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1. 发明申请

WO2013021305A1 WAFER LEVEL PROCESSING OF LEDS USING CARRIER WAFER 审中-公开
标题翻译：使用载体波的LED的水平加工
公开(公告)号：WO2013021305A1
公开(公告)日：2013-02-14
申请号：PCT/IB2012/053848
申请日：2012-07-27
申请人： KONINKLIJKE PHILIPS ELECTRONICS N.V. , DE SAMBER, Marc Andre , VAN GRUNSVEN, Eric Cornelis Egbertus
发明人： DE SAMBER, Marc Andre , VAN GRUNSVEN, Eric Cornelis Egbertus
IPC分类号： H01L33/62 , H01L33/48
CPC分类号： H01L33/62 , H01L33/486 , H01L2924/0002 , H01L2933/0066 , H01L2924/00
摘要： A LED wafer (16) comprises semiconductor layers and LED electrodes (34) on a bottom surface of the LED wafer. A carrier wafer (10), such as silicon, has vias (12) formed in it prior to bonding to the LED wafer. The LED wafer is then bonded to the carrier wafer using a polymer bonding layer (50), where the vias are aligned with the LED electrodes. The bonding layer exposed by the vias is then etched away. A seed layer (54) is then deposited over the carrier wafer, which electrically contacts the LED electrodes through the vias. The seed layer is then plated with copper, and the copper is patterned to form n and p electrodes (56, 58). A solder mask (60) is then formed over the metal layer, and bond pads (64, 66) are formed over the exposed metal layer for surface mount bonding to a thermally conductive circuit board.
摘要翻译： LED晶片（16）在LED晶片的底表面上包括半导体层和LED电极（34）。诸如硅的载体晶片（10）在结合到LED晶片之前在其中形成有通孔（12）。然后使用聚合物接合层（50）将LED晶片接合到载体晶片，其中通孔与LED电极对准。然后通过通孔暴露的结合层被蚀刻掉。然后将晶种层（54）沉积在载体晶片上，其通过通孔与LED电极电接触。然后用铜镀种子层，对铜进行图案化以形成n和p电极（56,58）。然后在金属层上形成焊接掩模（60），并且在暴露的金属层上方形成接合焊盘（64,66），用于表面贴装到导热电路板。

2. 发明申请

WO2007057818A2 LIGHTING DEVICE AND METHOD FOR DIRECTING LIGHT 审中-公开
标题翻译：照明设备和方向指示灯
公开(公告)号：WO2007057818A2
公开(公告)日：2007-05-24
申请号：PCT/IB2006/054175
申请日：2006-11-09
申请人： PHILIPS INTELLECTUAL PROPERTY & STANDARDS GMBH , KONINKLIJKE PHILIPS ELECTRONICS N.V. , PETERS, Ralph-Hubert , DE SAMBER, Marc Andre , VAN OS, Koen , SWEEGERS, Norbertus Antonius Maria , LENDERINK, Egbert , VAN HEESWIJK, Johannes Antonius Adrianus Maria , KOHL, Johann-Josef
发明人： PETERS, Ralph-Hubert , DE SAMBER, Marc Andre , VAN OS, Koen , SWEEGERS, Norbertus Antonius Maria , LENDERINK, Egbert , VAN HEESWIJK, Johannes Antonius Adrianus Maria , KOHL, Johann-Josef
CPC分类号： F21S41/43 , F21S41/143 , F21S41/147 , F21S41/19 , F21Y2115/10
摘要： An LED module is described with a base 10 made out of a heat conducting material. An LED element (32) is arranged in a cavity (11) of the base. A collimator reflector (70) is formed by reflective surfaces (24, 64, 66a). Three of these reflective surfaces (66a, 66b, 64) are provided on a plastic insert (60) received in the cavity (11). A further reflective surface (24) is provided on the base (10) itself. This surface (24) has a straight border line (50). The collimator reflector (70) is arranged to reflect light from the LED (32) so that a cut-off (72) is formed by the straight border line (50). By thus integrating the cut-off, as the most critical optical element, into the base (10) itself, high accuracy is achieved.
摘要翻译： LED模块被描述为具有由导热材料制成的基座10。 LED元件（32）布置在基座的空腔（11）中。准直反射器（70）由反射表面（24,64,66a）形成。这些反射表面（66a，66b，64）中的三个设置在容纳在空腔（11）中的塑料插入件（60）上。另一反射表面（24）设置在基座（10）上。该表面（24）具有直线边界线（50）。准直反射器（70）被布置成反射来自LED（32）的光，使得由直线边界线（50）形成截止线（72）。通过这样将作为最关键的光学元件的截止元件集成到基座（10）本身中，实现了高精度。

3. 发明申请

WO2013024428A1 LED MIXING CHAMBER WITH REFLECTIVE WALLS FORMED IN SLOTS 审中-公开
标题翻译： LED混合室与反光墙组成的SLOTS
公开(公告)号：WO2013024428A1
公开(公告)日：2013-02-21
申请号：PCT/IB2012/054128
申请日：2012-08-14
申请人： KONINKLIJKE PHILIPS ELECTRONICS N.V. , DE SAMBER, Marc Andre
发明人： DE SAMBER, Marc Andre
IPC分类号： H01L25/075 , H01L33/60 , H01L33/50
CPC分类号： H01L33/502 , H01L25/0753 , H01L33/06 , H01L33/32 , H01L33/50 , H01L33/507 , H01L33/52 , H01L33/56 , H01L33/60 , H01L2224/16 , H01L2933/0033 , H01L2933/0041 , H01L2933/005 , H01L2933/0058
摘要： A relatively large substrate has a reflective surface, such as a diffusive white surface. LED dies, either as bare LED dies or packaged LED dies, are mounted to the substrate to form separate arrays of LEDs. Each array is intended for a separate mixing chamber. A layer of an encapsulant, such as silicone, is deposited over the substrate to encapsulate the LED dies. A laser etches through the encapsulant to form slots, and a reflective material, such as a white paint, is deposited in the slots to form reflective walls of each mixing chamber. If desired, a phosphor layer is deposited over the encapsulant and reflective walls. The substrate is then singulated to separate out the mixing chambers. Since no discrete parts are assembled, and multiple mixing chambers are formed simultaneously, the resulting mixing chambers are inexpensive and very reliable.
摘要翻译：相对较大的衬底具有反射表面，例如漫射的白色表面。无论是裸LED还是封装的LED芯片，LED芯片都安装到基板上以形成独立的LED阵列。每个阵列用于单独的混合室。将诸如硅树脂的密封剂层沉积在衬底上以封装LED管芯。激光器通过密封剂蚀刻以形成槽，并且诸如白色涂料的反射材料沉积在槽中以形成每个混合室的反射壁。如果需要，在密封剂和反射壁上沉积磷光体层。然后将衬底分离以分离出混合室。由于没有组装分立的部件，并且同时形成多个混合室，所以产生的混合室便宜并且非常可靠。

4. 发明申请

WO2012161580A1 SOLAR PANEL MODULE AND METHOD FOR MANUFACTURING SUCH A SOLAR PANEL MODULE 审中-公开
标题翻译：太阳能面板模块和制造太阳能面板模块的方法
公开(公告)号：WO2012161580A1
公开(公告)日：2012-11-29
申请号：PCT/NL2012/050366
申请日：2012-05-24
申请人： SUNERGY INVESTO B.V. , KUNTZEL, Jan Hendrik Willem , DE SAMBER, Marc Andre , SENS, Martinus Maria
发明人： KUNTZEL, Jan Hendrik Willem , DE SAMBER, Marc Andre , SENS, Martinus Maria
IPC分类号： H01L31/0224 , H01L31/042 , H01L31/05
CPC分类号： H01L31/02245 , H01L31/0516 , Y02E10/50
摘要： A solar panel module includes a plurality of solar cells (1) that have a light receiving front surface (2a) and a rear surface (2b) with contacts (5) of first polarity and counter contacts (6) of a second opposite polarity arranged on the rear surface. The contacts include a first metal as conductor, the counter contacts include a second metal as conductor. The solar cells are arranged in an array adjacent to each other on a transparent superstrate (7). In each solar cell the contacts and counter contacts are connected to first (10) and second (11) metallic contacting tabs respectively. The first and second contacting tabs are arranged in an electrical output network. A connection between the contact and the first contacting tab or the counter contact and the second contacting tab is embodied as a weld where the metal of the contact or counter contact has a metallic interface with the metal of the respective contacting tab.
摘要翻译：太阳能电池板模块包括多个具有光接收前表面（2a）的太阳能电池（1）和具有第一极性触点（5）和具有相反极性的反向触点（6）的后表面（2b）在后表面。触点包括作为导体的第一金属，反接触包括作为导体的第二金属。太阳能电池被布置在彼此相邻的阵列的透明衬底（7）上。在每个太阳能电池中，触点和反接头分别连接到第一（10）和第二（11）金属接触片。第一和第二接触片布置在电输出网络中。接触件和第一接触片或反接触件和第二接触片之间的连接被实施为焊接，其中接触件或反接触件的金属具有与相应接触片的金属的金属界面。

5. 发明申请

WO2007054859A3 MINIATURE OPTICAL COMPONENT 审中-公开
公开(公告)号：WO2007054859A3
公开(公告)日：2007-05-18
申请号：PCT/IB2006/054065
申请日：2006-11-02
申请人： PHILIPS INTELLECTUAL PROPERTY & STANDARDS GMBH , KONINKLIJKE PHILIPS ELECTRONICS N. V. , LUETTGENS, Gunnar , VAN OS, Koen , DE SAMBER, Marc, Andre
发明人： LUETTGENS, Gunnar , VAN OS, Koen , DE SAMBER, Marc, Andre
IPC分类号： F21K7/00 , G02B5/00 , H01L25/075 , H01L33/00
摘要： The invention relates to a miniature optical component (31) comprising at least one optically active surface and having at least one base surface area on which at least one soldering surface is arranged via which the miniature optical component (31) can be positioned in a defined manner by at least one corresponding soldering surface on a carrier (1) with the use of a solder, wherein the miniature optical component (31) can also be arranged at a defined distance from a solid-state light source (2). The dimensions of the mutually corresponding soldering surfaces and the solder quantity are attuned to one another such that the defined positioning of the miniature optical components (31) on the carrier (1) can be realized by the liquid or liquefied and subsequently solidified solder, and at least one reference element (12) is arranged for the defined distancing of the miniature optical components (31) from the solid-state light source (2).

6. 发明申请

WO2007057818A3 LIGHTING DEVICE AND METHOD FOR DIRECTING LIGHT 审中-公开
标题翻译：照明设备和方向指示灯
公开(公告)号：WO2007057818A3
公开(公告)日：2008-01-03
申请号：PCT/IB2006054175
申请日：2006-11-09
申请人： PHILIPS INTELLECTUAL PROPERTY , KONINKL PHILIPS ELECTRONICS NV , PETERS RALPH-HUBERT , DE SAMBER MARC ANDRE , VAN OS KOEN , SWEEGERS NORBERTUS ANTONIUS MA , LENDERINK EGBERT , VAN HEESWIJK JOHANNES ANTONIUS , KOHL JOHANN-JOSEF
发明人： PETERS RALPH-HUBERT , DE SAMBER MARC ANDRE , VAN OS KOEN , SWEEGERS NORBERTUS ANTONIUS MA , LENDERINK EGBERT , VAN HEESWIJK JOHANNES ANTONIUS , KOHL JOHANN-JOSEF
IPC分类号： F21S8/12 , F21V7/00 , F21V29/00 , F21Y101/02
CPC分类号： F21S41/43 , F21S41/143 , F21S41/147 , F21S41/19 , F21Y2115/10
摘要： An LED module is described with a base 10 made out of a heat conducting material. An LED element (32) is arranged in a cavity (11) of the base. A collimator reflector (70) is formed by reflective surfaces (24, 64, 66a). Three of these reflective surfaces (66a, 66b, 64) are provided on a plastic insert (60) received in the cavity (11). A further reflective surface (24) is provided on the base (10) itself. This surface (24) has a straight border line (50). The collimator reflector (70) is arranged to reflect light from the LED (32) so that a cut-off (72) is formed by the straight border line (50). By thus integrating the cut-off, as the most critical optical element, into the base (10) itself, high accuracy is achieved.
摘要翻译： LED模块被描述为具有由导热材料制成的基座10。 LED元件（32）布置在基座的空腔（11）中。准直反射器（70）由反射表面（24,64,66a）形成。这些反射表面（66a，66b，64）中的三个设置在容纳在空腔（11）中的塑料插入件（60）上。另一反射表面（24）设置在基座（10）上。该表面（24）具有直线边界线（50）。准直反射器（70）被布置成反射来自LED（32）的光，使得由直线边界线（50）形成截止线（72）。通过这样将作为最关键的光学元件的截止元件集成到基座（10）本身中，实现了高精度。

7. 发明申请

WO2011033433A1 LIGHT-SOURCE MODULE AND LIGHT-EMITTING DEVICE 审中-公开
标题翻译：光源模块和发光器件
公开(公告)号：WO2011033433A1
公开(公告)日：2011-03-24
申请号：PCT/IB2010/054093
申请日：2010-09-10
申请人： KONINKLIJKE PHILIPS ELECTRONICS N.V. , KURT, Ralph , SLOB, Cornelis , DE SAMBER, Marc, Andre , TER LAAK, Michael, Johan, Ferdinand, Marie , KUMS, Gerard , LENDERINK, Egbert , VAN DER LUBBE, Marcellus, Jacobus, Johannes , SIPKES, Mark, Eduard, Johan
发明人： KURT, Ralph , SLOB, Cornelis , DE SAMBER, Marc, Andre , TER LAAK, Michael, Johan, Ferdinand, Marie , KUMS, Gerard , LENDERINK, Egbert , VAN DER LUBBE, Marcellus, Jacobus, Johannes , SIPKES, Mark, Eduard, Johan
IPC分类号： H05K1/02 , H05B33/08 , F21S2/00 , H01L25/075 , G02F1/13357 , H01L33/36 , H01L33/64
CPC分类号： H05K1/181 , F21S2/005 , F21V23/06 , F21Y2113/13 , F21Y2115/10 , G02F1/133603 , G02F2001/133612 , H01L25/0753 , H01L2224/48091 , H01L2224/48227 , H05B33/0824 , H05K1/117 , H05K2201/09709 , H05K2201/10106 , H05K2201/10969 , H05K2203/049 , Y02P70/611 , H01L2924/00014
摘要： A light-emitting module (3a-c; 23; 26; 33a-c) comprising a plurality of light- sources (12a-e; 27a-h) arranged in at least a first and a second column (18a-b; 28a-c) arranged side by side and extending along a first direction of extension (X 1 ) of the light- emitting module (3a-c; 23; 26; 33a-c); and a plurality of connector terminal pairs (13a-b, 14a-b, 15a-b, 16a-b 17a-b), each being electrically connected to a corresponding one of the light-sources (3a-c; 23; 26; 33a-c) for enabling supply of electrical power thereto. Each connector terminal pair (13a-b, 14a-b, 15a-b, 16a-b 17a-b) comprises a first connector terminal (13a, 14a, 15a, 16a 17a) and a second connector terminal (13b, 14b, 15b, 16b 17b) being arranged at opposite sides of the light-emitting module (3a-c; 23; 26; 33a-c). The light- sources (12a-e; 27a-h) are arranged in a predetermined light-source sequence along the first direction of extension (X 1 ) of the light-emitting module (3a-c; 23; 26; 33a-c), and the connector terminal pairs (13a-b, 14a-b, 15a-b, 16a-b 17a-b) being electrically connected to the corresponding light-sources (12a-e; 27a-h) are arranged in the predetermined light-source sequence along the first direction of extension (X 1 ) of the light-emitting module.
摘要翻译：包括布置在至少第一和第二列（18a-b; 28a）中的多个光源（12a-e; 27a-h）的发光模块（3a-c; 23; 26; 33a-c） -c）并排布置并沿着所述发光模块（3a-c; 23; 26; 33a-c）的第一延伸方向（X1）延伸; 以及多个连接器端子对（13a-b，14a-b，15a-b，16a-b 17a-b），每个连接器端子对电连接到相应的一个光源（3a-c; 23; 26; 33a-c），用于使其能够供电。每个连接器端子对（13a-b，14a-b，15a-b，16a-b 17a-b）包括第一连接器端子（13a，14a，15a，16a 17a）和第二连接器端子（13b，14b，15b ，16b 17b）布置在发光模块（3a-c; 23; 26; 33a-c）的相对侧。光源（12a-e; 27a-h）沿着发光模块（3a-c; 23; 26; 33a-c）的第一延伸方向（X1）以预定的光源顺序排列，，并且电连接到对应的光源（12a-e; 27a-h）的连接器端子对（13a-b，14a-b，15a-b，16a-b 17a-b）被布置在预定的光沿着发光模块的第一延伸方向（X1）的源序列。

8. 发明申请

WO2007144809A1 LIGHTING DEVICE 审中-公开
标题翻译：照明设备
公开(公告)号：WO2007144809A1
公开(公告)日：2007-12-21
申请号：PCT/IB2007/052132
申请日：2007-06-06
申请人： PHILIPS INTELLECTUAL PROPERTY & STANDARDS GMBH , KONINKLIJKE PHILIPS ELECTRONICS N. V. , DE SAMBER, Marc, Andre , PETERS, Ralph, Hubert , SORMANI, Joseph, Ludovicus, Antonius, Maria
发明人： DE SAMBER, Marc, Andre , PETERS, Ralph, Hubert , SORMANI, Joseph, Ludovicus, Antonius, Maria
IPC分类号： H01L33/00
CPC分类号： H01L33/507 , H01L33/60
摘要： The invention relates to a lighting device (101) comprising a blue light source, e.g. an LED (102), combined with a wavelength converting ceramic (106) and a collimating optical component (110). The ceramic (106) is mechanically carried by the optical component (110), for example by a glue or by insert moulding. Intermediate gaps between the light source (102) and the converter (106) are preferably filled with a material like silicone.
摘要翻译：本发明涉及一种包括蓝光源的照明装置（101），例如，与波长转换陶瓷（106）和准直光学部件（110）组合的LED（102）。陶瓷（106）由光学部件（110）机械承载，例如通过胶水或通过嵌入成型。光源（102）和转换器（106）之间的中间间隙优选地填充有硅酮材料。

9. 发明申请

WO2007054859A2 MINIATURE OPTICAL COMPONENT 审中-公开
标题翻译：微型光学元件
公开(公告)号：WO2007054859A2
公开(公告)日：2007-05-18
申请号：PCT/IB2006054065
申请日：2006-11-02
申请人： PHILIPS INTELLECTUAL PROPERTY , KONINKL PHILIPS ELECTRONICS NV , LUETTGENS GUNNAR , VAN OS KOEN , DE SAMBER MARC ANDRE
发明人： LUETTGENS GUNNAR , VAN OS KOEN , DE SAMBER MARC ANDRE
IPC分类号： H01L33/60
CPC分类号： H01L33/60 , H01L2224/16225 , H01L2924/181 , H01L2924/00012
摘要： The invention relates to a miniature optical component (31) comprising at least one optically active surface and having at least one base surface area on which at least one soldering surface is arranged via which the miniature optical component (31) can be positioned in a defined manner by at least one corresponding soldering surface on a carrier (1) with the use of a solder, wherein the miniature optical component (31) can also be arranged at a defined distance from a solid-state light source (2). The dimensions of the mutually corresponding soldering surfaces and the solder quantity are attuned to one another such that the defined positioning of the miniature optical components (31) on the carrier (1) can be realized by the liquid or liquefied and subsequently solidified solder, and at least one reference element (12) is arranged for the defined distancing of the miniature optical components (31) from the solid-state light source (2).
摘要翻译：本发明涉及一种包括至少一个光学活性表面并且具有至少一个基面表面区域的微型光学组件（31），在该至少一个基面表面区域上布置有至少一个焊接表面，通过该至少一个焊接表面，微型光学部件（31）可以被定位在限定的通过使用焊料在载体（1）上的至少一个对应的焊接表面的方式，其中所述微型光学部件（31）也可以被布置在与固态光源（2）限定的距离处。相互对应的焊接表面和焊料量的尺寸彼此相适应，使得微型光学部件（31）在载体（1）上的限定的定位可以通过液体或液化的和随后的固化的焊料实现，以及至少一个参考元件（12）被布置用于将微型光学部件（31）与固态光源（2）的限定距离。

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