专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

WO2010026527A2 RADIATION DETECTOR WITH A STACK OF CONVERTER PLATES AND INTERCONNECT LAYERS 审中-公开
标题翻译：具有转换板和互连层堆叠的辐射探测器
公开(公告)号：WO2010026527A2
公开(公告)日：2010-03-11
申请号：PCT/IB2009/053800
申请日：2009-09-01
申请人： KONINKLIJKE PHILIPS ELECTRONICS N.V. , PHILIPS INTELLECTUAL PROPERTY & STANDARDS GMBH , VAN ASSELT, Rob , SLOB, Cornelis , VAN VEEN, Nicolaas, J., A. , BAEUMER, Christian , STEADMAN BOOKER, Roger , HERRMANN, Christoph , WEEKAMP, Johannes, W. , ENGEL, Klaus, J.
发明人： VAN ASSELT, Rob , SLOB, Cornelis , VAN VEEN, Nicolaas, J., A. , BAEUMER, Christian , STEADMAN BOOKER, Roger , HERRMANN, Christoph , WEEKAMP, Johannes, W. , ENGEL, Klaus, J.
IPC分类号： G01T1/24
CPC分类号： G01T1/2928
摘要： The invention relates to a radiation detector and a method for its production, wherein a series of converter plates (110) and interconnect layers (120), which extend into a border volume (BV) lateral of the converter plates (110), are stacked. By filling voids in the border volume (BV) with an underfill material and cutting through the border volume, a contact surface (CS) is generated in which electrical leads (123) of the interconnect layers (120) lie free. To allow a good contacting, said leads (123) are preferably provided with enlargements in the contact surface, for example by bonding wires (132) to them.
摘要翻译：本发明涉及一种辐射检测器及其制造方法，其中一系列转换板（110）和互连层（120），其延伸到转换器板（110）的侧面的边界体积（BV）中，。通过用底部填充材料填充边界体积（BV）中的空隙并切割通过边界体积，产生接触表面（CS），其中互连层（120）的电引线（123）不存在。为了允许良好的接触，所述引线（123）优选地设置在接触表面中的放大，例如通过将导线（132）接合到它们。

2. 发明申请

WO2010143114A1 LED ILLUMINATION DEVICE 审中-公开
标题翻译： LED照明装置
公开(公告)号：WO2010143114A1
公开(公告)日：2010-12-16
申请号：PCT/IB2010/052507
申请日：2010-06-07
申请人： KONINKLIJKE PHILIPS ELECTRONICS N.V. , LENDERINK, Egbert , SLOB, Cornelis , KURT, Ralph , JAGT, Hendrik, Johannes, Boudewijn , KLEYNEN, Christian , HORNIX, Eefje, Janet
发明人： LENDERINK, Egbert , SLOB, Cornelis , KURT, Ralph , JAGT, Hendrik, Johannes, Boudewijn , KLEYNEN, Christian , HORNIX, Eefje, Janet
IPC分类号： H01L33/44
CPC分类号： H01L33/44 , H01L33/505 , H01L33/58 , H01L33/62 , H01L2224/8592 , H01L2224/48091 , H01L2924/00014
摘要： The invention relates to an illumination device comprising a semiconductor light-emitting element (2) having a light out-coupling side; a wavelength converting member (4) arranged on a region of said light out-coupling side of the semiconductor light-emitting element and not covering another region of said light out-coupling side; an electrically conductive member (5) contacting said light out-coupling side of the semiconductor light- emitting element at said region of the light out-coupling side not covered by the wavelength converting member; and a light redirecting and/or absorbing member (6) arranged on said light out-coupling side of the semiconductor light-emitting element at the region thereof not covered by the wavelength converting member and in direct or indirect contact with a lateral side of said wavelength converting member, such that, in operation, light emitted via the light out-coupling side of the semiconductor light-emitting element at the region thereof not covered by the wavelength converting member is absorbed or redirected by the light redirecting and/or absorbing member. The illumination device according to the invention produces light of more homogeneous color and/or improved color purity.
摘要翻译：本发明涉及一种包括具有光输出耦合侧的半导体发光元件（2）的照明装置; 布置在所述半导体发光元件的所述发光耦合侧的区域上并且不覆盖所述光输出耦合侧的另一区域的波长转换构件（4）导电构件（5），在所述光输出耦合侧的所述区域与所述波长转换构件未被覆盖的所述半导体发光元件的所述光出射耦合侧接触; 以及布置在所述半导体发光元件的所述发光耦合侧的光重定向和/或吸收构件（6），其未被所述波长转换构件覆盖的区域直接或间接地与所述波长转换构件，使得在操作中，在未被波长转换构件覆盖的区域处经由半导体发光元件的光出射耦合侧发射的光被光重定向和/或吸收构件吸收或重定向。根据本发明的照明装置产生更均匀的颜色和/或改善的色纯度的光。

3. 发明申请

WO2010026527A3 RADIATION DETECTOR WITH A STACK OF CONVERTER PLATES AND INTERCONNECT LAYERS 审中-公开
标题翻译：具有一堆转换板和互连层的辐射探测器
公开(公告)号：WO2010026527A3
公开(公告)日：2010-09-23
申请号：PCT/IB2009053800
申请日：2009-09-01
申请人： KONINKL PHILIPS ELECTRONICS NV , PHILIPS INTELLECTUAL PROPERTY , VAN ASSELT ROB , SLOB CORNELIS , VAN VEEN NICOLAAS J A , BAEUMER CHRISTIAN , STEADMAN BOOKER ROGER , HERRMANN CHRISTOPH , WEEKAMP JOHANNES W , ENGEL KLAUS J
发明人： VAN ASSELT ROB , SLOB CORNELIS , VAN VEEN NICOLAAS J A , BAEUMER CHRISTIAN , STEADMAN BOOKER ROGER , HERRMANN CHRISTOPH , WEEKAMP JOHANNES W , ENGEL KLAUS J
IPC分类号： G01T1/29
CPC分类号： G01T1/2928
摘要： The invention relates to a radiation detector and a method for its production, wherein a series of converter plates (110) and interconnect layers (120), which extend into a border volume (BV) lateral of the converter plates (110), are stacked. By filling voids in the border volume (BV) with an underfill material and cutting through the border volume, a contact surface (CS) is generated in which electrical leads (123) of the interconnect layers (120) lie free. To allow a good contacting, said leads (123) are preferably provided with enlargements in the contact surface, for example by bonding wires (132) to them.
摘要翻译：辐射探测器及其制造方法技术领域本发明涉及辐射探测器及其制造方法，其中延伸到转换器板（110）的横向边界体积（BV）中的一系列转换器板（110）和互连层（120）被堆叠。通过用底部填充材料填充边界体积（BV）中的空隙并切割边界体积，产生接触表面（CS），其中互连层（120）的电引线（123）处于空闲状态。为了允许良好的接触，所述引线（123）优选在接触表面上设置有扩大部分，例如通过将线（132）接合到它们。

4. 发明申请

WO2007119206A3 A METHOD FOR MANUFACTURING AN ELECTRONIC ASSEMBLY; AN ELECTRONIC ASSEMBLY, A COVER AND A SUBSTRATE 审中-公开
标题翻译：一种制造电子组件的方法; 电子组件，盖子和基板
公开(公告)号：WO2007119206A3
公开(公告)日：2008-01-10
申请号：PCT/IB2007051297
申请日：2007-04-11
申请人： KONINKL PHILIPS ELECTRONICS NV , WEEKAMP JOHANNES W , SLOB CORNELIS , SCHEER JACOB M , VAN STRATEN FREERK E
发明人： WEEKAMP JOHANNES W , SLOB CORNELIS , SCHEER JACOB M , VAN STRATEN FREERK E
IPC分类号： B81C1/00
CPC分类号： B81C1/00833 , B81C1/00269 , B81C2203/035 , H05K3/341 , H05K2201/10371 , H05K2201/10477 , H05K2203/1147 , Y02P70/613 , Y10T29/49117
摘要： The present invention relates to a method for manufacturing an electronic assembly (50) comprising an electronic component, a cavity and a substrate which method comprises; -providing an electronic component (10) having a first pattern with a substantially closed configuration; -providing a cover (18) on a surface of the electronic component, which cover together with said surface defines a cavity (20), the closed configuration of the first pattern substantially enclosing the cover at said surface; -providing a substrate (30) having a second pattern with a substantially closed configuration, which closed configuration at least partially corresponds to the closed configuration of the first pattern and comprises a solder pad; -disposing solder material at the solder pad; -positioning the electronic component and the substrate so as to align both the substantially closed configurations of the first and second pattern, while the substrate supports a top surface (28) of the cover; -reflow-soldering the solder material, therewith providing a soldered connection (52) between the first and second pattern. Furthermore the present invention relates to an electronic assembly (50), a cover (18) and a substrate (30).
摘要翻译：本发明涉及一种用于制造电子组件（50）的方法，所述电子组件（50）包括电子部件，空腔和基板，所述方法包括： - 提供具有基本上封闭构造的第一图案的电子部件（10） - 提供与所述表面一起覆盖的所述电子部件的表面上的盖子（18）限定空腔（20），所述第一图案的所述封闭构造基本上在所述表面上包围所述盖子; - 提供具有基本封闭构造的第二图案的衬底（30），该封闭构造至少部分对应于第一图案的封闭构造，并且包括焊盘; - 在焊料垫上涂抹焊料; - 定位所述电子部件和所述基板，以便在所述基板支撑所述盖的顶表面（28）的同时对准所述第一和第二图案的所述基本上封闭的构造; - 回流焊接焊料材料，从而在第一和第二图案之间提供焊接连接（52）。此外，本发明涉及电子组件（50），盖（18）和基板（30）。

5. 发明申请

WO2011033433A1 LIGHT-SOURCE MODULE AND LIGHT-EMITTING DEVICE 审中-公开
标题翻译：光源模块和发光器件
公开(公告)号：WO2011033433A1
公开(公告)日：2011-03-24
申请号：PCT/IB2010/054093
申请日：2010-09-10
申请人： KONINKLIJKE PHILIPS ELECTRONICS N.V. , KURT, Ralph , SLOB, Cornelis , DE SAMBER, Marc, Andre , TER LAAK, Michael, Johan, Ferdinand, Marie , KUMS, Gerard , LENDERINK, Egbert , VAN DER LUBBE, Marcellus, Jacobus, Johannes , SIPKES, Mark, Eduard, Johan
发明人： KURT, Ralph , SLOB, Cornelis , DE SAMBER, Marc, Andre , TER LAAK, Michael, Johan, Ferdinand, Marie , KUMS, Gerard , LENDERINK, Egbert , VAN DER LUBBE, Marcellus, Jacobus, Johannes , SIPKES, Mark, Eduard, Johan
IPC分类号： H05K1/02 , H05B33/08 , F21S2/00 , H01L25/075 , G02F1/13357 , H01L33/36 , H01L33/64
CPC分类号： H05K1/181 , F21S2/005 , F21V23/06 , F21Y2113/13 , F21Y2115/10 , G02F1/133603 , G02F2001/133612 , H01L25/0753 , H01L2224/48091 , H01L2224/48227 , H05B33/0824 , H05K1/117 , H05K2201/09709 , H05K2201/10106 , H05K2201/10969 , H05K2203/049 , Y02P70/611 , H01L2924/00014
摘要： A light-emitting module (3a-c; 23; 26; 33a-c) comprising a plurality of light- sources (12a-e; 27a-h) arranged in at least a first and a second column (18a-b; 28a-c) arranged side by side and extending along a first direction of extension (X 1 ) of the light- emitting module (3a-c; 23; 26; 33a-c); and a plurality of connector terminal pairs (13a-b, 14a-b, 15a-b, 16a-b 17a-b), each being electrically connected to a corresponding one of the light-sources (3a-c; 23; 26; 33a-c) for enabling supply of electrical power thereto. Each connector terminal pair (13a-b, 14a-b, 15a-b, 16a-b 17a-b) comprises a first connector terminal (13a, 14a, 15a, 16a 17a) and a second connector terminal (13b, 14b, 15b, 16b 17b) being arranged at opposite sides of the light-emitting module (3a-c; 23; 26; 33a-c). The light- sources (12a-e; 27a-h) are arranged in a predetermined light-source sequence along the first direction of extension (X 1 ) of the light-emitting module (3a-c; 23; 26; 33a-c), and the connector terminal pairs (13a-b, 14a-b, 15a-b, 16a-b 17a-b) being electrically connected to the corresponding light-sources (12a-e; 27a-h) are arranged in the predetermined light-source sequence along the first direction of extension (X 1 ) of the light-emitting module.
摘要翻译：包括布置在至少第一和第二列（18a-b; 28a）中的多个光源（12a-e; 27a-h）的发光模块（3a-c; 23; 26; 33a-c） -c）并排布置并沿着所述发光模块（3a-c; 23; 26; 33a-c）的第一延伸方向（X1）延伸; 以及多个连接器端子对（13a-b，14a-b，15a-b，16a-b 17a-b），每个连接器端子对电连接到相应的一个光源（3a-c; 23; 26; 33a-c），用于使其能够供电。每个连接器端子对（13a-b，14a-b，15a-b，16a-b 17a-b）包括第一连接器端子（13a，14a，15a，16a 17a）和第二连接器端子（13b，14b，15b ，16b 17b）布置在发光模块（3a-c; 23; 26; 33a-c）的相对侧。光源（12a-e; 27a-h）沿着发光模块（3a-c; 23; 26; 33a-c）的第一延伸方向（X1）以预定的光源顺序排列，，并且电连接到对应的光源（12a-e; 27a-h）的连接器端子对（13a-b，14a-b，15a-b，16a-b 17a-b）被布置在预定的光沿着发光模块的第一延伸方向（X1）的源序列。

6. 发明申请

WO2007119206A2 A METHOD FOR MANUFACTURING AN ELECTRONIC ASSEMBLY; AN ELECTRONIC ASSEMBLY, A COVER AND A SUBSTRATE 审中-公开
标题翻译：一种制造电子组件的方法; 电子组件，盖子和基板
公开(公告)号：WO2007119206A2
公开(公告)日：2007-10-25
申请号：PCT/IB2007/051297
申请日：2007-04-11
申请人： KONINKLIJKE PHILIPS ELECTRONICS N.V. , WEEKAMP, Johannes, W. , SLOB, Cornelis , SCHEER, Jacob, M. , VAN STRATEN, Freerk, E.
发明人： WEEKAMP, Johannes, W. , SLOB, Cornelis , SCHEER, Jacob, M. , VAN STRATEN, Freerk, E.
IPC分类号： B81C1/00
CPC分类号： B81C1/00833 , B81C1/00269 , B81C2203/035 , H05K3/341 , H05K2201/10371 , H05K2201/10477 , H05K2203/1147 , Y02P70/613 , Y10T29/49117
摘要： The present invention relates to a method for manufacturing an electronic assembly (50) comprising an electronic component, a cavity and a substrate which method comprises; -providing an electronic component (10) having a first pattern with a substantially closed configuration; -providing a cover (18) on a surface of the electronic component, which cover together with said surface defines a cavity (20), the closed configuration of the first pattern substantially enclosing the cover at said surface; -providing a substrate (30) having a second pattern with a substantially closed configuration, which closed configuration at least partially corresponds to the closed configuration of the first pattern and comprises a solder pad; -disposing solder material at the solder pad; -positioning the electronic component and the substrate so as to align both the substantially closed configurations of the first and second pattern, while the substrate supports a top surface (28) of the cover; -reflow-soldering the solder material, therewith providing a soldered connection (52) between the first and second pattern. Furthermore the present invention relates to an electronic assembly (50), a cover (18) and a substrate (30).
摘要翻译：本发明涉及一种用于制造电子组件（50）的方法，所述电子组件（50）包括电子部件，空腔和基板，所述方法包括： - 提供具有基本上封闭构造的第一图案的电子部件（10） - 提供与所述表面一起覆盖的所述电子部件的表面上的盖子（18）限定空腔（20），所述第一图案的所述封闭构造基本上在所述表面上包围所述盖子; - 提供具有基本封闭构造的第二图案的衬底（30），该封闭构造至少部分对应于第一图案的封闭构造，并且包括焊盘; - 在焊料垫上涂抹焊料; - 定位所述电子部件和所述基板，以便在所述基板支撑所述盖的顶表面（28）的同时对准所述第一和第二图案的所述基本上封闭的构造; - 回流焊接焊料材料，从而在第一和第二图案之间提供焊接连接（52）。此外，本发明涉及电子组件（50），盖（18）和基板（30）。

7. 发明申请

WO2009001264A1 LIGHT OUTPUT DEVICE 审中-公开
标题翻译：光输出装置
公开(公告)号：WO2009001264A1
公开(公告)日：2008-12-31
申请号：PCT/IB2008/052446
申请日：2008-06-20
申请人： KONINKLIJKE PHILIPS ELECTRONICS N.V. , WEEKAMP, Johannes, W. , SLOB, Cornelis , DE SAMBER, Marc, A.
发明人： WEEKAMP, Johannes, W. , SLOB, Cornelis , DE SAMBER, Marc, A.
IPC分类号： B32B17/10 , F21K7/00 , B24C1/04
CPC分类号： B32B17/10036 , B32B17/10174 , B32B17/10376 , B32B17/10541 , B32B17/10761 , B32B17/1099 , F21K9/00 , F21Y2105/10 , F21Y2115/10
摘要： The present invention relates to a light output device (1) comprising at least one light source (2) and a conductive structure (4) electrically connected to said light source (2), said light source (2) and conductive structure (4) being sandwiched between substrates (6, 7). The light output device (1) is characterized in that at least one of said substrates (6, 7) is provided with a through hole (8) exposing at least part of said conductive structure (4), thereby enabling electrical interconnection between said conductive structure (4) and an external power supply. The present invention also relates to a method for manufacturing a light output device.
摘要翻译：本发明涉及一种光输出装置（1），包括至少一个光源（2）和与所述光源（2），所述光源（2）和导电结构（4）电连接的导电结构（4）夹在基板（6,7）之间。光输出装置（1）的特征在于，所述基板（6,7）中的至少一个设置有暴露至少部分所述导电结构（4）的通孔（8），从而使所述导电结构（4）和外部电源。本发明还涉及一种制造光输出装置的方法。

8. 发明申请

WO2007122566A1 LED ARRAY GRID, METHOD AND DEVICE FOR MANUFACTURING SAID GRID AND LED COMPONENT FOR USE IN THE SAME 审中-公开
标题翻译： LED阵列网，用于制造网格的方法和装置以及在其中使用的LED组件
公开(公告)号：WO2007122566A1
公开(公告)日：2007-11-01
申请号：PCT/IB2007/051416
申请日：2007-04-19
申请人： KONINKLIJKE PHILIPS ELECTRONICS N.V. , WEEKAMP, Johannes, W. , SLOB, Cornelis
发明人： WEEKAMP, Johannes, W. , SLOB, Cornelis
IPC分类号： F21S4/00 , F21K7/00 , F21Y101/02
CPC分类号： F21V21/002 , B21F45/00 , F21K9/90 , F21S4/15 , F21S4/28 , F21Y2115/10 , H01L33/62 , H01L2224/45015 , H01L2224/45147 , H01L2224/48465 , H01L2924/01047 , H01L2924/207 , H01L2224/48091 , H01L2924/00014 , H01L2924/00 , H01L2924/0002 , H01L2924/2076
摘要： A method for production of a LED array grid is disclosed. The method comprises the steps of: - arranging N electrically conducting wires (W1-WN) in parallel, where N is an integer > 1, thus creating an array of wires (W1-WN), said array having a width D perpendicular to a length direction of the wires (W1-WN), - arranging LED components (106; 206) to the array of wires (110, 210) such that each LED component (106, 206) is electrically coupled to at least two adjacent wires (Wn-Wn+1), - stretching the array of wires such that the width D increases.
摘要翻译：公开了一种制造LED阵列栅格的方法。该方法包括以下步骤： - 并行布置N根导线（W1-WN），其中N为整数> 1，从而产生线阵列（W1-WN），所述阵列具有垂直于布线（W1-WN）的长度方向， - 将LED组件（106; 206）布置到所述导线阵列（110,210），使得每个LED组件（106,206）电耦合到至少两个相邻导线 Wn-Wn + 1）， - 拉伸线阵，使得宽度D增加。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式