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1. 发明申请

WO2009048255A3 METHOD FOR WAFER TEST AND PROBE CARD FOR THE SAME 审中-公开
标题翻译：用于晶片测试和探针卡的方法
公开(公告)号：WO2009048255A3
公开(公告)日：2009-05-28
申请号：PCT/KR2008005900
申请日：2008-10-08
申请人： AMST CO LTD , CHUNG IN BUHM , SONG BYUNG CHANG , KIM DONG IL
发明人： CHUNG IN BUHM , SONG BYUNG CHANG , KIM DONG IL
IPC分类号： H01L21/66
CPC分类号： G01R31/2887 , G01R1/0491
摘要： A method of testing a wafer capable of minimizing the asymmetrical thermal deformation of a probe card when a wafer is tested using a probe card and of minimizing the number of times of tests to effectively test a large area wafer and a probe card for the same is presented. For the wafer test method for testing semiconductor chips on a wafer using a probe card, the method includes creating virtual repeating units corresponding to N semiconductor chips, wherein the N is natural number larger than or equal to 2, arranging the plurality of repeating units on the wafer and moving the probe card or the wafer N times and testing the semiconductor chips on a wafer, wherein the semiconductor chips in the repeating units are sequentially tested one by one per each touchdown. Also, the probe cards to realize above mentioned method have been described.
摘要翻译：一种测试晶片的方法，当使用探针卡测试晶片时，能够最小化探针卡的非对称热变形，并且最小化有效地测试大面积晶片和探针卡的测试次数的方法是呈现。对于使用探针卡在晶片上测试半导体芯片的晶片测试方法，该方法包括创建对应于N个半导体芯片的虚拟重复单元，其中N是大于或等于2的自然数，将多个重复单元布置在晶片并将探针卡或晶片移动N次，并测试晶片上的半导体芯片，其中重复单元中的半导体芯片按照每次着地顺序依次测试。而且，已经描述了实现上述方法的探针卡。

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