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1. 发明申请

WO2018189419A3 MULTILAYER STRUCTURE AND RELATED METHOD OF MANUFACTURE OF MULTILAYER STRUCTURE 审中-公开
公开(公告)号：WO2018189419A3
公开(公告)日：2018-10-18
申请号：PCT/FI2018/050251
申请日：2018-04-06
申请人： TACTOTEK OY
发明人： HEIKKINEN, Mikko , KERÄNEN, Antti , SÄÄSKI, Jarmo , HAAG, Ronald
IPC分类号： H05K1/18 , H05K3/28 , H05K1/14 , H05K3/36 , H05K3/00 , H05K1/02 , H01R12/81
摘要： Multilayer structure (100), comprising a substrate film (102) having a first side and opposite second side, said substrate film (102) comprising electrically substantially insulating material, a number of conductive traces (108) on the first side of the substrate film (102) for establishing a desired predetermined circuit design, a connector element (118) provided to, preferably substantially laid upon the first side of, said substrate film (102), one side of the connector element (118) facing the structure internals and the other, opposite side facing the environment on the second side of the substrate film (102) via at least one hole (102B) defined in the substrate film (102), said connector element (118) comprising a number of electrically conductive contact members (118A) electrically connected to the circuit on the first side of the substrate film (102) and configured to contact one or more electrical contact members of an external element (119) responsive to mating (124) the external element (119) with the connector element (118), and a plastic layer (104) molded onto said first side of the substrate film (102) and said one side of the connector element (118) so as to cover said one side of the connector element and the circuit. Related method of manufacture is presented.

2. 发明申请

WO2017178703A1 ILLUMINATED MULTILAYER STRUCTURE WITH EMBEDDED AREA LIGHT SOURCE 审中-公开
标题翻译：照明的多层结构与嵌入式面积光源
公开(公告)号：WO2017178703A1
公开(公告)日：2017-10-19
申请号：PCT/FI2017/050261
申请日：2017-04-11
申请人： TACTOTEK OY
发明人： KERÄNEN, Antti
IPC分类号： F21V8/00 , F21V13/04 , F21K9/60 , F21K9/90 , H05K5/06 , B60Q3/10 , H05K1/16
摘要： Multilayer assembly (100, 200, 300) for an electronic device comprises a substrate film (202) configured to accommodate electronics (210, 212, 214) on at least first side thereof, said film having the first side and a second side, at least one area light source (215) on the first side of the substrate film (202) and configured to emit light of predetermined frequency or frequency band, a molded lightguide layer (204) provided onto the first side of the substrate film (202) and at least partially embedding the light source (214), the lightguide layer (204) being of optically at least translucent material, wherein the plastic lightguide layer (204) is configured to transmit light emitted by the embedded light source (215) so that the transmitted light propagates within the lightguide layer (204) and is outcoupled therefrom via an outer surface thereof substantially opposite to the embedded light source, and a masking layer (106) provided on the outer surface of the plastic lightguide layer (204), containing substantially opaque material to block external view of at least some internals of the multilayer structure, wherein the masking layer (106) defines a window (116, 116A, 116B) for letting the light emitted by the embedded light source (215) and propagated within the plastic lightguide layer to pass through the masking layer (106) towards the environment. A method of manufacture the assembly is presented.
摘要翻译：用于电子设备的多层组件（100,200,300）包括配置为在其至少第一侧容纳电子器件（210,212,214）的衬底膜（202），所述膜具有第一侧和第二侧，在基底膜（202）的第一侧上的至少一个区域光源（215），并被配置为发射预定频率或频带的光;模制光导层（204），其设置在第一侧所述光导层（204）由光学上至少半透明的材料构成，其中所述塑料光导层（204）被配置成将由所述光源（214）发射的光透射到所述基底膜（202）的侧面并且至少部分地嵌入所述光源使得透射的光在光导层（204）内传播并且经由其基本上与嵌入式光源相对的外表面与其耦合从而从其耦合，以及设置在光导层（204）的外表面上的掩模层（106）塑料所述光导层（204）包含基本上不透明的材料以阻挡所述多层结构的至少一些内部结构的外部视图，其中所述掩蔽层（106）限定窗口（116,116A，116B），用于使由所述嵌入的光源（215）并且在塑料光导层内传播以朝向环境穿过掩模层（106）。介绍了一种制造组件的方法。

3. 发明申请

WO2017055686A1 MULTILAYER STRUCTURE AND RELATED METHOD OF MANUFACTURE FOR ELECTRONICS 审中-公开
标题翻译：多层结构及相关电子制造方法
公开(公告)号：WO2017055686A1
公开(公告)日：2017-04-06
申请号：PCT/FI2016/050674
申请日：2016-09-28
申请人： TACTOTEK OY
发明人： HEIKKINEN, Mikko , RAAPPANA, Pasi , SÄÄSKI, Jarmo
IPC分类号： H05K5/00 , H05K3/28 , H01L23/538 , H05K5/06 , H01R12/77 , H01R12/61 , H05K1/03 , H05K1/14 , B32B27/08 , H01R4/04
CPC分类号： H05K3/4015 , H05K1/189 , H05K3/4046 , H05K2201/10287 , H05K2203/1327
摘要： A multilayer structure (100), comprising a flexible substrate film (102) having a first side and opposite second side, a number of conductive traces (108), optionally defining contact pads and/or conductors, preferably printed on the first side of the substrate film for establishing a desired predetermined circuit design, plastic layer (104) molded onto the first side of the substrate film (102) so as to enclose the circuit between the plastic layer and the first side of the substrate film (102), and a preferably flexible connector (114) for providing external electrical connection to the embedded circuit on the first side from the second, opposite side of the substrate film (102), one end of the connector being attached to a predetermined contact area on the first side whereas the other end (114B) is located on the second side of the substrate for coupling with an external element (118), the intermediate portion connecting the two ends being fed through an opening (115) in the substrate, wherein the opening extending through the thickness of the substrate film is preferably dimensioned so as to accommodate the connector without substantial additional clearance. A corresponding method of manufacture is presented.
摘要翻译：一种多层结构（100），包括具有第一侧和相对的第二侧的柔性基底膜（102），多个导电迹线（108），可选地限定接触焊盘和/或导体，优选地印刷在用于建立期望的预定电路设计的衬底膜，模塑在衬底膜（102）的第一侧上的塑料层（104），以便包围塑料层和衬底膜（102）的第一侧之间的电路;以及优选地，柔性连接器（114），用于在基板膜（102）的第二相对侧的第一侧上提供与嵌入电路的外部电连接，连接器的一端附接到第一侧上的预定接触区域而另一端（114B）位于用于与外部元件（118）联接的基板的第二侧上，连接两端的中间部分被馈送通过基板中的开口（115） te，其中延伸穿过基底膜的厚度的开口优选地被设计成能够容纳连接器而没有实质的额外的间隙。提出了相应的制造方法。

4. 发明申请

WO2016185096A9 THERMOFORMED PLASTIC COVER FOR ELECTRONICS AND RELATED METHOD OF MANUFACTURE 审中-公开
标题翻译：用于电子的热塑性塑料盖及相关的制造方法
公开(公告)号：WO2016185096A9
公开(公告)日：2016-11-24
申请号：PCT/FI2016/050337
申请日：2016-05-19
申请人： TACTOTEK OY
发明人： HEIKKINEN, Mikko , SÄÄSKI, Jarmo , TORVINEN, Jarkko
IPC分类号： B32B27/08 , H05K1/03 , H05K3/28 , H05K5/00 , H01L23/538 , F21K9/00
摘要： A multilayer structure for an electronic device comprising a flexible substrate film (202) for accommodating electronics (204); at least one electronic component (204) provided on said substrate film (202); and a number of conductive traces (206) provided on said substrate film (202) for electrically powering and/or connecting electronics including said at least one electronic component (204), wherein at least one preferably thermoformed cover (210) is attached to said sub-strate film (202) on top of said at least one electronic component (204), the at least one thermoformed cover (210) and the substrate film (202) accommodating the electronics (204) being overmolded with thermoplastic material (208). The invention also relates to a method for manufacturing a multilayer structure for an electronic device.
摘要翻译：包括用于容纳电子器件（204）的柔性衬底膜（202）的电子器件的多层结构; 至少一个设置在所述基底膜（202）上的电子部件（204）; 以及提供在所述基底膜（202）上的多个导电迹线（206），用于为包括所述至少一个电子部件（204）的电子器件供电和/或连接电子器件，其中至少一个优选热成型的盖（210）在所述至少一个电子组件204的顶部上的所述至少一个热成形覆盖件210和所述衬底膜202与所述电子器件204一起用热塑性材料208包覆成型，。本发明还涉及制造用于电子器件的多层结构的方法。

5. 发明申请

WO2020115370A1 MULTILAYER STRUCTURE WITH EMBEDDED LIGHT SOURCE AND LIGHT-GUIDING FEATURES AND RELATED METHOD OF MANUFACTURE 审中-公开
公开(公告)号：WO2020115370A1
公开(公告)日：2020-06-11
申请号：PCT/FI2019/050872
申请日：2019-12-05
申请人： TACTOTEK OY
发明人： KERÄNEN, Antti , HEIKKINEN, Mikko
IPC分类号： G02B6/00
摘要： Integrated multilayer structure (100, 200, 300, 400, 600, 700), comprising a substrate film (102) having a first side and an opposing second side; electronics comprising at least one light source (110), optionally a LED, provided upon the first side of the substrate film and a number of electrical conductors (112), preferably printed by printed electronics technology, at least electrically coupled to the at least one light source (110), the at least one light source (110) being configured to emit light in selected one or more frequencies or wavelengths, optionally including visible light; an optically transmissive element (104) comprising thermoplastic optically transmissive, having regard to the selected frequencies or wavelengths, material having a first refractive index and produced, preferably through utilization of molding from said optically transmissive thermoplastic material, onto the first side of the substrate film (102) so as to at least partially embed the at least one light source (110) therewithin; and optical cladding (106, 106a, 106b) comprising material having a lower refractive index than the first refractive index and provided adjacent the optically transmissive element upon the first side of the substrate film (102), wherein the at least one light source, the optically transmissive element and the optical cladding have been mutually configured (702, 704) so as to convey light emitted by the light source (110) within the optically transmissive material of the optically transmissive element, at least portion of the conveyed light undergoing a substantially total internal reflection when incident upon the optical cladding. Related method of manufacture is presented

6. 发明申请

WO2020043941A1 ELECTRICAL NODE, METHOD FOR MANUFACTURING AN ELECTRICAL NODE, ELECTRICAL NODE STRIP OR SHEET, AND MULTILAYER STRUCTURE COMPRISING THE NODE 审中-公开
公开(公告)号：WO2020043941A1
公开(公告)日：2020-03-05
申请号：PCT/FI2019/050603
申请日：2019-08-27
申请人： TACTOTEK OY
发明人： SIMULA, Tomi , BRÄYSY, Vinski , HEIKKINEN, Mikko , HINTIKKA, Juha-Matti , HARVELA, Juhani , PIRKONEN, Minna , RAAPPANA, Pasi , HEIKKILÄ, Tuomas , SÄÄSKI, Jarmo
IPC分类号： H05K1/02 , H05K1/18 , H05K1/11 , H05K1/09 , H05K3/00 , H05K3/12
摘要： An electrical node (100), a method, an electrical assembly such as a node strip or sheet, a related multilayer structure and a method of manufacture are presented. The electrical node comprises a first substrate film (10) defining a cavity, and a first material layer (30) arranged to at l east partly fill the cavity, and to embed or at l east partly cover at l east one electrical element (12) arranged into the cavity.

7. 发明申请

WO2019122524A1 ARRANGEMENT AND METHOD FOR DELIVERING A CURRENT-CONTROLLED VOLTAGE 审中-公开
公开(公告)号：WO2019122524A1
公开(公告)日：2019-06-27
申请号：PCT/FI2018/050942
申请日：2018-12-18
申请人： TACTOTEK OY
发明人： KÄRNÄ, Miikka , HEIKKILÄ, Tuomas
IPC分类号： H05B33/08
摘要： An arrangement (100, 200, 300) involving printed conductive traces, the arrangement comprising at least a voltage source (V supply ) and at least one target component (106), preferably a light-emitting component such as an LED. The arrangement is adapted to produce a current-controlled voltage (V out , V out ) originating from the voltage source, the current- controlled voltage being coupled to the at least one target component, wherein said voltage is dependent on the current (I R.LED , I LED ) that is being passed through the target component.

8. 发明申请

WO2017055685A4 METHOD AND ARRANGEMENT FOR PROVIDING ELECTRICAL CONNECTION TO IN-MOLD ELECTRONICS 审中-公开
标题翻译：用于为模内电子提供电连接的方法和装置
公开(公告)号：WO2017055685A4
公开(公告)日：2017-06-15
申请号：PCT/FI2016050673
申请日：2016-09-28
申请人： TACTOTEK OY
发明人： KERÄNEN ANTTI , HEIKKINEN MIKKO , RAAPPANA PASI , SÄÄSKI JARMO
IPC分类号： H05K5/00 , B32B27/08 , H01L23/538 , H01R12/61 , H01R12/77 , H05K1/03 , H05K1/14 , H05K3/28 , H05K5/06
CPC分类号： H05K1/189 , H05K1/0269 , H05K1/028 , H05K1/111 , H05K1/118 , H05K1/16 , H05K3/0044 , H05K3/12 , H05K3/28 , H05K3/4092 , H05K3/46 , H05K2201/0129 , H05K2201/0397 , H05K2201/09081 , H05K2201/09754 , H05K2203/0228 , H05K2203/1316
摘要： A multilayer structure (100) comprises a flexible substrate film (102) having a first side and opposite second side, a number of conductive traces (108), optionally defining contact pads and/or conductors, printed on the first side of the substrate film by printed electronics technology for establishing a desired predetermined circuit design, a plastic layer (104) molded onto the first side of the substrate film (102) so as to enclose the circuit between the plastic layer and the first side of the substrate film (102), and a connector (114) in a form of a flexible flap for providing external electrical connection to the embedded circuit from the second, opposite side of the substrate film (102), the connector being defined by a portion of the substrate film (102) accommodating at least part of one or more of the printed conductive traces (108) and cut partially loose from the surrounding substrate material so as to establish the flap, the loose end of which is bendable away from the molded plastic layer to facilitate the establishment of said electrical connection with external element (118), such as a wire or connector, via the associated gap. A related method of manufacture is presented.
摘要翻译：多层结构（100）包括柔性衬底膜（102），柔性衬底膜（102）具有第一侧和相对的第二侧，多个导电迹线（108），可选地限定接触焊盘和/或导体，印刷在衬底膜通过用于建立期望的预定电路设计的印刷电子技术，在基底膜（102）的第一侧上模制塑料层（104），以便在塑料层和基底膜（102）的第一侧之间封装电路）以及柔性翼片形式的连接器（114），用于从衬底薄膜（102）的相对的第二侧提供到嵌入电路的外部电连接，连接器由衬底薄膜（102）的一部分 102），其容纳印刷导电迹线（108）中的一个或多个的至少一部分并且从周围的基板材料部分地松开以便建立该翼片，该翼片的松散端可弯曲远离该mo 以便于通过相关间隙建立与外部元件（118）（例如导线或连接器）的所述电连接。介绍了一种相关的制造方法。

9. 发明申请

WO2015049425A1 ILLUMINATED INDICATOR STRUCTURES FOR ELECTRONIC DEVICES 审中-公开
标题翻译：电子设备的照明指示器结构
公开(公告)号：WO2015049425A1
公开(公告)日：2015-04-09
申请号：PCT/FI2014/050755
申请日：2014-10-03
申请人： TACTOTEK OY
发明人： KERÄNEN, Antti , HEIKKINEN, Mikko
IPC分类号： H05K5/00 , F21V8/00 , B29C45/14 , F21V31/00 , H05K3/10
CPC分类号： G01D11/28 , F21K9/60 , F21V23/04 , H01H13/83 , H01H2219/028 , H01H2219/039 , H01H2219/056 , H01H2219/06
摘要： A composite laminate assembly for an electronic device provides integrated backlighting for one or more indicator shapes defined by the assembly. The assembly includes a substantially opaque cover member to obscure at least parts of the electronic device. Translucent indicator structures in the cover member define respective indicator shapes to allow backlighting to pass through the cover member. An optical matrix layer of an optically conductive material is attached to an inner face of the cover member, with a plurality of lighting devices embedded in the optical matrix layer and laterally offset from associated indicator structures. The plurality of lighting devices may be connected to an electric circuit carried on the inner face of the cover member.
摘要翻译：用于电子设备的复合层压组件为由组件限定的一个或多个指示器形状提供集成背光。组件包括基本上不透明的盖构件，以遮蔽电子设备的至少一部分。盖构件中的半透明指示器结构限定相应的指示器形状，以允许背光通过盖构件。光学导电材料的光学基质层被附着到盖构件的内表面，其中多个照明装置嵌入在光学矩阵层中并且横向偏离相关联的指示器结构。多个照明装置可以连接到承载在盖构件的内表面上的电路。

10. 发明申请

WO2023037051A1 INTEGRAL 3D STRUCTURE FOR CREATING UI, RELATED DEVICE AND METHODS OF MANUFACTURE AND USE 审中-公开
公开(公告)号：WO2023037051A1
公开(公告)日：2023-03-16
申请号：PCT/FI2022/050596
申请日：2022-09-08
申请人： TACTOTEK OY
发明人： SINIVAARA, Hasse
IPC分类号： G06F3/0354 , G06F3/02 , G06F3/01 , G06F3/033 , G06F3/0362 , G06F3/041 , G06F3/0488 , B60K35/00 , H01L25/075 , H05K3/28
摘要： Integrated functional multilayer structure (100, 200, 1100,1200) for building a gestural UI (user interface), comprising a flexible, 3D-formable substrate film (202) comprising a first surface (202a) for facing towards an environment of the structure and a user therein, and an opposite second surface(202b) facing towards the internals of the structure, where in the first (202a) and second (202b) surfaces and remaining material of the substrate film (202) in between locally define a three-dimensional protrusion (101) extending from a plane(2020) of surrounding substrate film material and formed from locally stretched and shaped material of the substrate film, said protrusion (101) preferably defining a continuous multi-sided knob (100, 200) or recess (1100, 1200) shape in the multilayer structure with a plurality of substantially vertical or canted, and optionally at least locally curved, side walls (104) perceptible by touch; circuitry (206) provided upon the substrate film and comprising a number of conductive traces, electrodes and/or components configured to detect touch on two or more of the plurality of side walls and preferably, a top (201) of the protrusion; and at least one fill layer (208) of preferably thermoplastic fill material arranged, optionally (injection) molded or cast, upon the substrate film to at least partially embed the circuitry and5optionally also, volume defined by the protrusion shape and the plane. Related method of manufacture is presented.

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