectronic substrate through a cryogenic fluid mixture used to treat an exposed surface of the microelectronic substrate. The fluid mixture may be expanded through a nozzle to form an aerosol spray or gas cluster jet (GCJ) spray may impinge the microelectronic substrate and remove particles from the microelectronic substrate's surface. In one embodiment, the fluid mixture may be maintained to prevent liquid formation within the fluid mixture prior to passing the fluid mixture through the nozzle. The fluid mixture may include nitrogen, argon, helium, neon, xenon, krypton, carbon dioxide, or any combination thereof.
摘要翻译：本文公开了用于处理微电子衬底的表面的系统和方法，并且具体涉及用于通过用于处理微电子衬底的暴露表面的低温流体混合物扫描微电子衬底的设备和方法。微电子衬底。流体混合物可以通过喷嘴膨胀以形成气溶胶喷雾或气体团簇射流（GCJ）喷雾可以冲击微电子基板并从微电子基板的表面移除颗粒。在一个实施例中，可以保持流体混合物以在流体混合物通过喷嘴之前防止流体混合物内的液体形成。流体混合物可以包括氮气，氩气，氦气，氖气，氙气，氪气，二氧化碳或其任何组合。

5. 发明申请

WO2015073517A1 IMPROVED CHAMBER CLEANING WHEN USING ACID CHEMISTRIES TO FABRICATE MICROELECTRONIC DEVICES AND PRECURSORS THEREOF 审中-公开
标题翻译：当使用酸性化学物质制造微电子器件及其前驱体时，改进的室清洁
公开(公告)号：WO2015073517A1
公开(公告)日：2015-05-21
申请号：PCT/US2014/065186
申请日：2014-11-12
申请人： TEL FSI, INC.
发明人： BERG, Erik R. , SIEFERING, Kevin L.
IPC分类号： B08B3/08
CPC分类号： C11D11/0047 , B08B9/00 , C11D11/0064 , H01L21/02052
摘要： The present invention provides treatment strategies that reduce contamination on wafer surfaces that are treated with acid chemistries. The strategies are suitable for use with a wide variety of wafers, including those including sensitive microelectronic features or precursors thereof. These strategies involve a combination of neutralizing and rinsing strategies that quickly and effectively remove residual acid and acid by-products from both the front side of workpiece(s) as well as from other processing chamber surfaces that can be causes of contamination.
摘要翻译：本发明提供了减少用酸性化学物质处理的晶片表面污染的处理策略。该策略适用于各种晶片，包括那些包括敏感的微电子特征或其前体的晶片。这些策略涉及中和和冲洗策略的组合，其快速有效地从工件的前侧以及可能是污染原因的其它处理室表面清除残留的酸和副产物。

6. 发明申请

WO2018170264A1 SYSTEM AND METHOD FOR MONITORING TREATMENT OF MICROELECTRONIC SUBSTRATES WITH FLUID SPRAYS SUCH AS CRYOGENIC FLUID SPRAYS 审中-公开
公开(公告)号：WO2018170264A1
公开(公告)日：2018-09-20
申请号：PCT/US2018/022634
申请日：2018-03-15
申请人： TEL FSI, INC.
发明人： SCHWAB, Brent D. , MBANASO, Chimaobi , THOMES, Gregory P. , ROLF, Kevin , LAUERHAAS, Jeffrey M.
IPC分类号： B08B7/00 , B08B3/02 , C03C19/00 , H01J49/04
摘要： A system and method for treating a substrate is described. In particular, the system and method for treating a substrate include techniques for removing particles from the surface of a microelectronic substrate. The system includes: a vacuum process chamber; a substrate stage for supporting a microelectronic substrate within the vacuum process chamber; a cryogenic fluid supply system that can provide a fluid or fluid mixture through one or more nozzles arranged within the vacuum process chamber to inject a fluid spray into the process chamber in a direction towards an upper surface of the microelectronic substrate; and a process monitoring system coupled to the vacuum process chamber, and arranged to collect fluid spray data corresponding to at least one measured attribute of the injected fluid spray downstream of an exit of the one or more nozzles.

7. 发明申请

WO2018106952A1 WAFER EDGE LIFT PIN DESIGN FOR MANUFACTURING A SEMICONDUCTOR DEVICE 审中-公开
公开(公告)号：WO2018106952A1
公开(公告)日：2018-06-14
申请号：PCT/US2017/065166
申请日：2017-12-07
申请人： TEL FSI, INC.
发明人： HANZLIK, Edward D. , MOORE, Sean
IPC分类号： H01L21/687
CPC分类号： H01L21/68742 , H01L21/68728 , H01L21/68735
摘要： A wafer edge lift pin of an apparatus for manufacturing a semiconductor device is described. The wafer edge lift pin includes a top section containing a notch portion having a horizontal upwardly facing surface for supporting a wafer and a vertically sloped surface for lateral confinement of the wafer, wherein the notch portion is horizontally swept away from the wafer along a radius, a base section below the top section, the base section having a diameter that is greater than a diameter of the top section across the notch portion, and a bottom section having a diameter that is smaller than the diameter of the base section. The apparatus includes a process chamber where the wafer is processed, a chuck assembly on which the wafer is loaded, and a plurality of at least three wafer edge lift pins for moving the wafer up and down.

8. 发明申请

WO2018102305A1 TRANSLATING AND ROTATING CHUCK FOR PROCESSING MICROELECTRONIC SUBSTRATES IN A PROCESS CHAMBER 审中-公开
公开(公告)号：WO2018102305A1
公开(公告)日：2018-06-07
申请号：PCT/US2017/063486
申请日：2017-11-28
申请人： TEL FSI, INC.
发明人： HANZLIK, Edward Deneen , GRUENHAGEN, Michael , HERBST, Tim W.
IPC分类号： H01L21/687
CPC分类号： H01L21/67051 , B08B7/0092 , H01L21/02052 , H01L21/6719 , H01L21/68742 , H01L21/68764 , H01L21/68785
摘要： Cleaning systems and methods for semiconductor fabrication use rotatable and translatable chuck assemblies that incorporate a compact drive system to cause chuck rotation. The system uses an offset drive gear that drives a ring gear. This reduces components whose friction or lubricants might generate undue contamination. The low friction chuck functionality of the present invention is useful in any fabrication tool in which a workpiece is supported on a rotating support during a treatment. The chuck is particularly useful in cryogenic cleaning treatments.

9. 发明申请

WO2015038361A1 APPARATUS AND METHOD FOR SCANNING AN OBJECT THROUGH A FLUID STREAM 审中-公开
标题翻译：通过流体流扫描物体的装置和方法
公开(公告)号：WO2015038361A1
公开(公告)日：2015-03-19
申请号：PCT/US2014/053508
申请日：2014-08-29
申请人： TEL FSI, INC.
发明人： GOLUCH, Mark , ZIMMERMAN, David C. , LARSON, Robert E. , HANZLIK, Edward Deneen , THOMES, Gregory Paul , RATHMAN, Christina Ann
IPC分类号： C23C14/50
CPC分类号： H01L21/67051 , B08B3/02 , B08B3/022 , B08B3/024 , B08B3/04 , B08B5/02 , B08B15/023 , H01L21/02057 , H01L21/67023 , H01L21/6708 , H01L21/68742 , H01L21/68764 , H01L21/68792
摘要： An apparatus for treating the surface of a microelectronic workpiece via impingement of the surface with at least one fluid and a method for operating the apparatus are described. In particular, the apparatus includes a treatment chamber defining an interior space to treat the microelectronic workpiece with at least one fluid within the treatment chamber, and a movable chuck that supports the workpiece within the treatment chamber. The apparatus further includes a workpiece translational drive system configured to translate the movable chuck between a workpiece load position and at least one processing position at which the workpiece is treated with the at least one fluid using at least one nozzle connected to at least one fluid supply, and a workpiece rotational drive system configured to rotate the microelectronic workpiece.
摘要翻译：描述了通过至少一种流体冲击表面来处理微电子工件的表面的装置和用于操作该装置的方法。特别地，该设备包括处理室，其限定内部空间以利用处理室内的至少一个流体处理微电子工件;以及可移动卡盘，其在处理室内支撑工件。该装置还包括工件平移驱动系统，该工件平移驱动系统构造成使用至少一个连接至少一个流体供应器的喷嘴将可动夹头在工件装载位置与至少一个处理位置之间平移，以及构造成旋转微电子工件的工件旋转驱动系统。

10. 发明申请

WO2014182418A1 PROCESS COMPRISING WATER VAPOR FOR HAZE ELIMINATION AND RESIDUE REMOVAL 审中-公开
标题翻译：包装水蒸气的过程用于清除和清除废水
公开(公告)号：WO2014182418A1
公开(公告)日：2014-11-13
申请号：PCT/US2014/034483
申请日：2014-04-17
申请人： TEL FSI, INC.
发明人： LAUERHAAS, Jeffrey, M. , KAHAIAN, Don
IPC分类号： B08B3/02
CPC分类号： H01L21/02041 , H01L21/02057 , H01L21/31111 , H01L21/31133
摘要： A method of treating a substrate comprises removing material from a substrate using a treatment protocol to provide a treated substrate followed by a rinsing step. In the rinsing step at least one stream comprising a rinsing fluid is introduced and water vapor is caused to collide with and atomize the rinsing fluid. The atomized rinsing fluid is caused to rinsingly contact the treated substrate.
摘要翻译：处理基材的方法包括使用处理方案从基材中除去材料以提供经处理的基材，随后进行漂洗步骤。在冲洗步骤中，引入至少一个包含冲洗流体的流，并使水蒸气与冲洗流体碰撞并雾化。使雾化的冲洗液与经处理的基底漂洗接触。

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