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1. 发明申请

WO2016185096A9 THERMOFORMED PLASTIC COVER FOR ELECTRONICS AND RELATED METHOD OF MANUFACTURE 审中-公开
标题翻译：用于电子的热塑性塑料盖及相关的制造方法
公开(公告)号：WO2016185096A9
公开(公告)日：2016-11-24
申请号：PCT/FI2016/050337
申请日：2016-05-19
申请人： TACTOTEK OY
发明人： HEIKKINEN, Mikko , SÄÄSKI, Jarmo , TORVINEN, Jarkko
IPC分类号： B32B27/08 , H05K1/03 , H05K3/28 , H05K5/00 , H01L23/538 , F21K9/00
摘要： A multilayer structure for an electronic device comprising a flexible substrate film (202) for accommodating electronics (204); at least one electronic component (204) provided on said substrate film (202); and a number of conductive traces (206) provided on said substrate film (202) for electrically powering and/or connecting electronics including said at least one electronic component (204), wherein at least one preferably thermoformed cover (210) is attached to said sub-strate film (202) on top of said at least one electronic component (204), the at least one thermoformed cover (210) and the substrate film (202) accommodating the electronics (204) being overmolded with thermoplastic material (208). The invention also relates to a method for manufacturing a multilayer structure for an electronic device.
摘要翻译：包括用于容纳电子器件（204）的柔性衬底膜（202）的电子器件的多层结构; 至少一个设置在所述基底膜（202）上的电子部件（204）; 以及提供在所述基底膜（202）上的多个导电迹线（206），用于为包括所述至少一个电子部件（204）的电子器件供电和/或连接电子器件，其中至少一个优选热成型的盖（210）在所述至少一个电子组件204的顶部上的所述至少一个热成形覆盖件210和所述衬底膜202与所述电子器件204一起用热塑性材料208包覆成型，。本发明还涉及制造用于电子器件的多层结构的方法。

2. 发明申请

WO2015044523A1 METHOD FOR MANUFACTURING AN ELECTROMECHANICAL STRUCTURE AND AN ARRANGEMENT FOR CARRYING OUT THE METHOD 审中-公开
标题翻译：制造机电结构的方法和实施方法的安排
公开(公告)号：WO2015044523A1
公开(公告)日：2015-04-02
申请号：PCT/FI2014/050729
申请日：2014-09-25
申请人： TACTOTEK OY
发明人： HEIKKINEN, Mikko , SÄÄSKI, Jarmo , TORVINEN, Jarkko , NISKALA, Paavo , SIPPARI, Mikko , RAAPPANA, Pasi , KERÄNEN, Antti
IPC分类号： B29C45/14 , H05K1/03 , H05K1/16 , H05K1/18
CPC分类号： H05K3/0014 , B29C45/1418 , B29C45/14639 , B29C45/14811 , B29C45/14819 , B29C2045/14237 , B29L2031/3425 , B29L2031/3481 , H05K1/0284 , H05K1/0393 , H05K2201/0129 , H05K2201/09118 , H05K2203/1105
摘要： Method for manufacturing an electromechanical structure, com-prising: producing conductors and/or graphics on a substantially flat film 106, attaching electronic elements on the said film 108 in relation to the de-sired three-dimensional shape of the film,forming the said film housing the electronic elements into a substantially three-dimensional shape 110,using the substantially three-dimensional film as an insert in an injection molding process by molding substantially on said film 112, wherein a preferred layer of material is attached on the surface of the film, creating an electromechanical structure.A corresponding arrangement for carrying out said method is also presented.
摘要翻译：制造机电结构的方法，其特征在于：在基本上平坦的薄膜106上制造导体和/或图形，将电子元件相对于薄膜的三维形状相对于所述薄膜108附着，形成所述薄膜将电子元件容纳在基本上为三维形状110中，使用基本上三维的膜作为注射成型工艺中的插入物，通过基本上模制在所述膜112上，其中优选的材料层附着在还提出了用于实现所述方法的相应装置。

3. 发明申请

WO2015132455A1 METHOD FOR MANUFACTURING ELECTRONIC PRODUCTS, RELATED ARRANGEMENT AND PRODUCT 审中-公开
标题翻译：制造电子产品的方法，相关安排和产品
公开(公告)号：WO2015132455A1
公开(公告)日：2015-09-11
申请号：PCT/FI2015/050094
申请日：2015-02-16
申请人： TACTOTEK OY
发明人： HEIKKINEN, Mikko , NISKALA, Paavo , RAAPPANA, Pasi , SIPPARI, Mikko , TORVINEN, Jarkko
IPC分类号： H05K1/09 , H05K3/12 , H05K3/30
CPC分类号： H05K3/1216 , H05K1/0284 , H05K1/092 , H05K1/181 , H05K1/189 , H05K3/0014 , H05K3/12 , H05K3/284 , H05K3/305 , H05K2201/0108 , H05K2203/1105 , H05K2203/1316 , Y10T29/53174
摘要： A method for manufacturing an electronic product, comprising providing a flexible, optionally optically substantially transparent or translucent, substrate film, printing (106) a number of conductive traces of conductive ink on the substrate film, said traces defining a number of conductors and conductive contact areas for the contacts of at least one electronic surface-mountable component, disposing (108) the at least one electronic surface-mountable component, such as an integrated circuit, on the substrate film so that the contacts meet the predefined contact areas when they are still wet to establish the electrical connection therebetween, and further securing, optionally overmoulding, the component. Related arrangement and electronic product are presented.
摘要翻译：一种用于制造电子产品的方法，包括提供柔性的，可选地光学上基本上透明或半透明的基底膜，在基底膜上印刷（106）导电油墨的多个导电迹线，所述迹线限定多个导体和导电接触用于至少一个电子表面可安装部件的触点的区域，在基底膜上设置（108）至少一个电子表面贴装元件（如集成电路），使得当触点满足预定义的接触区域时仍然湿润以在其间建立电连接，并进一步确保（任选地包覆成型）部件。介绍相关安排和电子产品。

4. 发明申请

WO2021130408A1 INTEGRATED FUNCTIONAL MULTILAYER STRUCTURE AND METHOD OF MANUFACTURE THEREFOR 审中-公开
公开(公告)号：WO2021130408A1
公开(公告)日：2021-07-01
申请号：PCT/FI2020/050850
申请日：2020-12-18
申请人： TACTOTEK OY
发明人： RAUTIO, Tapio , SIMULA, Tomi , PIRKONEN, Minna , TORVINEN, Jarkko , JUNKKARI, Tuukka , ASIKKALA, Janne , SINIVAARA, Hasse
IPC分类号： H05K1/02 , H05K3/00 , H05K3/28 , H05K1/0277 , H05K1/0281 , H05K1/189 , H05K2201/0108 , H05K2201/0129 , H05K2201/091 , H05K2201/09118 , H05K2201/09781 , H05K2201/09909 , H05K2201/2009 , H05K2201/2027 , H05K2203/1327 , H05K3/0014 , H05K3/284
摘要： Integrated functional multilayer structure (100), comprising asubstrate film (102) formed or formable so as to exhibit aselected shape (103); and a number of functional, preferably5including optical, mechanical, optoelectrical, electrical and/orspecifically, electronic, elements (110, 112, 114, 210), such asconductors (112), insulators (114), components (110, 210)and/or integrated circuits (110, 210), provided upon thesubstrate film in the proximity of the shape (103); wherein the0substrate film (102) has further been provided with a structuraltuning element (116, 316, 416, 616, 716, 816, 916, 1016),optionally comprising an elongated (316, 416), circumferential(616, 716) or other selected shape, said structural tuning elementbeing configured to locally control induced deformation,5optionally including stretching, bending, compression and/orshearing, of the substrate film within said proximity of the shape.Related method of manufacture is presented.Fig. 10

5. 发明申请

WO2017178702A1 MULTILAYER STRUCTURE WITH EMBEDDED MULTILAYER ELECTRONICS 审中-公开
标题翻译：具有嵌入式多层电子的多层结构
公开(公告)号：WO2017178702A1
公开(公告)日：2017-10-19
申请号：PCT/FI2017/050260
申请日：2017-04-11
申请人： TACTOTEK OY
发明人： SÄÄSKI, Jarmo , TORVINEN, Jarkko , RAAPPANA, Pasi , HEIKKINEN, Mikko
IPC分类号： H05K5/00 , H05K3/28 , H05K5/06 , H05K1/03 , H05K1/14 , H01L23/522 , H01L23/538 , B29C39/12 , B29C45/16 , B32B27/08 , G06F3/044 , B32B17/10
摘要： An integrated multilayer assembly (100, 200, 300) for an electronic device comprising a first substrate film (106) configured to accommodate electrical features on at least first side thereof, said first substrate film having the first side and a substantially opposing second side, a second substrate film (202) configured to accommodate electrical features on at least first side thereof, said second substrate film having the first side and a substantially opposing second side, the first sides of the first and second substrate films being configured to face each other, at least one electrical feature (214B) on the first side of the first substrate film, at least one other electrical feature (214A) on the first side of the second substrate film, and a molded plastic layer (204) between the first and second substrate films at least partially embedding the electrical features on the first sides thereof. A related method of manufacture is presented.
摘要翻译：一种用于电子装置的集成多层组件（100,200,300），所述集成多层组件（100,200,300）包括被配置为在其至少第一侧上容纳电特征的第一衬底薄膜（106），所述第一衬底薄膜具有第一衬底薄膜（202），其被配置为在其至少第一侧上容纳电特征，所述第二基底膜具有所述第一侧和基本上相对的第二侧，所述第一和第二侧衬底膜被配置为彼此面对，第一衬底膜的第一侧上的至少一个电特征（214B），第二衬底膜的第一侧上的至少一个其他电特征（214A）以及模制塑料所述第一和第二基底膜之间的层（204）至少部分地将所述电特征嵌入其第一侧上。介绍了一种相关的制造方法。

6. 发明申请

WO2016185096A1 THERMOFORMED PLASTIC COVER FOR ELECTRONICS AND RELATED METHOD OF MANUFACTURE 审中-公开
标题翻译：电热塑料包装机及相关制造方法
公开(公告)号：WO2016185096A1
公开(公告)日：2016-11-24
申请号：PCT/FI2016/050337
申请日：2016-05-19
申请人： TACTOTEK OY
发明人： HEIKKINEN, Mikko , SÄÄSKI, Jarmo , TORVINEN, Jarkko
IPC分类号： B32B27/08 , H05K1/03 , H05K3/28 , H05K5/00 , H01L23/538 , F21K9/00
CPC分类号： H05K1/186 , H01L23/4985 , H01L23/5387 , H01L33/52 , H01L51/0097 , H01L2224/1319 , H01L2933/005 , H05K1/0274 , H05K1/0298 , H05K1/189 , H05K3/284 , H05K2201/0129 , H05K2201/05 , H05K2201/09872 , H05K2201/10106 , H05K2201/10151 , H05K2203/1316 , H05K2203/1322
摘要： A multilayer structure for an electronic device comprising a flexible substrate film (202) for accommodating electronics (204); at least one electronic component (204) provided on said substrate film (202); and a number of conductive traces (206) provided on said substrate film (202) for electrically powering and/or connecting electronics including said at least one electronic component (204), wherein at least one preferably thermoformed cover (210) is attached to said sub-strate film (202) on top of said at least one electronic component (204), the at least one thermoformed cover (210) and the substrate film (202) accommodating the electronics (204) being overmolded with thermoplastic material (208). The invention also relates to a method for manufacturing a multilayer structure for an electronic device.
摘要翻译：一种用于电子设备的多层结构，包括用于容纳电子装置（204）的柔性基底膜（202）。设置在所述衬底膜（202）上的至少一个电子部件（204）; 以及设置在所述衬底膜（202）上的多个导电迹线（206），用于对包括所述至少一个电子部件（204）的电子元件进行电力供应和/或连接，其中至少一个优选地，热成型盖（210）附接到所述所述至少一个电子部件（204）顶部的所述至少一个热成型盖（210）和容纳所述电子器件（204）的所述基底膜（202）被热塑性材料（208）包覆成型，。本发明还涉及一种用于制造电子设备的多层结构的方法。

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